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* * * * * * * * * * PIC16C52 PIC16C54s PIC16CR54s PIC16C55s PIC16C56s PIC16CR56s PIC16C57s PIC16CR57s PIC16C58s PIC16CR58s Note:
PIC16C5X
* * * * * 12-bit wide instructions 8-bit wide data path Seven or eight special function hardware registers Two-level deep hardware stack Direct, indirect and relative addressing modes for data and instructions
EPROM/ROM-Based 8-Bit CMOS Microcontroller Series
Devices Included in this Data Sheet:
Peripheral Features:
* 8-bit real time clock/counter (TMR0) with 8-bit programmable prescaler * Power-On Reset (POR) * Device Reset Timer (DRT) * Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation * Programmable code-protection * Power saving SLEEP mode * Selectable oscillator options: - RC: Low-cost RC oscillator - XT: Standard crystal/resonator - HS: High-speed crystal/resonator - LP: Power saving, low-frequency crystal
The letter "s" used following the part numbers throughout this document indicate plural, meaning there is more than one part variety for the indicated device.
High-Performance RISC CPU:
* Only 33 single word instructions to learn * All instructions are single cycle (200 ns) except for program branches which are two-cycle * Operating speed: DC - 20 MHz clock input DC - 200 ns instruction cycle Device
PIC16C52 PIC16C54 PIC16C54A PIC16C54B PIC16C54C PIC16CR54A PIC16CR54B PIC16CR54C PIC16C55 PIC16C55A PIC16C56 PIC16C56A PIC16CR56A PIC16C57 PIC16C57C PIC16CR57B PIC16CR57C PIC16C58A PIC16C58B PIC16CR58A PIC16CR58B
CMOS Technology:
* Low-power, high-speed CMOS EPROM/ROM technology * Fully static design * Wide-operating voltage and temperature range: - EPROM Commercial/Industrial 2.0V to 6.25V - ROM Commercial/Industrial 2.0V to 6.25V - EPROM Extended 2.5V to 6.0V - ROM Extended 2.5V to 6.0V * Low-power consumption - < 2 mA typical @ 5V, 4 MHz - 15 A typical @ 3V, 32 kHz - < 0.6 A typical standby current (with WDT disabled) @ 3V, 0C to 70C Note: In this document, figure and table titles refer to all varieties of the part number indicated, (i.e., The title "Figure 14-1: Load Conditions - PIC16C54A", also refers to PIC16LC54A and PIC16LV54A parts).
Pins
18 18 18 18 18 18 18 18 28 28 18 18 18 28 28 28 28 18 18 18 18
I/O
12 12 12 12 12 12 12 12 20 20 12 12 12 20 20 20 20 12 12 12 12
EPROM/ RAM ROM
384 512 512 512 512 512 512 512 512 512 1K 1K 1K 2K 2K 2K 2K 2K 2K 2K 2K 25 25 25 25 25 25 25 25 24 24 25 25 25 72 72 72 72 73 73 73 73
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 1
PIC16C5X
Pin Diagrams
PDIP, SOIC, Windowed CERDIP
RA2 RA3 T0CKI MCLR/VPP VSS RB0 RB1 RB2 RB3 *1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 RA1 RA0 OSC1/CLKIN OSC2/CLKOUT VDD RB7 RB6 RB5 RB4
PDIP, SOIC, Windowed CERDIP
T0CKI VDD N/C VSS N/C RA0 RA1 RA2 RA3 RB0 RB1 RB2 RB3 RB4 *1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 MCLR/VPP OSC1/CLKIN OSC2/CLKOUT RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 RB7 RB6 RB5
PIC16C52s PIC16C54s PIC16CR54s PIC16C56s PIC16CR56s PIC16C58s PIC16CR58s
PIC16C55s PIC16C57s PIC16CR57s
SSOP
RA2 RA3 T0CKI MCLR/VPP VSS VSS RB0 RB1 RB2 RB3 *1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 RA1 RA0 OSC1/CLKIN OSC2/CLKOUT VDD VDD RB7 RB6 RB5 RB4
SSOP
VSS T0CKI VDD VDD RA0 RA1 RA2 RA3 RB0 RB1 RB2 RB3 RB4 VSS *1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 MCLR/VPP OSC1/CLKIN OSC2/CLKOUT RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 RB7 RB6 RB5
PIC16C54s PIC16CR54s PIC16C56s PIC16CR56s PIC16C58s PIC16CR58s
PIC16C55s PIC16C57s PIC16CR57s
DS30453B-page 2
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
Device Differences
Device PIC16C52 PIC16C54 PIC16C54A PIC16C54B PIC16C54C PIC16C55 PIC16C55A PIC16C56 PIC16C56A PIC16C57 PIC16C57C PIC16C58A PIC16C58B PIC16CR54A PIC16CR54B PIC16CR54C PIC16CR56A PIC16CR57B PIC16CR57C PIC16CR58A PIC16CR58B Voltage Range 3.0-6.25 2.5-6.25 2.0-6.25 2.5-5.5 2.5-5.5 2.5-6.25 2.5-5.5 2.5-6.25 2.5-5.5 2.5-6.25 2.5-5.5 2.0-6.25 2.5-5.5 2.5-6.25 2.5-5.5 2.5-5.5 2.5-5.5 2.5-6.25 2.5-5.5 2.5-6.25 2.5-5.5 Oscillator Selection (Program) User Factory User User User Factory User Factory User Factory User User User Factory Factory Factory Factory Factory Factory Factory Factory Oscillator See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 Process Technology (Microns) 0.9 1.2 0.9 0.7 0.7 1.7 0.7 1.7 0.7 1.2 0.7 0.9 0.7 1.2 0.7 0.7 0.7 0.9 0.7 0.9 0.7 ROM Equivalent -- PIC16CR54A -- PIC16CR54B PIC16CR54C -- -- -- PIC16CR56A -- PIC16CR57C PIC16CR58A PIC16CR58B N/A N/A N/A N/A N/A N/A N/A N/A MCLR Filter No No No Yes Yes No Yes No Yes No Yes No(2) Yes Yes Yes Yes Yes Yes Yes Yes Yes
Note 1: If you change from this device to another device, please verify oscillator characteristics in your application. Note 2: In PIC16LV58A, MCLR Filter = Yes
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 3
PIC16C5X
Table of Contents 1.0 General Description .............................................................................................................................................5 2.0 PIC16C5X Device Varieties.................................................................................................................................7 3.0 Architectural Overview.........................................................................................................................................9 4.0 Memory Organization ........................................................................................................................................15 5.0 I/O Ports.............................................................................................................................................................25 6.0 Timer0 Module and TMR0 Register...................................................................................................................27 7.0 Special Features of the CPU .............................................................................................................................31 8.0 Instruction Set Summary ...................................................................................................................................43 9.0 Development Support ........................................................................................................................................55 10.0 Electrical Characteristics - PIC16C52................................................................................................................59 11.0 Electrical Characteristics - PIC16C54/55/56/57.................................................................................................67 12.0 DC and AC Characteristics - PIC16C54/55/56/57 .............................................................................................81 13.0 Electrical Characteristics - PIC16CR54A...........................................................................................................89 14.0 Electrical Characteristics - PIC16C54A ...........................................................................................................103 15.0 Electrical Characteristics - PIC16CR57B.........................................................................................................117 16.0 Electrical Characteristics - PIC16C58A ...........................................................................................................131 17.0 Electrical Characteristics - PIC16CR58A.........................................................................................................145 18.0 DC and AC Characteristics - PIC16C54A/CR57B/C58A/CR58A ....................................................................159 19.0 Electrical Characteristics PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B ....................................171 20.0 DC and AC Characteristics PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B ....................................183 21.0 Packaging Information .....................................................................................................................................195 Appendix A: Compatibility ...........................................................................................................................................207 Index .........................................................................................................................................................................209 On-Line Support ..........................................................................................................................................................211 PIC16C5X Product Identification System....................................................................................................................213 PIC16C54/55/56/57 Product Identification System .....................................................................................................214
To Our Valued Customers
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please check our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number. e.g., DS30000A is version A of document DS30000.
Errata
An errata sheet may exist for current devices, describing minor operational differences (from the data sheet) and recommended workarounds. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) * The Microchip Corporate Literature Center; U.S. FAX: (602) 786-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using.
Corrections to this Data Sheet
We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time to ensure that this document is correct. However, we realize that we may have missed a few things. If you find any information that is missing or appears in error, please: * Fill out and mail in the reader response form in the back of this data sheet. * E-mail us at webmaster@microchip.com. We appreciate your assistance in making this a better document.
DS30453B-page 4
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
1.0 GENERAL DESCRIPTION
1.1 Applications
The PIC16C5X from Microchip Technology is a family of low-cost, high performance, 8-bit, fully static, EPROM/ ROM-based CMOS microcontrollers. It employs a RISC architecture with only 33 single word/single cycle instructions. All instructions are single cycle (200 ns) except for program branches which take two cycles. The PIC16C5X delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit wide instructions are highly symmetrical resulting in 2:1 code compression over other 8-bit microcontrollers in its class. The easy to use and easy to remember instruction set reduces development time significantly. The PIC16C5X products are equipped with special features that reduce system cost and power requirements. The Power-On Reset (POR) and Device Reset Timer (DRT) eliminate the need for external reset circuitry. There are four oscillator configurations to choose from, including the power-saving LP (Low Power) oscillator and cost saving RC oscillator. Power saving SLEEP mode, Watchdog Timer and code protection features improve system cost, power and reliability. The UV erasable CERDIP packaged versions are ideal for code development, while the cost-effective One Time Programmable (OTP) versions are suitable for production in any volume. The customer can take full advantage of Microchip's price leadership in OTP microcontrollers while benefiting from the OTP's flexibility. The PIC16C5X products are supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a `C' compiler, fuzzy logic support tools, a low-cost development programmer, and a full featured programmer. All the tools are supported on IBM(R) PC and compatible machines. The PIC16C5X series fits perfectly in applications ranging from high-speed automotive and appliance motor control to low-power remote transmitters/receivers, pointing devices and telecom processors. The EPROM technology makes customizing application programs (transmitter codes, motor speeds, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make this microcontroller series perfect for applications with space limitations. Low-cost, low-power, high performance, ease of use and I/O flexibility make the PIC16C5X series very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, replacement of "glue" logic in larger systems, coprocessor applications).
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 5
PIC16C5X
TABLE 1-1: PIC16C5X FAMILY OF DEVICES
PIC16C52 Clock Maximum Frequency of Operation (MHz) EPROM Program Memory (x12 words) Memory ROM Program Memory (x12 words) RAM Data Memory (bytes) Peripherals Timer Module(s) I/O Pins Number of Instructions Features Packages 4 384 -- 25 TMR0 12 33 18-pin DIP, SOIC PIC16C54s 20 512 -- 25 TMR0 12 33 18-pin DIP, SOIC; 20-pin SSOP PIC16CR54s 20 -- 512 25 TMR0 12 33 18-pin DIP, SOIC; 20-pin SSOP PIC16C55s 20 512 -- 24 TMR0 20 33 28-pin DIP, SOIC; 28-pin SSOP PIC16C56s 20 1K -- 25 TMR0 12 33 18-pin DIP, SOIC; 20-pin SSOP
All PICmicroTM Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code protect and high I/O current capability.
PIC16CR56s Clock Maximum Frequency of Operation (MHz) EPROM Program Memory (x12 words) Memory ROM Program Memory (x12 words) RAM Data Memory (bytes) Peripherals Timer Module(s) I/O Pins Number of Instructions Features Packages 20 -- 1K 25 TMR0 12 33 18-pin DIP, SOIC; 20-pin SSOP
PIC16C57s 20 2K -- 72 TMR0 20 33 28-pin DIP, SOIC; 28-pin SSOP
PIC16CR57s 20 -- 2K 72 TMR0 20 33 28-pin DIP, SOIC; 28-pin SSOP
PIC16C58s 20 2K -- 73 TMR0 12 33 18-pin DIP, SOIC; 20-pin SSOP
PIC16CR58s 20 -- 2K 73 TMR0 12 33 18-pin DIP, SOIC; 20-pin SSOP
All PICmicroTM Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code protect and high I/O current capability.
DS30453B-page 6
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
2.0 PIC16C5X DEVICE VARIETIES
2.3
A variety of frequency ranges and packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC16C5X Product Identification System at the back of this data sheet to specify the correct part number. For the PIC16C5X family of devices, there are four device types, as indicated in the device number: 1. C, as in PIC16C54. These devices have EPROM program memory and operate over the standard voltage range. LC, as in PIC16LC54A. These devices have EPROM program memory and operate over an extended voltage range. LV, as in PIC16LV54A. These devices have EPROM program memory and operate over a 2.0V to 3.8V range. CR, as in PIC16CR54A. These devices have ROM program memory and operate over the standard voltage range. LCR, as in PIC16LCR54B. These devices have ROM program memory and operate over an extended voltage range.
Quick-Turnaround-Production (QTP) Devices
Microchip offers a QTP Programming Service for factory production orders. This service is made available for users who choose not to program a medium to high quantity of units and whose code patterns have stabilized. The devices are identical to the OTP devices but with all EPROM locations and configuration bit options already programmed by the factory. Certain code and prototype verification procedures apply before production shipments are available. Please contact your Microchip Technology sales office for more details.
2.
2.4
Serialized Quick-Turnaround-Production (SQTP SM) Devices
3.
4.
5.
Microchip offers the unique programming service where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. The devices are identical to the OTP devices but with all EPROM locations and configuration bit options already programmed by the factory. Serial programming allows each device to have a unique number which can serve as an entry code, password or ID number.
2.1
UV Erasable Devices (EPROM)
The UV erasable versions, offered in CERDIP packages, are optimal for prototype development and pilot programs UV erasable devices can be programmed for any of the four oscillator configurations. Microchip's PICSTART(R) and PRO MATE(R) programmers both support programming of the PIC16C5X. Third party programmers also are available; refer to the Third Party Guide for a list of sources.
2.5
Read Only Memory (ROM) Devices
Microchip offers masked ROM versions of several of the highest volume parts, giving the customer a low cost option for high volume, mature products.
2.2
One-Time-Programmable (OTP) Devices
The availability of OTP devices is especially useful for customers expecting frequent code changes and updates. The OTP devices, packaged in plastic packages, permit the user to program them once. In addition to the program memory, the configuration bits must be programmed.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 7
PIC16C5X
NOTES:
DS30453B-page 8
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
3.0 ARCHITECTURAL OVERVIEW
The high performance of the PIC16C5X family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC16C5X uses a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architecture where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12-bits wide making it possible to have all single word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (200ns @ 20MHz) except for program branches. The PIC16C52 addresses 384 x 12 of program memory, the PIC16C54s/CR54s and PIC16C55s address 512 x 12 of program memory, the PIC16C56s/CR56s address 1K X 12 of program memory, and the PIC16C57s/CR57s and PIC16C58s/CR58s address 2K x 12 of program memory. All program memory is internal. The PIC16C5X can directly or indirectly address its register files and data memory. All special function registers including the program counter are mapped in the data memory. The PIC16C5X has a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation on any register using any addressing mode. This symmetrical nature and lack of `special optimal situations' make programming with the PIC16C5X simple yet efficient. In addition, the learning curve is reduced significantly. The PIC16C5X device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplified block diagram is shown in Figure 3-1, with the corresponding device pins described in Table 3-1.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 9
PIC16C5X
FIGURE 3-1: PIC16C5X SERIES BLOCK DIAGRAM
9-11 EPROM/ROM 384 X 12 TO 2048 X 12 12 INSTRUCTION REGISTER 9 12 8 INSTRUCTION DECODER DIRECT ADDRESS DIRECT RAM ADDRESS 6 OPTION REG. FROM W 5 8 LITERALS STATUS TMR0 DATA BUS ALU FROM W 4 "TRIS 5" TRISA PORTA 4 RA3:RA0 4 "TRIS 6" 8 FROM W 8 TRISB 8 PORTB "TRIS 7" FROM W 8 TRISC 8 FSR 8 W 5-7 "OPTION" GENERAL PURPOSE REGISTER FILE (SRAM) 24, 25, 72 or 73 Bytes WDT TIME OUT WDT/TMR0 PRESCALER CLKOUT 9-11 PC WATCHDOG TIMER "CODE PROTECT" STACK 1 STACK 2 T0CKI PIN OSC1 OSC2 MCLR
CONFIGURATION WORD "DISABLE"
"OSC SELECT" 2 OSCILLATOR/ TIMING & CONTROL
"SLEEP"
PORTC 8 RC7:RC0 (28-Pin Devices Only)
8 RB7:RB0
DS30453B-page 10
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
TABLE 3-1: PINOUT DESCRIPTION - PIC16C52, PIC16C54s, PIC16CR54s, PIC16C56s, PIC16CR56s, PIC16C58s, PIC16CR58s
DIP, SOIC SSOP I/O/P Input No. No. Type Levels 17 18 1 2 6 7 8 9 10 11 12 13 3 4 19 20 1 2 7 8 9 10 11 12 13 14 3 4 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL ST ST Bi-directional I/O port Description
Name RA0 RA1 RA2 RA3 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RB7 T0CKI MCLR/VPP
Bi-directional I/O port
OSC1/CLKIN OSC2/CLKOUT
16 15
18 17
I O
ST --
VDD 14 15,16 P -- VSS 5 5,6 P -- Legend: I = input, O = output, I/O = input/output, P = power, -- = Not Used, TTL = TTL input, ST = Schmitt Trigger input
Clock input to Timer0. Must be tied to VSS or VDD, if not in use, to reduce current consumption. Master clear (reset) input/programming voltage input. This pin is an active low reset to the device. Voltage on the MCLR/VPP pin must not exceed VDD to avoid unintended entering of programming mode. Oscillator crystal input/external clock source input. Oscillator crystal output. Connects to crystal or resonator in crystal oscillator mode. In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate. Positive supply for logic and I/O pins. Ground reference for logic and I/O pins.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 11
PIC16C5X
TABLE 3-2:
Name RA0 RA1 RA2 RA3 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RB7 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RC7 T0CKI MCLR OSC1/CLKIN OSC2/CLKOUT
PINOUT DESCRIPTION
- PIC16C55s, PIC16C57s, PIC16CR57s
Description Bi-directional I/O port
DIP, SOIC SSOP I/O/P Input No. No. Type Levels 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 28 27 26 5 6 7 8 9 10 11 12 13 15 16 17 18 19 20 21 22 23 24 25 2 28 27 26 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I I O TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL ST ST ST --
Bi-directional I/O port
Bi-directional I/O port
VDD 2 3,4 P -- VSS 4 1,14 P -- N/C 3,5 -- -- -- Legend: I = input, O = output, I/O = input/output, P = power, -- = Not Used, TTL = TTL input, ST = Schmitt Trigger input
Clock input to Timer0. Must be tied to VSS or VDD if not in use to reduce current consumption. Master clear (reset) input. This pin is an active low reset to the device. Oscillator crystal input/external clock source input. Oscillator crystal output. Connects to crystal or resonator in crystal oscillator mode. In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate. Positive supply for logic and I/O pins. Ground reference for logic and I/O pins. Unused, do not connect
DS30453B-page 12
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining
The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks namely Q1, Q2, Q3 and Q4. Internally, the program counter is incremented every Q1, and the instruction is fetched from program memory and latched into instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2 and Example 3-1. An Instruction Cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO) then two cycles are required to complete the instruction (Example 3-1). A fetch cycle begins with the program counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3, and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write).
FIGURE 3-2:
CLOCK/INSTRUCTION CYCLE
Q1 OSC1 Q1 Q2 Q3 Q4 PC
PC PC+1 PC+2 Internal phase clock
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
OSC2/CLKOUT (RC mode)
Fetch INST (PC) Execute INST (PC-1)
Fetch INST (PC+1) Execute INST (PC)
Fetch INST (PC+2) Execute INST (PC+1)
EXAMPLE 3-1:
1. MOVLW 55H 2. MOVWF PORTB 3. CALL 4. BSF SUB_1
INSTRUCTION PIPELINE FLOW
Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1
PORTA, BIT3
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is "flushed" from the pipeline while the new instruction is being fetched and then executed.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 13
PIC16C5X
NOTES:
DS30453B-page 14
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
4.0 MEMORY ORGANIZATION
FIGURE 4-2:
PIC16C5X memory is organized into program memory and data memory. For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one or two STATUS register bits. For devices with a data memory register file of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Selection Register (FSR).
PIC16C54s/CR54s/C55s PROGRAM MEMORY MAP AND STACK
PC<8:0> 9 Stack Level 1 Stack Level 2
000h
CALL, RETLW
User Memory Space
4.1
Program Memory Organization
The PIC16C52 has a 9-bit Program Counter (PC) capable of addressing a 384 x 12 program memory space (Figure 4-1). The PIC16C54s, PIC16CR54s and PIC16C55s have a 9-bit Program Counter (PC) capable of addressing a 512 x 12 program memory space (Figure 4-2). The PIC16C56s and PIC16CR56s have a 10-bit Program Counter (PC) capable of addressing a 1K x 12 program memor y space (Figure 4-3). The PIC16CR57s, PIC16C58s and PIC16CR58s have an 11-bit Program Counter capable of addressing a 2K x 12 program memory space (Figure 4-4). Accessing a location above the physically implemented address will cause a wraparound. The reset vector for the PIC16C52 is at 17Fh. A NOP at the reset vector location will cause a restart at location 000h. The reset vector for the PIC16C54s, PIC16CR54s and PIC16C55s is at 1FFh. The reset vector for the PIC16C56s and PIC16CR56s is at 3 F F h . T h e r e s e t ve c t o r fo r t h e P I C 1 6 C 5 7 s , PIC16CR57s, PIC16C58s, and PIC16CR58s is at 7FFh.
On-chip Program Memory
0FFh 100h
Reset Vector
1FFh
FIGURE 4-3:
PIC16C56s/CR56s PROGRAM MEMORY MAP AND STACK
PC<9:0> 10 Stack Level 1 Stack Level 2
000h
CALL, RETLW
User Memory Space
On-chip Program Memory (Page 0)
0FFh 100h 1FFh 200h
FIGURE 4-1:
PIC16C52 PROGRAM MEMORY MAP AND STACK
PC<8:0> 9 Stack Level 1 Stack Level 2
000h
On-chip Program Memory (Page 1) Reset Vector
2FFh 300h
3FFh
CALL, RETLW
User Memory Space
On-chip Program Memory
Reset Vector
17Fh
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 15
PIC16C5X
FIGURE 4-4: PIC16C57s/CR57s/C58s/ CR58s PROGRAM MEMORY MAP AND STACK
PC<10:0> CALL, RETLW Stack Level 1 Stack Level 2
000h
11
On-chip Program Memory (Page 0)
0FFh 100h 1FFh 200h
User Memory Space
On-chip Program Memory (Page 1)
2FFh 300h 3FFh 400h
On-chip Program Memory (Page 2)
4FFh 500h 5FFh 600h
On-chip Program Memory (Page 3) Reset Vector
6FFh 700h 7FFh
DS30453B-page 16
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
4.2 Data Memory Organization FIGURE 4-5:
Data memory is composed of registers, or bytes of RAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: special function registers and general purpose registers. The special function registers include the TMR0 register, the Program Counter (PC), the Status Register, the I/O registers (ports), and the File Select Register (FSR). In addition, special purpose registers are used to control the I/O port configuration and prescaler options. The general purpose registers are used for data and control information under command of the instructions. For the PIC16C52, PIC16C54s, PIC16CR54s, PIC16C56s and PIC16CR56s, the register file is composed of 7 special function registers and 25 general purpose registers (Figure 4-5). For the PIC16C55s, the register file is composed of 8 special function registers and 24 general purpose registers. For the PIC16C57s and PIC16CR57s, the register file is composed of 8 special function registers, 24 general purpose registers and up to 48 additional general purpose registers that may be addressed using a banking scheme (Figure 4-6). For the PIC16C58s and PIC16CR58s, the register file is composed of 7 special function registers, 25 general purpose registers and up to 48 additional general purpose registers that may be addressed using a banking scheme (Figure 4-7). 4.2.1 GENERAL PURPOSE REGISTER FILE
PIC16C52, PIC16C54s, PIC16CR54s, PIC16C55s, PIC16C56s, PIC16CR56s REGISTER FILE MAP
File Address 00h 01h 02h 03h 04h 05h 06h 07h INDF(1) TMR0 PCL STATUS FSR PORTA PORTB PORTC(2)
0Fh 10h
General Purpose Registers
1Fh
Note 1: 2: Not a physical register. See Section 4.7 PIC16C55s only, others are a general purpose register.
The register file is accessed either directly or indirectly through the file select register FSR (Section 4.7).
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 17
PIC16C5X
FIGURE 4-6: PIC16C57s/CR57s REGISTER FILE MAP
00 INDF(1) TMR0 PCL STATUS FSR PORTA PORTB PORTC General Purpose Registers 10h General Purpose Registers 1Fh Bank 0
Note 1:
FSR<6:5> File Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 0Fh
01 20h 40h
10 60h
11
Addresses map back to addresses in Bank 0.
2Fh 30h General Purpose Registers 3Fh Bank 1
4Fh 50h General Purpose Registers 5Fh Bank 2
6Fh 70h General Purpose Registers 7Fh Bank 3
Not a physical register. See Section 4.7
FIGURE 4-7:
PIC16C58s/CR58s REGISTER FILE MAP
00 INDF(1) TMR0 PCL STATUS FSR PORTA PORTB General Purpose Registers 0Fh 10h General Purpose Registers 1Fh Bank 0
Note 1:
FSR<6:5> File Address 00h 01h 02h 03h 04h 05h 06h 07h
01 20h 40h
10 60h
11
Addresses map back to addresses in Bank 0.
2Fh 30h General Purpose Registers 3Fh Bank 1
4Fh 50h General Purpose Registers 5Fh Bank 2
6Fh 70h General Purpose Registers 7Fh Bank 3
Not a physical register. See Section 4.7
DS30453B-page 18
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
4.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). The special registers can be classified into two sets. The special function registers associated with the "core" functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature.
TABLE 4-1:
SPECIAL FUNCTION REGISTER SUMMARY
Value on Power-On Reset 1111 1111 --11 1111 xxxx xxxx xxxx xxxx 1111 1111 TO PD Z DC C 0001 1xxx 1xxx xxxx RA3 RB3 RC3 RA2 RB2 RC2 RA1 RB1 RC1 RA0 RB0 RC0 ---- xxxx xxxx xxxx xxxx xxxx Value on MCLR and WDT Reset 1111 1111 --11 1111 uuuu uuuu uuuu uuuu 1111 1111 000q quuu 1uuu uuuu ---- uuuu uuuu uuuu uuuu uuuu
Address N/A N/A 00h 01h 02h 03h 04h 05h 06h 07h
(2) (1)
Name TRIS OPTION INDF TMR0 PCL STATUS FSR PORTA PORTB PORTC
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
I/O control registers (TRISA, TRISB, TRISC) Contains control bits to configure Timer0 and Timer0/WDT prescaler Uses contents of FSR to address data memory (not a physical register) 8-bit real-time clock/counter Low order 8 bits of PC PA2 PA1 PA0
Indirect data memory address pointer -- RB7 RC7 -- RB6 RC6 -- RB5 RC5 -- RB4 RC4
Legend: Shaded boxes = unimplemented or unused, - = unimplemented, read as '0' (if applicable) x = unknown, u = unchanged, q = see the tables in Section 7.7 for possible values. Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.5 for an explanation of how to access these bits. 2: File address 07h is a general purpose register on the PIC16C52, PIC16C54s, PIC16CR54s, PIC16C56s, PIC16CR56s, PIC16C58s and PIC16CR58s.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 19
PIC16C5X
4.3 STATUS Register
This register contains the arithmetic status of the ALU, the RESET status, and the page preselect bits for program memories larger than 512 words. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF and MOVWF instructions be used to alter the STATUS register because these instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions, which do affect STATUS bits, see Section 8.0, Instruction Set Summary.
FIGURE 4-8:
R/W-0 PA2 bit7 bit 7:
STATUS REGISTER (ADDRESS:03h)
R/W-0 PA0 5 R-1 TO 4 R-1 PD 3 R/W-x Z 2 R/W-x DC 1 R/W-x C bit0
R/W-0 PA1 6
R = Readable bit W = Writable bit - n = Value at POR reset
PA2: This bit unused at this time. Use of the PA2 bit as a general purpose read/write bit is not recommended, since this may affect upward compatibility with future products. PA1:PA0: Program page preselect bits (PIC16C56s/CR56s)(PIC16C57s/CR57s)(PIC16C58s/CR58s) 00 = Page 0 (000h - 1FFh) - PIC16C56s/CR56s, PIC16C57s/CR57s, PIC16C58s/CR58s 01 = Page 1 (200h - 3FFh) - PIC16C56s/CR56s, PIC16C57s/CR57s, PIC16C58s/CR58s 10 = Page 2 (400h - 5FFh) - PIC16C57s/CR57s, PIC16C58s/CR58s 11 = Page 3 (600h - 7FFh) - PIC16C57s/CR57s, PIC16C58s/CR58s Each page is 512 words. Using the PA1:PA0 bits as general purpose read/write bits in devices which do not use them for program page preselect is not recommended since this may affect upward compatibility with future products. TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF 1 = A carry from the 4th low order bit of the result occurred 0 = A carry from the 4th low order bit of the result did not occur SUBWF 1 = A borrow from the 4th low order bit of the result did not occur 0 = A borrow from the 4th low order bit of the result occurred C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF SUBWF 1 = A carry occurred 1 = A borrow did not occur 0 = A carry did not occur 0 = A borrow occurred RRF or RLF Load bit with LSb or MSb, respectively
bit 6-5:
bit 4:
bit 3:
bit 2:
bit 1:
bit 0:
DS30453B-page 20
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
4.4 OPTION Register
The OPTION register is a 6-bit wide, write-only register which contains var ious control bits to configure the Timer0/WDT prescaler and Timer0. By executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A RESET sets the OPTION<5:0> bits.
FIGURE 4-9:
U-0 -- bit7 bit 7-6: bit 5:
OPTION REGISTER
U-0 -- 6 W-1 T0CS 5 W-1 T0SE 4 W-1 PSA 3 W-1 PS2 2 W-1 PS1 1 W-1 PS0 bit0
W = Writable bit U = Unimplemented bit - n = Value at POR reset
Unimplemented. T0CS: Timer0 clock source select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) T0SE: Timer0 source edge select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin PSA: Prescaler assignment bit 1 = Prescaler assigned to the WDT (not implemented on PIC16C52) 0 = Prescaler assigned to Timer0 PS2:PS0: Prescaler rate select bits Bit Value 000 001 010 011 100 101 110 111 Timer0 Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 WDT Rate (not implemented on PIC16C52) 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128
bit 4:
bit 3:
bit 2-0:
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 21
PIC16C5X
4.5 Program Counter
As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The PC Latch (PCL) is mapped to PC<7:0> (Figure 4-10 and Figure 4-11). For the PIC16C56s, PIC16CR56s, PIC16C57s, PIC16CR57s, PIC16C58s and PIC16CR58s, a page number must be supplied as well. Bit5 and bit6 of the STATUS register provide page information to bit9 and bit10 of the PC (Figure 4-11 and Figure 4-12). For a CALL instruction, or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-10 and Figure 4-11). Instructions where the PCL is the destination, or Modify PCL instructions, include MOVWF PC, ADDWF PC, and BSF PC,5. For the PIC16C56s, PIC16CR56s, PIC16C57s, PIC16CR57s, PIC16C58s and PIC16CR58s, a page number again must be supplied. Bit5 and bit6 of the STATUS register provide page information to bit9 and bit10 of the PC (Figure 4-11 and Figure 4-12). Note: Because PC<8> is cleared in the CALL instruction, or any Modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long).
FIGURE 4-10: LOADING OF PC BRANCH INSTRUCTIONS PIC16C52, PIC16C54s, PIC16CR54s, PIC16C55s
GOTO Instruction
8 PC 7 PCL 0
Instruction Word
CALL or Modify PCL Instruction
8 PC 7 PCL 0
Reset to '0'
Instruction Word
FIGURE 4-11: LOADING OF PC BRANCH INSTRUCTIONS PIC16C56s/PIC16CR56s
GOTO Instruction
10 PC 9 87 PCL 0
Instruction Word 2 7 PA1:PA0 0
STATUS
CALL or Modify PCL Instruction
10 PC 9 87 PCL 0
Instruction Word Reset to `0' PA1:PA0 0
2 7
STATUS
DS30453B-page 22
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
FIGURE 4-12: LOADING OF PC BRANCH INSTRUCTIONS PIC16C57s/PIC16CR57s, AND PIC16C58s/PIC16CR58s
GOTO Instruction
10 PC 9 87 PCL 0
4.5.1
PAGING CONSIDERATIONS - PIC16C56s/CR56s, PIC16C57s/CR57s AND PIC16C58s/CR58s
Instruction Word 2 7 PA1:PA0 0
If the Program Counter is pointing to the last address of a selected memory page, when it increments it will cause the program to continue in the next higher page. However, the page preselect bits in the STATUS register will not be updated. Therefore, the next GOTO, CALL, or Modify PCL instruction will send the program to the page specified by the page preselect bits (PA0 or PA1:PA0). For example, a NOP at location 1FFh (page 0) increments the PC to 200h (page 1). A GOTO xxx at 200h will return the program to address 0xxh on page 0 (assuming that PA1:PA0 are clear). To prevent this, the page preselect bits must be updated under program control.
STATUS
CALL or Modify PCL Instruction
10 PC 9 87 PCL 0
4.5.2
EFFECTS OF RESET
Instruction Word Reset to `0' PA1:PA0 0
The Program Counter is set upon a RESET, which means that the PC addresses the last location in the last page i.e., the reset vector. The STATUS register page preselect bits are cleared u p o n a R E S E T, w h i c h m e a n s t h a t p a g e 0 i s pre-selected. Therefore, upon a RESET, a GOTO instruction at the reset vector location will automatically cause the program to jump to page 0.
2 7
STATUS
4.6
Stack
PIC16C5X devices have a 9-bit, 10-bit or 11-bit wide, two-level hardware push/pop stack (Figure 4-2, Figure 4-1, and Figure 4-3 respectively). A CALL instruction will push the current value of stack 1 into stack 2 and then push the current program counter value, incremented by one, into stack level 1. If more than two sequential CALL's are executed, only the most recent two return addresses are stored. A RETLW instruction will pop the contents of stack level 1 into the program counter and then copy stack level 2 contents into level 1. If more than two sequential RETLW's are executed, the stack will be filled with the address previously stored in level 2. Note that the W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. For the RETLW instruction, the PC is loaded with the Top Of Stack (TOS) contents. All of the devices covered in this data sheet have a two-level stack. The stack has the same bit width as the device PC.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 23
PIC16C5X
4.7 Indirect Data Addressing; INDF and FSR Registers EXAMPLE 4-2: HOW TO CLEAR RAM USING INDIRECT ADDRESSING
0x10 FSR INDF FSR,F FSR,4 NEXT ;initialize pointer ; to RAM ;clear INDF register ;inc pointer ;all done? ;NO, clear next ;YES, continue
The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing.
NEXT
EXAMPLE 4-1:
* * * *
INDIRECT ADDRESSING
movlw movwf clrf incf btfsc goto :
Register file 05 contains the value 10h Register file 06 contains the value 0Ah Load the value 05 into the FSR register A read of the INDF register will return the value of 10h * Increment the value of the FSR register by one (FSR = 06h) * A read of the INDR register now will return the value of 0Ah. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although STATUS bits may be affected). A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-2.
CONTINUE
The FSR is either a 5-bit (PIC16C52, PIC16C54s, PIC16CR54s, PIC16C55s), 6-bit (PIC16C56s, PIC16CR56s), or 7-bit (PIC16C57s, PIC16CR57s, PIC16C58s, PIC16CR58s) wide register. It is used in conjunction with the INDF register to indirectly address the data memory area. The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. PIC16C52, PIC16C54s, PIC16CR54s, PIC16C55s: These do not use banking. FSR<6:5> are unimplemented and read as '1's. PIC16C57s, PIC16CR57s, PIC16C58s, PIC16CR58s: FSR<6:5> are the bank select bits and are used to select the bank to be addressed (00 = bank 0, 01 = bank 1, 10 = bank 2, 11 = bank 3).
FIGURE 4-13: DIRECT/INDIRECT ADDRESSING
Direct Addressing (FSR) 65 4 (opcode) 0 6 Indirect Addressing 5 4 (FSR) 0
bank select
location select 00 00h Addresses map back to addresses in Bank 0. Data Memory(1) 0Fh 10h 01 10 11
bank
location select
1Fh Bank 0
3Fh Bank 1
5Fh Bank 2
7Fh Bank 3
Note 1: For register map detail see Section 4.2.
DS30453B-page 24
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
5.0 I/O PORTS
5.5 I/O Interfacing
As with any other register, the I/O registers can be written and read under program control. However, read instructions (e.g., MOVF PORTB,W) always read the I/O pins independent of the pin's input/output modes. On RESET, all I/O ports are defined as input (inputs are at hi-impedance) since the I/O control registers (TRISA, TRISB, TRISC) are all set. The equivalent circuit for an I/O port pin is shown in Figure 5-1. All ports may be used for both input and output operation. For input operations these ports are non-latching. Any input must be present until read by an input instruction (e.g., MOVF PORTB, W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit (in TRISA, TRISB) must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin can be programmed individually as input or output.
5.1
PORTA
PORTA is a 4-bit I/O register. Only the low order 4 bits are used (RA3:RA0). Bits 7-4 are unimplemented and read as '0's.
FIGURE 5-1:
Data Bus D WR Port
5.2
PORTB
EQUIVALENT CIRCUIT FOR A SINGLE I/O PIN
Q Data Latch VDD Q P
PORTB is an 8-bit I/O register (PORTB<7:0>).
5.3
PORTC
PORTC is an 8-bit I/O register for PIC16C55s, PIC16C57s and PIC16CR57s. PORTC is a general purpose register for PIC16C52, PIC16C54s, PIC16CR54s, PIC16C56s, PIC16C58s and PIC16CR58s.
CK
W Reg
N D TRIS Latch Q VSS Q
I/O pin(1)
5.4
TRIS Registers
TRIS `f'
The output driver control registers are loaded with the contents of the W register by executing the TRIS f instruction. A '1' from a TRIS register bit puts the corresponding output driver in a hi-impedance mode. A '0' puts the contents of the output data latch on the selected pins, enabling the output buffer. Note: A read of the ports reads the pins, not the output data latches. That is, if an output driver on a pin is enabled and driven high, but the external system is holding it low, a read of the port will indicate that the pin is low.
CK
Reset
RD Port Note 1: I/O pins have protection diodes to VDD and VSS.
The TRIS registers are "write-only" and are set (output drivers disabled) upon RESET.
TABLE 5-1:
SUMMARY OF PORT REGISTERS
Value on Power-On Reset 1111 1111 RA2 RB2 RC2 RA1 RB1 RC1 RA0 RB0 RC0 ---- xxxx xxxx xxxx xxxx xxxx Value on MCLR and WDT Reset 1111 1111 ---- uuuu uuuu uuuu uuuu uuuu
Address N/A 05h 06h 07h
Name TRIS PORTA PORTB PORTC
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
I/O control registers (TRISA, TRISB, TRISC) -- RB7 RC7 -- RB6 RC6 -- RB5 RC5 -- RB4 RC4 RA3 RB3 RC3
Legend: Shaded boxes = unimplemented, read as `0', - = unimplemented, read as '0', x = unknown, u = unchanged
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 25
PIC16C5X
5.6
5.6.1
I/O Programming Considerations
BI-DIRECTIONAL I/O PORTS
EXAMPLE 5-1:
READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT
Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and re-write the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit5 of PORTB will cause all eight bits of PORTB to be read into the CPU, bit5 to be set and the PORTB value to be written to the output latches. If another bit of PORTB is used as a bi-directional I/O pin (say bit0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the input mode, no problem occurs. However, if bit0 is switched into output mode later on, the content of the data latch may now be unknown. Example 5-1 shows the effect of two sequential read-modify-write instructions (e.g., BCF, BSF, etc.) on an I/O port. A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin ("wired-or", "wired-and"). The resulting high output currents may damage the chip.
;Initial PORT Settings ; PORTB<7:4> Inputs ; PORTB<3:0> Outputs ;PORTB<7:6> have external pull-ups and are ;not connected to other circuitry ; ; PORT latch PORT pins ; ---------- ---------BCF PORTB, 7 ;01pp pppp 11pp pppp BCF PORTB, 6 ;10pp pppp 11pp pppp MOVLW 03Fh ; TRIS PORTB ;10pp pppp 10pp pppp ; ;Note that the user may have expected the pin ;values to be 00pp pppp. The 2nd BCF caused ;RB7 to be latched as the pin value (High).
5.6.2
SUCCESSIVE OPERATIONS ON I/O PORTS
The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-2). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction, which causes that file to be read into the CPU, is executed. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port.
FIGURE 5-2:
SUCCESSIVE I/O OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC PC + 1 MOVF PORTB,W PC + 2 NOP PC + 3 NOP
Instruction fetched RB7:RB0
MOVWF PORTB
This example shows a write to PORTB followed by a read from PORTB.
Port pin written here Port pin sampled here MOVF PORTB,W (Read PORTB) NOP
Instruction executed
MOVWF PORTB (Write to PORTB)
DS30453B-page 26
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
6.0 TIMER0 MODULE AND TMR0 REGISTER
Counter mode is selected by setting the T0CS bit (OPTION<5>). In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The incrementing edge is determined by the source edge select bit T0SE (OPTION<4>). Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.1. The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit PSA (OPTION<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 6.2 details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 6-1.
The Timer0 module has the following features: * 8-bit timer/counter register, TMR0 - Readable and writable * 8-bit software programmable prescaler * Internal or external clock select - Edge select for external clock Figure 6-1 is a simplified block diagram of the Timer0 module, while Figure 6-2 shows the electrical structure of the Timer0 input. Timer mode is selected by clearing the T0CS bit (OPTION<5>). In timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two cycles (Figure 6-3 and Figure 6-4). The user can work around this by writing an adjusted value to the TMR0 register.
FIGURE 6-1:
TIMER0 BLOCK DIAGRAM
Data bus FOSC/4 0 1 1 PSout Sync with Internal Clocks 8 TMR0 reg
T0CKI pin
T0SE(1)
Programmable Prescaler(2) 3 T0CS(1) PS2, PS1, PS0(1)
0
PSout (2 cycle delay) Sync
PSA(1)
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. 2: The prescaler is shared with the Watchdog Timer (Figure 6-6).
FIGURE 6-2:
ELECTRICAL STRUCTURE OF T0CKI PIN
RIN T0CKI pin
(1)
N
(1)
Schmitt Trigger Input Buffer
VSS
VSS
Note 1: ESD protection circuits
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 27
PIC16C5X
FIGURE 6-3:
PC (Program Counter) Instruction Fetch
TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 PC MOVWF TMR0 PC+1 MOVF TMR0,W PC+2 MOVF TMR0,W PC+3 MOVF TMR0,W PC+4 MOVF TMR0,W PC+5 MOVF TMR0,W PC+6
Timer0 Instruction Executed
T0
T0+1
T0+2
NT0
NT0
NT0
NT0+1
NT0+2
Write TMR0 executed
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0 + 1
Read TMR0 reads NT0 + 2
FIGURE 6-4:
PC (Program Counter) Instruction Fetch Timer0 T0
TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 PC MOVWF TMR0 PC+1 MOVF TMR0,W PC+2 MOVF TMR0,W PC+3 MOVF TMR0,W PC+4 MOVF TMR0,W PC+5 MOVF TMR0,W PC+6
T0+1
NT0
NT0+1
T0
Instruction Execute
Write TMR0 executed
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0 + 1
TABLE 6-1:
REGISTERS ASSOCIATED WITH TIMER0
Value on Power-On Reset Value on MCLR and WDT Reset
Address 01h N/A
Name TMR0 OPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Timer0 - 8-bit real-time clock/counter -- -- T0CS T0SE PSA PS2 PS1 PS0
xxxx xxxx uuuu uuuu --11 1111 --11 1111
Legend: Shaded cells: Unimplemented bits, - = unimplemented, x = unknown, u = unchanged,
DS30453B-page 28
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
6.1 Using Timer0 with an External Clock
When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.1.1 EXTERNAL CLOCK SYNCHRONIZATION When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4TOSC (and a small RC delay of 40 ns) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of 10 ns. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. 6.1.2 TIMER0 INCREMENT DELAY
When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-5). Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device.
Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-5 shows the delay from the external clock edge to the timer incrementing.
FIGURE 6-5:
TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Small pulse misses sampling
External Clock Input or Prescaler Output (2) (1) External Clock/Prescaler Output After Sampling Increment Timer0 (Q4) Timer0 T0 T0 + 1 (3)
T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc). Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max. 2: External clock if no prescaler selected, Prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 29
PIC16C5X
6.2 Prescaler
An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer (WDT) (WDT postscaler not implemented on PIC16C52), respectively (Section 6.1.2). For simplicity, this counter is being referred to as "prescaler" throughout this data sheet. Note that the prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT, and vice-versa. The PSA and PS2:PS0 bits (OPTION<3:0>) determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a RESET, the prescaler contains all '0's. 6.2.1 SWITCHING PRESCALER ASSIGNMENT following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT.
EXAMPLE 6-1:
CHANGING PRESCALER (TIMER0WDT)
1.CLRWDT ;Clear WDT 2.CLRF TMR0 ;Clear TMR0 & Prescaler 3.MOVLW '00xx1111'b ;These 3 lines (5, 6, 7) 4.OPTION ; are required only if ; desired 5.CLRWDT ;PS<2:0> are 000 or 001 6.MOVLW '00xx1xxx'b ;Set Postscaler to 7.OPTION ; desired WDT rate
To change prescaler from the WDT to the Timer0 module, use the sequence shown in Example 6-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler.
EXAMPLE 6-2:
CLRWDT MOVLW
CHANGING PRESCALER (WDTTIMER0)
;Clear WDT and ;prescaler ;Select TMR0, new ;prescale value and ;clock source
The prescaler assignment is fully under software control (i.e., it can be changed "on the fly" during program execution). To avoid an unintended device RESET, the
'xxxx0xxx'
OPTION
FIGURE 6-6:
BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
Data Bus 0 M U X 8 1 0 T0SE T0CS PSA M U X Sync 2 Cycles TMR0 reg
TCY ( = Fosc/4)
T0CKI pin
1
0 M U X
8-bit Prescaler 8 8 - to - 1MUX PS2:PS0
Watchdog Timer
1
PSA WDT Enable bit 0 MUX 1 PSA
WDT Time-Out Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register. WDT not implemented on PIC16C52.
DS30453B-page 30
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
7.0 SPECIAL FEATURES OF THE CPU
The SLEEP mode is designed to offer a very low current power-down mode. The user can wake up from SLEEP through external reset or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options.
What sets a microcontroller apart from other processors are special circuits that deal with the needs of real-time applications. The PIC16C5X family of microcontrollers has a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These features are: Oscillator selection Reset Power-On Reset (POR) Device Reset Timer (DRT) Watchdog Timer (WDT) (not implemented on PIC16C52) * SLEEP * Code protection * ID locations (not implemented on PIC16C52) The PIC16C5X Family has a Watchdog Timer which can be shut off only through configuration bit WDTE. It runs off of its own RC oscillator for added reliability. There is an 18 ms delay provided by the Device Reset Timer (DRT), intended to keep the chip in reset until the crystal oscillator is stable. With this timer on-chip, most applications need no external reset circuitry. * * * * *
7.1
Configuration Bits
Configuration bits can be programmed to select various device configurations. Two bits are for the selection of the oscillator type and one bit is the Watchdog Timer enable bit. Nine bits are code protection bits (Figure 7-1 and Figure 7-2) for the PIC16C54, PIC16CR54, PIC16C56, PIC16CR56, PIC16C58, and PIC16CR58 devices. QTP or ROM devices have the oscillator configuration programmed at the factory and these parts are tested accordingly (see "Product Identification System" diagrams in the back of this data sheet).
FIGURE 7-1:
CONFIGURATION WORD FOR PIC16CR54A/C54B/CR54B/C54C/CR54C/C55A/C56A/CR56A/C57C/ CR57B/CR57C/C58B/CR58A/CR58B
CP 9 CP 8 CP 7 CP 6 CP 5 CP 4 CP 3 WDTE FOSC1 FOSC0 2 1 bit0 Register: Address(1): CONFIG FFFh
CP bit11
CP 10
bit 11-3: CP: Code protection bits 1 = Code protection off 0 = Code protection on bit 2: WDTE: Watchdog timer enable bit 1 = WDT enabled 0 = WDT disabled FOSC1:FOSC0: Oscillator selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator
bit 1-0:
Note 1: Refer to the PIC16C5X Programming Specification (Literature Number DS30190) to determine how to access the configuration word.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 31
PIC16C5X
FIGURE 7-2:
-- bit11 bit 3: -- 10
CONFIGURATION WORD FOR PIC16C52/C54/C54A/C55/C56/C57/C58A
-- 9 -- 8 -- 7 -- 6 -- 5 -- 4 CP 3 WDTE FOSC1 FOSC0 2 1 bit0 Register: Address(1): CONFIG FFFh
bit 11-4: Unimplemented: Read as '0' CP: Code protection bit. 1 = Code protection off 0 = Code protection on WDTE: Watchdog timer enable bit (not implemented on PIC16C52) 1 = WDT enabled 0 = WDT disabled FOSC1:FOSC0: Oscillator selection bits(2) 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator
bit 2:
bit 1-0:
Note 1: Refer to the PIC16C5X Programming Specifications (Literature Number DS30190) to determine how to access the configuration word. 2: PIC16C52 supports XT and RC oscillator only. PIC16LV54A supports XT, RC and LP oscillator only. PIC16LV58A supports XT, RC and LP oscillator only.
DS30453B-page 32
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
7.2
7.2.1
Oscillator Configurations
OSCILLATOR TYPES
FIGURE 7-4:
EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION)
OSC1 PIC16C5X
PIC16C5Xs can be operated in four different oscillator modes. The user can program two configuration bits (FOSC1:FOSC0) to select one of these four modes: * * * * LP: XT: HS: RC: Note: 7.2.2 Low Power Crystal Crystal/Resonator High Speed Crystal/Resonator Resistor/Capacitor Not all oscillator selections available for all parts. See Section 7.1. CRYSTAL OSCILLATOR / CERAMIC RESONATORS
Clock from ext. system Open
OSC2
TABLE 7-1:
CAPACITOR SELECTION FOR CERAMIC RESONATORS - PIC16C5X, PIC16CR5X
Cap. Range C1 Cap. Range C2
Osc Type XT
Resonator Freq
In XT, LP or HS modes, a crystal or ceramic resonator is connected to the OSC1/CLKIN and OSC2/CLKOUT pins to establish oscillation (Figure 7-3). The PIC16C5X oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source drive the OSC1/CLKIN pin (Figure 7-4).
HS
Note:
FIGURE 7-3:
CRYSTAL OPERATION (OR CERAMIC RESONATOR) (HS, XT OR LP OSC CONFIGURATION)
OSC1
455 kHz 22-100 pF 22-100 pF 2.0 MHz 15-68 pF 15-68 pF 4.0 MHz 15-68 pF 15-68 pF 4.0 MHz 15-68 pF 15-68 pF 8.0 MHz 10-68 pF 10-68 pF 16.0 MHz 10-22 pF 10-22 pF These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components.
TABLE 7-2:
CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR - PIC16C5X, PIC16CR5X
Cap.Range C1 Cap. Range C2
C1(1)
PIC16C5X
SLEEP
Osc Type LP
Resonator Freq
XTAL RS(2) C2(1) OSC2
RF(3)
To internal logic
Note 1: See Capacitor Selection tables for recommended values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF varies with the crystal chosen (approx. value = 10 M).
32 kHz(1) 15 pF 15 pF 100 kHz 15-30 pF 30-47 pF 200 kHz 15-30 pF 15-82 pF 200-300 pF 15-30 pF XT 100 kHz 100-200 pF 15-30 pF 200 kHz 15-100 pF 15-30 pF 455 kHz 15-30 pF 15-30 pF 1 MHz 15-30 pF 15-30 pF 2 MHz 15-47 pF 15-47 pF 4 MHz HS 4 MHz 15-30 pF 15-30 pF 8 MHz 15-30 pF 15-30 pF 20 MHz 15-30 pF 15-30 pF Note 1: For VDD > 4.5V, C1 = C2 30 pF is recommended. 2: These values are for design guidance only. Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. Note: If you change from this device to another device, please verify oscillator characteristics in your application.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 33
PIC16C5X
7.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT
FIGURE 7-6:
Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 7-5 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs.
EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT (USING XT, HS OR LP OSCILLATOR MODE)
330 74AS04 74AS04 To Other Devices PIC16C5X OSC1 OSC2 100k
330 74AS04 0.1 F XTAL
Note:
If you change from this device to another device, please verify oscillator characteristics in your application. RC OSCILLATOR
7.2.4
FIGURE 7-5:
EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT (USING XT, HS OR LP OSCILLATOR MODE)
To Other Devices
+5V 10k 4.7k 74AS04 74AS04 PIC16C5X OSC1 OSC2 10k XTAL 10k 20 pF 20 pF 100k
For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (Rext) and capacitor (Cext) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low Cext values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 7-7 shows how the R/C combination is connected to the PIC16C5X. For Rext values below 2.2 k, the oscillator operation may become unstable, or stop completely. For very high Rext values (e.g., 1 M) the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping Rext between 3 k and 100 k. Although the oscillator will operate with no external capacitor (Cext = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance.
Note:
If you change from this device to another device, please verify oscillator characteristics in your application.
This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180-degree phase shift in a series resonant oscillator circuit. The 330 resistors provide the negative feedback to bias the inverters in their linear region.
DS30453B-page 34
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
The Electrical Specifications sections show RC frequency variation from part to part due to normal process variation. Also, see the Electrical Specifications sections for variation of oscillator frequency due to VDD for given Rext/Cext values as well as frequency variation due to operating temperature for given R, C, and VDD values. The oscillator frequency, divided by 4, is available on the OSC2/CLKOUT pin, and can be used for test purposes or to synchronize other logic.
7.3
Reset
PIC16C5X devices may be reset in one of the following ways: * * * * * Power-On Reset (POR) MCLR reset (normal operation) MCLR wake-up reset (from SLEEP) WDT reset (normal operation) WDT wake-up reset (from SLEEP)
FIGURE 7-7:
VDD Rext
RC OSCILLATOR MODE
Table 7-3 shows these reset conditions for the PCL and STATUS registers. Some registers are not affected in any reset condition. Their status is unknown on POR and unchanged in any other reset. Most other registers are reset to a "reset state" on Power-On Reset (POR), MCLR or WDT reset. A MCLR or WDT wake-up from SLEEP also results in a device reset, and not a continuation of operation before SLEEP. The TO and PD bits (STATUS <4:3>) are set or cleared depending on the different reset conditions (Section 7.7). These bits may be used to determine the nature of the reset. Table 7-4 lists a full description of reset states of all registers. Figure 7-8 shows a simplified block diagram of the on-chip reset circuit.
OSC1 N
Internal clock
Cext VSS Fosc/4
PIC16C5X
OSC2/CLKOUT
Note:
If you change from this device to another device, please verify oscillator characteristics in your application.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 35
PIC16C5X
TABLE 7-3: RESET CONDITIONS FOR SPECIAL REGISTERS
Condition Power-On Reset MCLR reset (normal operation) MCLR wake-up (from SLEEP) WDT reset (normal operation) PCL Addr: 02h 1111 1111 1111 1111 1111 1111 1111 1111 STATUS Addr: 03h 0001 1xxx 000u uuuu(1) 0001 0uuu 0000 uuuu(2) 0000 0uuu
WDT wake-up (from SLEEP) 1111 1111 Legend: u = unchanged, x = unknown, - = unimplemented read as '0'. Note 1: TO and PD bits retain their last value until one of the other reset conditions occur. 2: The CLRWDT instruction will set the TO and PD bits.
TABLE 7-4:
Register W TRIS OPTION INDF TMR0 PCL(1) STATUS(1) FSR PORTA PORTB PORTC(2)
RESET CONDITIONS FOR ALL REGISTERS
Address N/A N/A N/A 00h 01h 02h 03h 04h 05h 06h 07h Power-On Reset
xxxx xxxx 1111 1111 --11 1111 xxxx xxxx xxxx xxxx 1111 1111 0001 1xxx 1xxx xxxx ---- xxxx xxxx xxxx xxxx xxxx
MCLR or WDT Reset
uuuu uuuu 1111 1111 --11 1111 uuuu uuuu uuuu uuuu 1111 1111 000q quuu 1uuu uuuu ---- uuuu uuuu uuuu uuuu uuuu
General Purpose Register Files 07-7Fh xxxx xxxx uuuu uuuu Legend: u = unchanged, x = unknown, - = unimplemented, read as '0', q = see tables in Section 7.7 for possible values. Note 1: See Table 7-3 for reset value for specific conditions. 2: General purpose register file on PIC16C52/C54s/CR54s/C56s/CR56s/C58s/CR58s
FIGURE 7-8:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up Detect VDD POR (Power-On Reset)
MCLR/VPP pin
WDT Time-out RESET WDT On-Chip RC OSC 8-bit Asynch Ripple Counter (Start-Up Timer) S Q
R
Q CHIP RESET
DS30453B-page 36
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
7.4 Power-On Reset (POR) FIGURE 7-9:
The PIC16C5X family incorporates on-chip Power-On Reset (POR) circuitry which provides an internal chip reset for most power-up situations. To use this feature, the user merely ties the MCLR/VPP pin to VDD. A simplified block diagram of the on-chip Power-On Reset circuit is shown in Figure 7-8. The Power-On Reset circuit and the Device Reset Timer (Section 7.5) circuit are closely related. On power-up, the reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 18 ms, it will reset the reset latch and thus end the on-chip reset signal. A power-up example where MCLR is not tied to VDD is shown in Figure 7-10. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of reset TDRT msec after MCLR goes high. In Figure 7-11, the on-chip Power-On Reset feature is being used (MCLR and VDD are tied together). The VDD is stable before the start-up timer times out and there is no problem in getting a proper reset. However, Figure 7-12 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses a high on the MCLR/VPP pin, and when the MCLR/VPP pin (and VDD) actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip is, therefore, not guaranteed to function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 7-9). Note: When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be meet to ensure operation. If these conditions are not met, the device must be held in reset until the operating conditions are met.
EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP)
VDD
VDD
D
R R1 MCLR C PIC16C5X
* External Power-On Reset circuit is required only if VDD power-up is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. * R < 40 k is recommended to make sure that voltage drop across R does not violate the device electrical specification. * R1 = 100 to 1 k will limit any current flowing into MCLR from external capacitor C in the event of MCLR pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS).
For more information on PIC16C5X POR, see Power-Up Considerations - AN522 in the Embedded Control Handbook. The POR circuit does not produce an internal reset when VDD declines.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 37
PIC16C5X
FIGURE 7-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD)
VDD MCLR INTERNAL POR TDRT
DRT TIME-OUT INTERNAL RESET
FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
VDD MCLR INTERNAL POR TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 7-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME
V1 VDD MCLR INTERNAL POR TDRT DRT TIME-OUT
INTERNAL RESET When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1 VDD min
DS30453B-page 38
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
7.5 Device Reset Timer (DRT) 7.6
The Device Reset Timer (DRT) provides a fixed 18 ms nominal time-out on reset. The DRT operates on an internal RC oscillator. The processor is kept in RESET as long as the DRT is active. The DRT delay allows VDD to rise above VDD min., and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the device in a RESET condition for approximately 18 ms after the voltage on the MCLR/VPP pin has reached a logic high (VIH) level. Thus, external RC networks connected to the MCLR input are not required in most cases, allowing for savings in cost-sensitive and/or space restricted applications. The Device Reset time delay will vary from device to device due to VDD, temperature, and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out. This is particularly important for applications using the WDT to wake the PIC16C5X from SLEEP mode automatically.
Watchdog Timer (WDT) (not implemented on PIC16C52)
The Watchdog Timer (WDT) is a free running on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the RC oscillator of the OSC1/CLKIN pin. That means that the WDT will run even if the clock on the OSC1/CLKIN and OSC2/CLKOUT pins have been stopped, for example, by execution of a SLEEP instruction. During normal operation or SLEEP, a WDT reset or wake-up reset generates a device RESET. The TO bit (STATUS<4>) will be cleared upon a Watchdog Timer reset. The WDT can be permanently disabled by programming the configuration bit WDTE as a '0' (Section 7.1). Refer to the PIC16C5X Programming Specifications (Literature Number DS30190) to determine how to access the configuration word. 7.6.1 WDT PERIOD
The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, time-out a period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-to-part process variations (see DC specs). Under worst case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. 7.6.2 WDT PROGRAMMING CONSIDERATIONS
The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device RESET. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum SLEEP time before a WDT wake-up reset.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 39
PIC16C5X
FIGURE 7-13: WATCHDOG TIMER BLOCK DIAGRAM
From TMR0 Clock Source 0 Watchdog Timer 1 M U X Postscaler Postscaler
8 - to - 1 MUX WDT Enable EPROM Bit PSA
PS2:PS0
To TMR0 0 MUX Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register. WDT Time-out 1 PSA
TABLE 7-5:
SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER
Value on Power-On Reset --11 1111 Value on MCLR and WDT Reset --11 1111
Address N/A
Name OPTION
Bit 7 --
Bit 6 --
Bit 5 T0CS
Bit 4 T0SE
Bit 3 PSA
Bit 2 PS2
Bit 1 PS1
Bit 0 PS0
Legend: Shaded boxes = Not used by Watchdog Timer, - = unimplemented, read as '0', u = unchanged
DS30453B-page 40
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
7.7 Time-Out Sequence and Power Down Status Bits (TO/PD) 7.8 Reset on Brown-Out
A brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a brown-out. To reset PIC16C5X devices when a brown-out occurs, external brown-out protection circuits may be built, as shown in Figure 7-14 and Figure 7-15.
The TO and PD bits in the STATUS register can be tested to determine if a RESET condition has been caused by a power-up condition, a MCLR or Watchdog Timer (WDT) reset, or a MCLR or WDT wake-up reset.
TABLE 7-6:
TO
1 u 1 0 0
TO/PD STATUS AFTER RESET
RESET was caused by Power-up (POR) MCLR reset (normal operation)(1) MCLR wake-up reset (from SLEEP) WDT reset (normal operation) WDT wake-up reset (from SLEEP)
PD
1 u 0 1 0
FIGURE 7-14: BROWN-OUT PROTECTION CIRCUIT 1
VDD VDD 33k 10k Q1 MCLR 40k PIC16C5X
Legend: u = unchanged Note 1: The TO and PD bits maintain their status (u) until a reset occurs. A low-pulse on the MCLR input does not change the TO and PD status bits.
These STATUS bits are only affected by events listed in Table 7-7.
TABLE 7-7:
Event
EVENTS AFFECTING TO/PD STATUS BITS
TO
1 0 1 1
This circuit will activate reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage).
PD
1 u 0 1
Remarks No effect on PD
Power-up WDT Time-out SLEEP instruction CLRWDT instruction
Legend: u = unchanged
FIGURE 7-15: BROWN-OUT PROTECTION CIRCUIT 2
VDD VDD R1 Q1 MCLR R2 40k PIC16C5X
Note:
A WDT time-out will occur regardless of the status of the TO bit. A SLEEP instruction will be executed, regardless of the status of the PD bit.
Table 7-3 lists the reset conditions for the special function registers, while Table 7-4 lists the reset conditions for all the registers.
This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: VDD * R1 R1 + R2 = 0.7V
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 41
PIC16C5X
7.9 Power-Down Mode (SLEEP) 7.10 Program Verification/Code Protection
A device may be powered down (SLEEP) and later powered up (Wake-up from SLEEP). 7.9.1 SLEEP If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. Note: The Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit (STATUS<4>) is set, the PD bit (STATUS<3>) is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low, or hi-impedance). It should be noted that a RESET generated by a WDT time-out does not drive the MCLR/VPP pin low. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the MCLR/VPP pin must be at a logic high level. 7.9.2 WAKE-UP FROM SLEEP Microchip does not recommend code protecting windowed devices.
7.11
ID Locations (not implemented on PIC16C52)
Four memory locations are designated as ID locations where the user can store checksum or other code-identification numbers. These locations are not accessible during normal execution but are readable and writable during program/verify. Use only the lower 4 bits of the ID locations and always program the upper 8 bits as '1's. Note: Microchip will assign a unique pattern number for QTP and SQTP requests and for ROM devices. This pattern number will be unique and traceable to the submitted code.
The device can wake up from SLEEP through one of the following events: 1. 2. An external reset input on MCLR/VPP pin. A Watchdog Timer time-out reset (if WDT was enabled).
Both of these events cause a device reset. The TO and PD bits can be used to determine the cause of device reset. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The WDT is cleared when the device wakes from sleep, regardless of the wake-up source.
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(c) 1998 Microchip Technology Inc.
PIC16C5X
8.0 INSTRUCTION SET SUMMARY
Each PIC16C5X instruction is a 12-bit word divided into an OPCODE, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The PIC16C5X instruction set summary in Table 8-2 groups the instructions into byte-oriented, bit-oriented, and literal and control operations. Table 8-1 shows the opcode field descriptions. For byte-oriented instructions, 'f' represents a file register designator and 'd' represents a destination designator. The file register designator is used to specify which one of the 32 file registers is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If 'd' is '0', the result is placed in the W register. If 'd' is '1', the result is placed in the file register specified in the instruction. For bit-oriented instructions, 'b' represents a bit field designator which selects the number of the bit affected by the operation, while 'f' represents the number of the file in which the bit is located. For literal and control operations, 'k' represents an 8 or 9-bit constant or literal value. All instructions are executed within one single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Figure 8-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: 0xhhh where 'h' signifies a hexadecimal digit.
FIGURE 8-1:
GENERAL FORMAT FOR INSTRUCTIONS
6 5 d 4 f (FILE #) 0
Byte-oriented file register operations 11 OPCODE
TABLE 8-1:
Field
f W b k x
OPCODE FIELD DESCRIPTIONS
Description
d = 0 for destination W d = 1 for destination f f = 5-bit file register address Bit-oriented file register operations 11 OPCODE 87 54 b (BIT #) f (FILE #) 0
Register file address (0x00 to 0x7F) Working register (accumulator) Bit address within an 8-bit file register Literal field, constant data or label Don't care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. Destination select; d = 0 (store result in W) d = 1 (store result in file register 'f') Default is d = 1 Label name Top of Stack Program Counter Watchdog Timer Counter Time-Out bit Power-Down bit Destination, either the W register or the specified register file location Options Contents Assigned to Register bit field In the set of User defined term (font is courier)
b = 3-bit bit address f = 5-bit file register address Literal and control operations (except GOTO) 11 OPCODE k = 8-bit immediate value Literal and control operations - GOTO instruction 11 OPCODE k = 9-bit immediate value 9 8 k (literal) 0 8 7 k (literal) 0
d label TOS PC WDT TO PD
dest [] () <>
italics
(c) 1998 Microchip Technology Inc.
Preliminary
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PIC16C5X
TABLE 8-2:
Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF BCF BSF BTFSC BTFSS ANDLW CALL CLRWDT GOTO IORLW MOVLW OPTION RETLW SLEEP TRIS XORLW f,d f,d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d f, b f, b f, b f, b k k k k k k k k - f k
INSTRUCTION SET SUMMARY
12-Bit Opcode Description Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate left f through Carry Rotate right f through Carry Subtract W from f Swap f Exclusive OR W with f Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set AND literal with W Call subroutine Clear Watchdog Timer Unconditional branch Inclusive OR Literal with W Move Literal to W Load OPTION register Return, place Literal in W Go into standby mode Load TRIS register Exclusive OR Literal to W Cycles MSb 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 1 1 1 (2) 1 (2) 1 2 1 2 1 1 1 2 1 1 1 0001 0001 0000 0000 0010 0000 0010 0010 0011 0001 0010 0000 0000 0011 0011 0000 0011 0001 11df 01df 011f 0100 01df 11df 11df 10df 11df 00df 00df 001f 0000 01df 00df 10df 10df 10df LSb ffff ffff ffff 0000 ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff Status Affected Notes C,DC,Z Z Z Z Z Z None Z None Z Z None None C C C,DC,Z None Z None None None None Z None TO, PD None Z None None None TO, PD None Z 1,2,4 2,4 4
2,4 2,4 2,4 2,4 2,4 2,4 1,4 2,4 2,4 1,2,4 2,4 2,4 2,4 2,4
BIT-ORIENTED FILE REGISTER OPERATIONS 0100 0101 0110 0111 bbbf bbbf bbbf bbbf ffff ffff ffff ffff
LITERAL AND CONTROL OPERATIONS 1110 1001 0000 101k 1101 1100 0000 1000 0000 0000 1111 kkkk kkkk 0000 kkkk kkkk kkkk 0000 kkkk 0000 0000 kkkk kkkk kkkk 0100 kkkk kkkk kkkk 0010 kkkk 0011 0fff kkkk 1
3
Note 1: The 9th bit of the program counter will be forced to a '0' by any instruction that writes to the PC except for GOTO. (See individual device data sheets, Memory Section/Indirect Data Addressing, INDF and FSR Registers) 2: When an I/O register is modified as a function of itself (e.g. MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'. 3: The instruction TRIS f, where f = 5 or 6 causes the contents of the W register to be written to the tristate latches of PORTA or B respectively. A '1' forces the pin to a hi-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0).
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PIC16C5X
ADDWF Syntax: Operands: Operation: Encoding: Description: Add W and f [ label ] ADDWF 0 f 31 d [0,1] (W) + (f) (dest)
0001 11df ffff
ANDWF f,d Syntax: Operands: Operation: Encoding: Description:
AND W with f [ label ] ANDWF 0 f 31 d [0,1] (W) .AND. (f) (dest)
0001 01df ffff
f,d
Status Affected: C, DC, Z
Add the contents of the W register and register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'.
Status Affected: Z
The contents of the W register are AND'ed with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'.
Words: Cycles: Example:
W = FSR = W = FSR =
1 1
ADDWF 0x17 0xC2 0xD9 0xC2 FSR, 0
Words: Cycles: Example:
W= FSR = W = FSR =
1 1
ANDWF 0x17 0xC2 0x17 0x02 FSR, 1
Before Instruction
Before Instruction
After Instruction
After Instruction
ANDLW Syntax: Operands: Operation: Encoding: Description:
And literal with W [ label ] ANDLW 0 k 255 (W).AND. (k) (W) k
BCF Syntax: Operands: Operation:
Bit Clear f [ label ] BCF 0 f 31 0b7 0 (f)
0100 bbbf ffff
f,b
Status Affected: Z
1110 kkkk kkkk The contents of the W register are AND'ed with the eight-bit literal 'k'. The result is placed in the W register.
Status Affected: None Encoding: Description: Words: Cycles: Example: 1 1
BCF FLAG_REG, 7 Bit 'b' in register 'f' is cleared.
Words: Cycles: Example:
W W = =
1 1
ANDLW 0xA3 0x03 0x5F
Before Instruction
FLAG_REG = 0xC7
Before Instruction After Instruction
After Instruction
FLAG_REG = 0x47
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PIC16C5X
BSF Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example: 1 1
BSF FLAG_REG, 7
Bit Set f [ label ] BSF 0 f 31 0b7 1 (f)
0101 bbbf ffff
BTFSS f,b Syntax: Operands: Operation: Encoding: Description:
Bit Test f, Skip if Set [ label ] BTFSS f,b 0 f 31 0b<7 skip if (f) = 1
0111 bbbf ffff
Status Affected: None
Bit 'b' in register 'f' is set.
Status Affected: None
If bit 'b' in register 'f' is '1' then the next instruction is skipped. If bit 'b' is '1', then the next instruction fetched during the current instruction execution, is discarded and an NOP is executed instead, making this a 2 cycle instruction.
Before Instruction
FLAG_REG = 0x0A
Words: Cycles: Example:
1 1(2)
HERE FALSE TRUE * * BTFSS GOTO * FLAG,1 PROCESS_CODE
After Instruction
FLAG_REG = 0x8A
BTFSC Syntax: Operands: Operation: Encoding: Description:
Bit Test f, Skip if Clear [ label ] BTFSC f,b 0 f 31 0b7 skip if (f) = 0 0110
bbbf ffff
Before Instruction
PC = = = = = address (HERE) 0, address (FALSE); 1, address (TRUE)
After Instruction
If FLAG<1> PC if FLAG<1> PC
Status Affected: None
If bit 'b' in register 'f' is 0 then the next instruction is skipped. If bit 'b' is 0 then the next instruction fetched during the current instruction execution is discarded, and an NOP is executed instead, making this a 2 cycle instruction.
Words: Cycles: Example:
1 1(2)
HERE FALSE TRUE BTFSC GOTO
FLAG,1 PROCESS_CODE
* * *
address (HERE) 0, address (TRUE); 1, address(FALSE)
Before Instruction
PC = = = = =
After Instruction
if FLAG<1> PC if FLAG<1> PC
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PIC16C5X
CALL Syntax: Operands: Operation: Subroutine Call [ label ] CALL k 0 k 255 (PC) + 1 Top of Stack; k PC<7:0>; (STATUS<6:5>) PC<10:9>; 0 PC<8>
1001 kkkk kkkk
CLRW Syntax: Operands: Operation:
Clear W [ label ] CLRW None 00h (W); 1Z
0000 0100 0000
Status Affected: Z Encoding: Description: Words: Cycles: Example:
W W Z = = = The W register is cleared. Zero bit (Z) is set.
Status Affected: None Encoding: Description:
Subroutine call. First, return address (PC+1) is pushed onto the stack. The eight bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a two cycle instruction.
1 1
CLRW 0x5A 0x00 1
Before Instruction After Instruction
Words: Cycles: Example:
PC = PC = TOS =
1 2
HERE CALL THERE
Before Instruction
address (HERE) address (THERE) address (HERE + 1)
CLRWDT Syntax: Operands: Operation:
Clear Watchdog Timer [ label ] CLRWDT None 00h WDT; 0 WDT prescaler (if assigned); 1 TO; 1 PD
0000 0000 0100
After Instruction
CLRF Syntax: Operands: Operation:
Clear f [ label ] CLRF 0 f 31 00h (f); 1Z
0000 011f ffff
f
Status Affected: TO, PD Encoding: Description:
The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set.
Status Affected: Z Encoding: Description: Words: Cycles: Example:
The contents of register 'f' are cleared and the Z bit is set.
Words: Cycles: Example:
1 1
CLRWDT ? 0x00 0 1 1
1 1
CLRF = = = FLAG_REG 0x5A 0x00 1
Before Instruction
WDT counter =
Before Instruction
FLAG_REG
After Instruction
WDT counter WDT prescale TO PD = = = =
After Instruction
FLAG_REG Z
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PIC16C5X
COMF Syntax: Operands: Operation: Encoding: Description: Complement f [ label ] COMF 0 f 31 d [0,1] (f) (dest)
0010 01df ffff
DECFSZ f,d Syntax: Operands: Operation: Encoding: Description:
Decrement f, Skip if 0 [ label ] DECFSZ f,d 0 f 31 d [0,1] (f) - 1 d;
0010
skip if result = 0
ffff
Status Affected: Z
The contents of register 'f' are complemented. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
Status Affected: None
11df The contents of register 'f' are decremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction.
Words: Cycles: Example:
REG1 REG1 W
1 1
COMF = = = 0x13 0x13 0xEC REG1,0
Before Instruction After Instruction
Words: Cycles: Example:
1 1(2)
HERE DECFSZ GOTO CONTINUE * * * = = = = = address (HERE) CNT - 1; 0, address (CONTINUE); 0, address (HERE+1) CNT, 1 LOOP
DECF Syntax: Operands: Operation: Encoding: Description:
Decrement f [ label ] DECF f,d 0 f 31 d [0,1] (f) - 1 (dest)
0000 11df ffff
Before Instruction
PC CNT if CNT PC if CNT PC
After Instruction
Status Affected: Z
Decrement register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
GOTO Syntax: Operands: Operation:
Unconditional Branch [ label ] GOTO k 0 k 511 k PC<8:0>; STATUS<6:5> PC<10:9>
101k kkkk kkkk
Words: Cycles: Example:
CNT Z CNT Z
1 1
DECF = = = = 0x01 0 0x00 1 CNT,
1
Before Instruction
Status Affected: None Encoding: Description:
GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from STATUS<6:5>. GOTO is a two cycle instruction.
After Instruction
Words: Cycles: Example:
PC =
1 2
GOTO THERE address (THERE)
After Instruction
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PIC16C5X
INCF Syntax: Operands: Operation: Encoding: Description: Increment f [ label ] 0 f 31 d [0,1] (f) + 1 (dest)
0010 10df ffff
IORLW Syntax: Operands: Operation: Encoding: Description:
Inclusive OR literal with W [ label ] IORLW k 0 k 255 (W) .OR. (k) (W)
1101 kkkk kkkk
INCF f,d
Status Affected: Z
The contents of the W register are OR'ed with the eight bit literal 'k'. The result is placed in the W register.
Status Affected: Z
The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
Words: Cycles: Example:
1 1
IORLW = = = 0x9A 0xBF 0 0x35
Words: Cycles: Example:
CNT Z CNT Z
1 1
INCF = = = = CNT,
1
Before Instruction
W W Z
Before Instruction
0xFF 0 0x00 1
After Instruction
After Instruction IORWF Syntax: INCFSZ Syntax: Operands: Operation: Encoding: Description: Increment f, Skip if 0 [ label ] 0 f 31 d [0,1] (f) + 1 (dest), skip if result = 0
0011 11df ffff
Inclusive OR W with f [ label ] 0 f 31 d [0,1] (W).OR. (f) (dest)
0001 00df ffff
IORWF
f,d
Operands: Operation: Encoding: Description:
INCFSZ f,d
Status Affected: Z
Inclusive OR the W register with register 'f'. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
Status Affected: None
The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, then the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction.
Words: Cycles: Example:
1 1
IORWF 0x13 0x91 0x13 0x93 0 RESULT, 0
Before Instruction
RESULT = W =
Words: Cycles: Example:
1 1(2)
HERE INCFSZ GOTO CONTINUE * * * = = = = = address (HERE) CNT + 1; 0, address (CONTINUE); 0, address (HERE +1) CNT, LOOP 1
After Instruction
RESULT = W = Z =
Before Instruction
PC CNT if CNT PC if CNT PC
After Instruction
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PIC16C5X
MOVF Syntax: Operands: Operation: Encoding: Description: Move f [ label ] 0 f 31 d [0,1] (f) (dest)
0010 00df ffff
MOVWF MOVF f,d Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example:
Move W to f [ label ] 0 f 31 (W) (f)
0000 001f ffff
MOVWF
f
Status Affected: None
Move data from the W register to register 'f'.
Status Affected: Z
The contents of register 'f' is moved to destination 'd'. If 'd' is 0, destination is the W register. If 'd' is 1, the destination is file register 'f'. 'd' is 1 is useful to test a file register since status flag Z is affected.
1 1
MOVWF = = = = TEMP_REG 0xFF 0x4F 0x4F 0x4F
Words: Cycles: Example:
W =
1 1
MOVF FSR, 0
Before Instruction
TEMP_REG W
After Instruction
TEMP_REG W
After Instruction
value in FSR register
NOP MOVLW Syntax: Operands: Operation: Encoding: Description: Move Literal to W [ label ] k (W)
1100 kkkk kkkk
No Operation [ label ] None No operation
0000 0000 0000
Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example:
NOP
MOVLW k
0 k 255
Status Affected: None No operation. 1 1
NOP
Status Affected: None
The eight bit literal 'k' is loaded into the W register. The don't cares will assemble as 0s.
Words: Cycles: Example:
W =
1 1
MOVLW 0x5A 0x5A
After Instruction
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PIC16C5X
OPTION Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example
W
Load OPTION Register [ label ] None (W) OPTION OPTION
RLF Syntax: Operands: Operation:
Rotate Left f through Carry [ label ] RLF 0 f 31 d [0,1] See description below
0011 01df ffff
f,d
Status Affected: None
0000 0000 0010 The content of the W register is loaded into the OPTION register.
Status Affected: C Encoding: Description:
The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is stored back in register 'f'.
1 1
OPTION
Before Instruction
= 0x07 0x07
C Words: Cycles: Example: 1 1
RLF = = = = =
register 'f'
After Instruction
OPTION =
REG1,0 1110 0110 0 1110 0110 1100 1100 1
RETLW Syntax: Operands: Operation:
Return with Literal in W [ label ] RETLW k 0 k 255 k (W); TOS PC
1000 kkkk kkkk
Before Instruction
REG1 C REG1 W C
After Instruction
Status Affected: None Encoding: Description:
The W register is loaded with the eight bit literal 'k'. The program counter is loaded from the top of the stack (the return address). This is a two cycle instruction.
RRF Syntax: Operands: Operation: Encoding: Description:
Rotate Right f through Carry [ label ] 0 f 31 d [0,1] See description below
0011 00df ffff
RRF f,d
Words: Cycles: Example:
1 2
CALL TABLE ;W contains ;table offset ;value. * ;W now has table * ;value. * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ; End of table = = 0x07 value of k8
Status Affected: C
The contents of register 'f' are rotated one bit to the right through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
TABLE
C Words: Cycles: Example:
REG1 C REG1 W C
register 'f'
1 1
RRF = = = = = REG1,0 1110 0110 0 1110 0110 0111 0011 0
Before Instruction
W W
Before Instruction
After Instruction
After Instruction
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SLEEP Syntax: Operands: Operation: Enter SLEEP Mode [label] None 00h WDT; 0 WDT prescaler; 1 TO; 0 PD
0000 0000 0011
SUBWF Syntax: Operands: Operation: Encoding: Description:
Subtract W from f [label] SUBWF f,d 0 f 31 d [0,1] (f) - (W) (dest)
0000 10df ffff
SLEEP
Status Affected: C, DC, Z
Subtract (2's complement method) the W register from register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
Status Affected: TO, PD Encoding: Description:
Time-out status bit (TO) is set. The power down status bit (PD) is cleared. The WDT and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. See section on SLEEP for more details.
Words: Cycles: Example 1:
REG1 W C REG1 W C
1 1
SUBWF = = = = = = 3 2 ? 1 2 1 REG1, 1
Before Instruction
Words: Cycles: Example:
1 1 SLEEP
After Instruction
; result is positive
Example 2: Before Instruction
REG1 W C REG1 W C = = = = = = 2 2 ? 0 2 1
After Instruction
; result is zero
Example 3: Before Instruction
REG1 W C REG1 W C = = = = = = 1 2 ? FF 2 0
After Instruction
; result is negative
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PIC16C5X
SWAPF Syntax: Operands: Operation: Swap Nibbles in f [ label ] SWAPF f,d 0 f 31 d [0,1] (f<3:0>) (dest<7:4>); (f<7:4>) (dest<3:0>)
0011 10df ffff
XORLW Syntax: Operands: Operation: Encoding: Description:
Exclusive OR literal with W [label] XORLW k 0 k 255 (W) .XOR. k (W)
1111 kkkk kkkk
Status Affected: Z
The contents of the W register are XOR'ed with the eight bit literal 'k'. The result is placed in the W register.
Status Affected: None Encoding: Description:
The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0 the result is placed in W register. If 'd' is 1 the result is placed in register 'f'.
Words: Cycles: Example:
1 1 XORLW
= = 0xB5 0x1A
Words: Cycles: Example
REG1 REG1 W
1 1
SWAPF = = =
0xAF
Before Instruction REG1, 0
W W
Before Instruction
0xA5 0xA5 0X5A
After Instruction
After Instruction XORWF Syntax: Operands: TRIS Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example
W TRISA
Exclusive OR W with f [ label ] XORWF 0 f 31 d [0,1] (W) .XOR. (f) (dest)
0001 10df ffff
f,d
Load TRIS Register [ label ] TRIS f = 5, 6 or 7 (W) TRIS register f
0000 0000 0fff
f
Operation: Encoding: Description:
Status Affected: Z
Exclusive OR the contents of the W register with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
Status Affected: None
TRIS register 'f' (f = 5, 6, or 7) is loaded with the contents of the W register
1 1
TRIS = = 0XA5 0XA5 PORTA
Words: Cycles: Example
REG W REG W
1 1 XORWF
= = = = REG,1
Before Instruction After Instruction
Before Instruction
0xAF 0xB5 0x1A 0xB5
After Instruction
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NOTES:
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PIC16C5X
9.0
9.1
DEVELOPMENT SUPPORT
Development Tools
9.3
ICEPIC: Low-Cost PICmicroTM In-Circuit Emulator
The PICmicrTM microcontrollers are supported with a full range of hardware and software development tools: * PICMASTER(R)/PICMASTER CE Real-Time In-Circuit Emulator * ICEPICTM Low-Cost PIC16C5X and PIC16CXXX In-Circuit Emulator * PRO MATE(R) II Universal Programmer * PICSTART(R) Plus Entry-Level Prototype Programmer * PICDEM-1 Low-Cost Demonstration Board * PICDEM-2 Low-Cost Demonstration Board * PICDEM-3 Low-Cost Demonstration Board * MPASM Assembler * MPLABTM SIM Software Simulator * MPLAB-C17 (C Compiler) * Fuzzy Logic Development System (fuzzyTECH(R)-MP)
ICEPIC is a low-cost in-circuit emulator solution for the Microchip PIC12CXXX, PIC16C5X and PIC16CXXX families of 8-bit OTP microcontrollers. ICEPIC is designed to operate on PC-compatible machines ranging from 286-AT(R) through PentiumTM based machines under Windows 3.x environment. ICEPIC features real time, non-intrusive emulation.
9.4
PRO MATE II: Universal Programmer
The PRO MATE II Universal Programmer is a full-featured programmer capable of operating in stand-alone mode as well as PC-hosted mode. PRO MATE II is CE compliant. The PRO MATE II has programmable VDD and VPP supplies which allows it to verify programmed memory at VDD min and VDD max for maximum reliability. It has an LCD display for displaying error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In standalone mode the PRO MATE II can read, verify or program PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices. It can also set configuration and code-protect bits in this mode.
9.2
PICMASTER: High Performance Universal In-Circuit Emulator with MPLAB IDE
The PICMASTER Universal In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for all microcontrollers in the PIC14C000, PIC12CXXX, PIC16C5X, PIC16CXXX and PIC17CXX families. PICMASTER is supplied with the MPLABTM Integrated Development Environment (IDE), which allows editing, "make" and download, and source debugging from a single environment. Interchangeable target probes allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the PICMASTER allows expansion to support all new Microchip microcontrollers. The PICMASTER Emulator System has been designed as a real-time emulation system with advanced features that are generally found on more expensive development tools. The PC compatible 386 (and higher) machine platform and Microsoft Windows(R) 3.x environment were chosen to best make these features available to you, the end user. A CE compliant version of PICMASTER is available for European Union (EU) countries.
9.5
PICSTART Plus Entry Level Development System
The PICSTART programmer is an easy-to-use, low-cost prototype programmer. It connects to the PC via one of the COM (RS-232) ports. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. PICSTART Plus is not recommended for production programming. PICSTART Plus supports all PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices with up to 40 pins. Larger pin count devices such as the PIC16C923, PIC16C924 and PIC17C756 may be supported with an adapter socket. PICSTART Plus is CE compliant.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 55
PIC16C5X
9.6 PICDEM-1 Low-Cost PICmicro Demonstration Board
connecting it to the microcontroller socket(s). Some of the features include an RS-232 interface, push-button switches, a potentiometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM-3 board is an LCD panel, with 4 commons and 12 segments, that is capable of displaying time, temperature and day of the week. The PICDEM-3 provides an additional RS-232 interface and Windows 3.1 software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals.
The PICDEM-1 is a simple board which demonstrates the capabilities of several of Microchip's microcontrollers. The microcontrollers supported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The users can program the sample microcontrollers provided with the PICDEM-1 board, on a PRO MATE II or PICSTART-Plus programmer, and easily test firmware. The user can also connect the PICDEM-1 board to the PICMASTER emulator and download the firmware to the emulator for testing. Additional prototype area is available for the user to build some additional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simulated analog input, push-button switches and eight LEDs connected to PORTB.
9.9
MPLABTM Integrated Development Environment Software
The MPLAB IDE Software brings an ease of software development previously unseen in the 8-bit microcontroller market. MPLAB is a windows based application which contains: * A full featured editor * Three operating modes - editor - emulator - simulator * A project manager * Customizable tool bar and key mapping * A status bar with project information * Extensive on-line help MPLAB allows you to: * Edit your source files (either assembly or `C') * One touch assemble (or compile) and download to PICmicro tools (automatically updates all project information) * Debug using: - source files - absolute listing file * Transfer data dynamically via DDE (soon to be replaced by OLE) * Run up to four emulators on the same PC The ability to use MPLAB with Microchip's simulator allows a consistent platform and the ability to easily switch from the low cost simulator to the full featured emulator with minimal retraining due to development tools.
9.7
PICDEM-2 Low-Cost PIC16CXX Demonstration Board
The PICDEM-2 is a simple demonstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-2 board, on a PRO MATE II programmer or PICSTART-Plus, and easily test firmware. The PICMASTER emulator may also be used with the PICDEM-2 board to test firmware. Additional prototype area has been provided to the user for adding additional hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push-button switches, a potentiometer for simulated analog input, a Serial EEPROM to demonstrate usage of the I2C bus and separate headers for connection to an LCD module and a keypad.
9.8
PICDEM-3 Low-Cost PIC16CXXX Demonstration Board
The PICDEM-3 is a simple demonstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with a LCD Module. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II programmer or PICSTART Plus with an adapter socket, and easily test firmware. The PICMASTER emulator may also be used with the PICDEM-3 board to test firmware. Additional prototype area has been provided to the user for adding hardware and
9.10
Assembler (MPASM)
The MPASM Universal Macro Assembler is a PC-hosted symbolic assembler. It supports all microcontroller series including the PIC12C5XX, PIC14000, PIC16C5X, PIC16CXXX, and PIC17CXX families. MPASM offers full featured Macro capabilities, conditional assembly, and several source and listing formats. It generates various object code formats to support Microchip's development tools as well as third party programmers.
DS30453B-page 56
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
MPASM allows full symbolic debugging from PICMASTER, Microchip's Universal Emulator System. MPASM has the following features to assist in developing software for specific use applications. * Provides translation of Assembler source code to object code for all Microchip microcontrollers. * Macro assembly capability. * Produces all the files (Object, Listing, Symbol, and special) required for symbolic debug with Microchip's emulator systems. * Supports Hex (default), Decimal and Octal source and listing formats. MPASM provides a rich directive language to support programming of the PICmicro. Directives are helpful in making the development of your assemble source code shorter and more maintainable.
9.14
MP-DriveWayTM - Application Code Generator
MP-DriveWay is an easy-to-use Windows-based Application Code Generator. With MP-DriveWay you can visually configure all the peripherals in a PICmicro device and, with a click of the mouse, generate all the initialization and many functional code modules in C language. The output is fully compatible with Microchip's MPLAB-C C compiler. The code produced is highly modular and allows easy integration of your own code. MP-DriveWay is intelligent enough to maintain your code through subsequent code generation.
9.15
SEEVAL(R) Evaluation and Programming System
9.11
Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code development in a PC host environment. It allows the user to simulate the PICmicro series microcontrollers on an instruction level. On any given instruction, the user may examine or modify any of the data areas or provide external stimulus to any of the pins. The input/output radix can be set by the user and the execution can be performed in; single step, execute until break, or in a trace mode. MPLAB-SIM fully supports symbolic debugging using MPLAB-C and MPASM. The Software Simulator offers the low cost flexibility to develop and debug code outside of the laboratory environment making it an excellent multi-project software development tool.
The SEEVAL SEEPROM Designer's Kit supports all Microchip 2-wire and 3-wire Serial EEPROMs. The kit includes everything necessary to read, write, erase or program special features of any Microchip SEEPROM product including Smart SerialsTM and secure serials. The Total EnduranceTM Disk is included to aid in trade-off analysis and reliability calculations. The total kit can significantly reduce time-to-market and result in an optimized system.
9.16
KEELOQ(R) Evaluation and Programming Tools
9.12
C Compiler (MPLAB-C17)
KEELOQ evaluation and programming tools support Microchips HCS Secure Data Products. The HCS evaluation kit includes an LCD display to show changing codes, a decoder to decode transmissions, and a programming interface to program test transmitters.
The MPLAB-C Code Development System is a complete `C' compiler and integrated development environment for Microchip's PIC17CXXX family of microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with other compilers. For easier source level debugging, the compiler provides symbol information that is compatible with the MPLAB IDE memory display.
9.13
Fuzzy Logic Development System (fuzzyTECH-MP)
fuzzyTECH-MP fuzzy logic development tool is available in two versions - a low cost introductory version, MP Explorer, for designers to gain a comprehensive working knowledge of fuzzy logic system design; and a full-featured version, fuzzyTECH-MP, Edition for implementing more complex systems.
Both versions include Microchip's fuzzyLABTM demonstration board for hands-on experience with fuzzy logic systems implementation.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 57
DS30453B-page 58
TABLE 9-1:
PIC16C5X
PIC12C5XX
PIC14000
PIC16C5X
PIC16CXXX
PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X
PIC17C7XX
24CXX 25CXX 93CXX HCSXXX
EMULATOR PRODUCTS
PICMASTER(R)/ PICMASTER-CE In-Circuit Emulator MPLABTM-ICE ICEPICTM Low-Cost In-Circuit Emulator
(PIC17C75X only)
DEVELOPMENT TOOLS FROM MICROCHIP
u u
u
u u
u u
u u
u u
u u
u u
u
u u
SOFTWARE PRODUCTS
MPLABTM Integrated Development Environment MPLABTM C17 Compiler
u
u
u
u
u
u
u
u
u u
u u
Preliminary
(c) 1998 Microchip Technology Inc.
fuzzyTECH(R)-MP Explorer/Edition Fuzzy Logic Dev. Tool
MP-DriveWayTM Applications Code Generator Total EnduranceTM Software Model
u
u
u u
u u
u u
u u
u u
u u
u u u
PROGRAMMERS
PICSTART(R)Plus Low-Cost Universal Dev. Kit PRO MATE(R) II Universal Programmer KEELOQ(R) Programmer
u u
u u
u u
u u
u u
u u
u u
u u
u u
u u u u u
DEMO BOARDS
SEEVAL(R) Designers Kit PICDEM-1 PICDEM-2 PICDEM-3 KEELOQ(R) Evaluation Kit
u u u u u u u u u
PIC16C52
10.0 ELECTRICAL CHARACTERISTICS - PIC16C52
PIC16C5X
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -55C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..............................................................................................................0 V to +7.5 V Voltage on MCLR with respect to VSS............................................................................................................0 V to +14 V Voltage on all other pins with respect to VSS ................................................................................-0.6 V to (VDD + 0.6 V) Total Power Dissipation(1) ....................................................................................................................................800 mW Max. Current out of VSS pin...................................................................................................................................150 mA Max. Current into VDD pin........................................................................................................................................50 mA Max. Current into an input pin (T0CKI only).....................................................................................................................500 A Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................10 mA Max. Output Current sourced by any I/O pin...........................................................................................................10 mA Max. Output Current sourced by a single I/O port (PORTA or B)............................................................................10 mA Max. Output Current sunk by a single I/O port (PORTA or B) .................................................................................10 mA Note 1: Power Dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 59
PIC16C5X
10.1 DC Characteristics: PIC16C52-04 (Commercial) PIC16C52-04I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RAM Data Supply Retention Voltage(2) Sym VDD VDR IDD IPD
PIC16C52
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min 3.0
-- -- --
Typ(1)
--
Max 6.25
--
Units V V mA A A
Conditions FOSC = DC to 4 MHz Device in SLEEP Mode FOSC = 4 MHz, VDD = 5.5 V VDD = 3.0 V VDD = 3.0 V
1.5* 1.8 0.6 0.6
Current(3,4) Current(5)
3.3 9 12
Power Down Commercial Industrial
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: For RC option, does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 60
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C52
10.2 DC Characteristics: PIC16C52-04 (Commercial) PIC16C52-04I (Industrial)
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) Input High Voltage I/O ports Sym VIL VSS VSS VSS VSS VSS VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1 -5 -3 -3 VOL -- -- -- 0.5 0.5 0.5 -- -- -- -- -- -- +5 +3 +3 0.5 +1 A A A A A 0.15VDD*
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1. Min Typ(1) -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 0.2 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD VDD VDD VDD VDD VDD VDD VDD -- Units V V V V V V V V V V V V V For VDD 5.5 V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25 V VPIN = VDD VSS VPIN VDD VSS VPIN VDD, XT option IOL = 2.0 mA, VDD = 4.5 V IOL = 1.6 mA, VDD = 4.5 V, RC option IOH = -2.0 mA, VDD = 4.5 V IOH = -1.0 mA, VDD = 4.5 V, RC option Conditions Pin at hi-impedance RC(4) option only XT option For all VDD(5) 4.0 V < VDD 5.5 V(5) VDD > 5.5 V RC(4) option only XT option
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) Hysteresis of Schmitt Trigger inputs Input Leakage Current(2,3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage I/O ports(3) OSC2/CLKOUT
0.6 0.6 -- -- --
V V
VOH VDD - 0.7 VDD - 0.7
V V
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C52 be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 61
PIC16C5X
10.3 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase subscripts (pp) and their meanings: pp 2 to ck CLKOUT cy cycle time drt device reset timer io I/O port Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low
PIC16C52
T
Time
mc osc os t0
MCLR oscillator OSC1 T0CKI
P R V Z
Period Rise Valid Hi-impedance
FIGURE 10-1: LOAD CONDITIONS - PIC16C52
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT mode when external clock is used to drive OSC1
DS30453B-page 62
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C52
10.4 Timing Diagrams and Specifications
PIC16C5X
FIGURE 10-2: EXTERNAL CLOCK TIMING - PIC16C52
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 10-1:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C52
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1.
Characteristic External CLKIN Frequency(2) Oscillator Frequency(2) External CLKIN Period(2) Oscillator Period(2) Instruction Cycle Time(3) Min DC DC 0.1 Typ(1) -- -- -- -- -- -- -- 4/FOSC -- -- Max 4 4 4 -- -- -- 10,000 -- -- 25* Units MHz MHz MHz ns ns ns ns -- ns ns XT oscillator XT oscillator Conditions XT osc mode RC osc mode XT osc mode RC osc mode XT osc mode RC osc mode XT osc mode
AC Characteristics
Parameter No.
Sym FOSC
1
TOSC
250 250 250 250
2 3 4
TCY
-- 85* --
TosL, TosH Clock in (OSC1) Low or High Time TosR, TosF Clock in (OSC1) Rise or Fall Time
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 63
PIC16C5X
FIGURE 10-3: CLKOUT AND I/O TIMING - PIC16C52
Q4 OSC1 10 CLKOUT 13 I/O Pin (input) 17 I/O Pin (output) Old Value 15 18 12 16 11 Q1 Q2
PIC16C52
Q3
14
19
New Value
20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 10-2:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C52
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5 5 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 10-1 for loading conditions.
DS30453B-page 64
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C52
FIGURE 10-4: RESET AND DEVICE RESET TIMER TIMING - PIC16C52
VDD MCLR 30 Internal POR 32
PIC16C5X
32 DRT Time-out
32
Internal RESET
34 I/O pin (Note 1)
34
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 10-3:
RESET AND DEVICE RESET TIMER - PIC16C52
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1. Parameter No.
30 32 34
Sym TmcL TDRT TioZ
Characteristic MCLR Pulse Width (low) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 100* 9* --
Typ(1) -- 18* --
Max -- 30* 100*
Units ns ms ns
Conditions VDD = 5 V VDD = 5 V (Commercial)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 65
PIC16C5X
FIGURE 10-5: TIMER0 CLOCK TIMINGS - PIC16C52
PIC16C52
T0CKI 40 41
42
TABLE 10-4:
TIMER0 CLOCK REQUIREMENTS - PIC16C52
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 66
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
11.0 ELECTRICAL CHARACTERISTICS - PIC16C54/55/56/57
PIC16C5X
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -55C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ............................................................................................................... 0V to +7.5V Voltage on MCLR with respect to VSS(2) ......................................................................................................... 0V to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total Power Dissipation(1) ....................................................................................................................................800 mW Max. Current out of VSS pin...................................................................................................................................150 mA Max. Current into VDD pin......................................................................................................................................100 mA Max. Current into an input pin (T0CKI only).....................................................................................................................500 A Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................20 mA Max. Output Current sourced by a single I/O port (PORTA, B or C) .......................................................................40 mA Max. Output Current sunk by a single I/O port (PORTA, B or C) ............................................................................50 mA Note 1: Power Dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOL x IOL) Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50 to 100 should be used when applying a "low" level to the MCLR pin rather than pulling this pin directly to VSS
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 67
PIC16C5X
TABLE 11-1:
OSC
VDD: IDD: IPD: Freq: VDD: IDD: IPD: Freq:
PIC16C54/55/56/57
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS (RC, XT & 10) AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16C5X-RC
3.0 V to 6.25 V 3.3 mA max. at 5. V 9 A max. at 3.0 V, WDT dis 4 MHz max. 3.0V to 6.25V 1.8 mA typ. at 5.5V 0.6 A typ. at 3.0V WDT dis 4 MHz max. VDD: IDD: IPD: Freq:
PIC16C5X-XT
PIC16C5X-10
RC
N/A
N/A
XT
3.0V to 6.25V 3.3 mA max. at 5.5V 9 A max. at 3.0V, WDT dis 4 MHz max. VDD: IDD: IPD: Freq: VDD: IDD: IPD: Freq:
N/A
HS
N/A
N/A
4.5V to 5.5V 10 mA max. at 5.5V 9 A max. at 3.0V, WDT dis 10 MHz max. 2.5V to 6.25V 15 A typ. at 3.0V 0.6 A typ. at 3.0V, WDT dis 40 kHz max.
LP
VDD: IDD: IPD: Freq:
2.5V to 6.25V 15 A typ. at 3.0V 0.6 A typ. at 3.0V, WDT dis 40 kHz max.
VDD: IDD: IPD: Freq:
2.5V to 6.25V 15 A typ. at 3.0V 0.6 A typ. at 3.0V, WDT dis 40 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
TABLE 11-2:
OSC
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS (HS, LP & JW) AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16C5X-HS PIC16C5X-LP
VDD: IDD: IPD: Freq: VDD: IDD: IPD: Freq: VDD: IDD: IPD: Freq: VDD: IDD: IPD: Freq:
PIC16C5X/JW
3.0V to 6.25V 3.3 mA max. at 5.5V 9 A max. at 3.0V, WDT dis 4 MHz max. 3.0V to 6.25V 3.3 mA max. at 5.5V 9 A max. at 3.0V, WDT dis 4 MHz max. 4.5V to 5.5V 20 mA max. at 5.5V 9 A max. at 3.0V, WDT dis 20 MHz max. 2.5V to 6.25V 32 A max. at 32 kHz, 3.0V 9 A max. at 3.0V, WDT dis 40 kHz max.
RC
N/A
N/A
XT
N/A
N/A
HS
VDD: IDD: IPD: Freq: VDD: IDD: IPD: Freq:
4.5V to 5.5V 20 mA max. at 5.5V 9 A max. at 3.0V, WDT dis 20 MHz max. 2.5V to 6.25V 15 A typ. at 3.0V 0.6 A typ. at 3.0V, WDT dis 40 kHz max. VDD: IDD: IPD: Freq:
N/A
LP
2.5V to 6.25V 32 A max. at 32 kHz, 3.0V 9 A max. at 3.0V, WDT dis 40 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 68
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
11.1
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C Sym VDD 3.0 3.0 4.5 4.5 2.5 VDR VPOR SVDD IDD 0.05* -- -- -- -- -- -- -- Min Typ(1) -- -- -- -- -- -- 1.5* VSS -- Max 6.25 6.25 5.5 5.5 6.25 -- -- -- Units V V V V V V V V/ms Conditions FOSC = DC to 4 MHz FOSC = DC to 4 MHz FOSC = DC to 10 MHz FOSC = DC to 20 MHz FOSC = DC to 40 kHz Device in SLEEP Mode See Section 7.4 for details on Power-On Reset See Section 7.4 for details on Power-On Reset FOSC = 4 MHz, VDD = 5.5V FOSC = 4 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled
DC Characteristics: PIC16C54/55/56/57-RC, XT, 10, HS, LP (Commercial)
DC Characteristics Power Supply Pins Characteristic
Supply Voltage PIC16C5X-RC PIC16C5X-XT PIC16C5X-10 PIC16C5X-HS PIC16C5X-LP RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-On Reset VDD Rise Rate to ensure Power-On Reset Supply Current(3) PIC16C5X-RC(4) PIC16C5X-XT PIC16C5X-10 PIC16C5X-HS PIC16C5X-LP Power Down Current(5)
1.8 1.8 4.8 4.8 9.0 15
3.3 3.3 10 10 20 32
mA mA mA mA mA A
IPD -- -- 4.0 0.6 12 9 A A
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 69
PIC16C5X
11.2
DC Characteristics Power Supply Pins Characteristic Supply Voltage PIC16C5X-RCI PIC16C5X-XTI PIC16C5X-10I PIC16C5X-HSI PIC16C5X-LPI RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-On Reset VDD Rise Rate to ensure Power-On Reset Supply Current(3) PIC16C5X-RCI(4) PIC16C5X-XTI PIC16C5X-10I PIC16C5X-HSI PIC16C5X-LPI Power Down Current(5) IPD -- -- * These parameters are characterized but not tested. 4.0 0.6 14 12 A A Sym VDD 3.0 3.0 4.5 4.5 2.5 VDR VPOR SVDD IDD -- -- -- -- -- -- 1.8 1.8 4.8 4.8 9.0 15 3.3 3.3 10 10 20 40 mA mA mA mA mA A -- -- 0.05* -- -- -- -- -- 1.5* VSS -- 6.25 6.25 5.5 5.5 6.25 -- -- -- V V V V V V V V/ms
PIC16C54/55/56/57
DC Characteristics: PIC16C54/55/56/57-RCI, XTI, 10I, HSI, LPI (Industrial)
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C Min Typ(1) Max Units Conditions FOSC = DC to 4 MHz FOSC = DC to 4 MHz FOSC = DC to 10 MHz FOSC = DC to 20 MHz FOSC = DC to 40 kHz Device in SLEEP mode See Section 7.4 for details on Power-On Reset See Section 7.4 for details on Power-On Reset FOSC = 4 MHz, VDD = 5.5V FOSC = 4 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled
Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 70
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
11.3
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C Sym VDD 3.25 3.25 4.5 4.5 2.5 VDR VPOR SVDD IDD -- -- -- -- -- -- IPD -- -- 5.0 0.8 22 18 A A VDD = 3.25V, WDT enabled VDD = 3.25V, WDT disabled 1.8 1.8 4.8 4.8 9.0 19 3.3 3.3 10 10 20 55 mA mA mA mA mA A FOSC = 4 MHz, VDD = 5.5V FOSC = 4 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 16 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 3.25V, WDT disabled -- -- 0.05* -- -- -- -- -- 1.5* VSS -- 6.0 6.0 5.5 5.5 6.0 -- -- -- V V V V V V V V/ms FOSC = DC to 4 MHz FOSC = DC to 4 MHz FOSC = DC to 10 MHz FOSC = DC to 16 MHz FOSC = DC to 40 kHz Device in SLEEP mode See Section 7.4 for details on Power-On Reset See Section 7.4 for details on Power-On Reset Min Typ (1) Max Units Conditions
DC Characteristics: PIC16C54/55/56/57-RCE, XTE, 10E, HSE, LPE (Extended)
DC Characteristics Power Supply Pins Characteristic
Supply Voltage PIC16C5X-RCE PIC16C5X-XTE PIC16C5X-10E PIC16C5X-HSE PIC16C5X-LPE RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) PIC16C5X-RCE(4) PIC16C5X-XTE PIC16C5X-10E PIC16C5X-HSE PIC16C5X-LPE Power Down Current(5)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 71
PIC16C5X
11.4
PIC16C54/55/56/57
DC Characteristics: PIC16C54/55/56/57-RC, XT, 10, HS, LP (Commercial) PIC16C54/55/56/57-RCI, XTI, 10I, HSI, LPI (Industrial)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3. Sym VIL VSS VSS VSS VSS VSS VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1 -5 -3 -3 VOL -- -- VOH VDD - 0.7 VDD - 0.7 -- -- -- -- V V IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, PIC16C5X-RC -- -- 0.6 0.6 V V IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, PIC16C5X-RC 0.5 0.5 0.5 +5 +3 +3 0.5 +1 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V VPIN = VDD VSS VPIN VDD VSS VPIN VDD, PIC16C5X-XT, 10, HS, LP For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5V PIC16C5X-RC only(4) PIC16C5X-XT, 10, HS, LP -- -- -- -- -- 0.2 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD V V V V V Pin at hi-impedance PIC16C5X-RC only(4) PIC16C5X-XT, 10, HS, LP Min Typ(1) Max Units Conditions
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) Input High Voltage I/O ports
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) Hysteresis of Schmitt Trigger inputs Input Leakage Current(2,3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage I/O ports(3) OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For PIC16C5X-RC devices, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
DS30453B-page 72
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
11.5 DC Characteristics: PIC16C54/55/56/57-RC, XT, 10, HS, LP (Extended)
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) Input High Voltage I/O ports Sym VIL Vss Vss Vss Vss Vss VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1 -5 -3 -3 VOL -- -- VOH VDD - 0.7 VDD - 0.7 -- -- -- -- V V -- -- 0.6 0.6 V V 0.5 0.5 0.5 +5 +3 +3 0.5 +1 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V -- -- -- -- -- 0.15 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD V V V V V
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3. Min Typ(1) Max Units Conditions Pin at hi-impedance PIC16C5X-RC only(4) PIC16C5X-XT, 10, HS, LP For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5 V PIC16C5X-RC only(4) PIC16C5X-XT, 10, HS, LP
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) Hysteresis of Schmitt Trigger inputs Input Leakage Current (2,3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage I/O ports(3) OSC2/CLKOUT
For VDD 5.5 V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V VPIN = VDD VSS VPIN VDD VSS VPIN VDD, PIC16C5X-XT, 10, HS, LP IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, PIC16C5X-RC IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, PIC16C5X-RC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For PIC16C5X-RC devices, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 73
PIC16C5X
11.6 Timing Parameter Symbology and Load Conditions
PIC16C54/55/56/57
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase subscripts (pp) and their meanings: pp 2 to ck CLKOUT cy cycle time drt device reset timer io I/O port Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low
T
Time
mc osc os t0 wdt
MCLR oscillator OSC1 T0CKI watchdog timer
P R V Z
Period Rise Valid Hi-impedance
FIGURE 11-1: LOAD CONDITIONS - PIC16C54/55/56/57
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1
DS30453B-page 74
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
11.7 Timing Diagrams and Specifications
PIC16C5X
FIGURE 11-2: EXTERNAL CLOCK TIMING - PIC16C54/55/56/57
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 11-3:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54/55/56/57
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3
Characteristic External CLKIN Frequency(2) Min DC DC DC DC DC Oscillator Frequency(2) DC 0.1 4 4 4 DC Typ(1) -- -- -- -- -- -- -- -- -- -- -- Max 4 10 20 16 40 4 4 10 20 16 40 Units MHz MHz MHz MHz kHz MHz MHz MHz MHz MHz kHz Conditions XT osc mode 10 MHz mode HS osc mode (Com/Indust) HS osc mode (Extended) LP osc mode RC osc mode XT osc mode 10 MHz mode HS osc mode (Com/Indust) HS osc mode (Extended) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 75
PIC16C5X
TABLE 11-3:
AC Characteristics
PIC16C54/55/56/57
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54/55/56/57 (CON'T)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3
Characteristic External CLKIN Period(2) Min 250 100 50 62.5 25 Oscillator Period(2) 250 250 100 50 62.5 25 Instruction Cycle Time(3) Typ(1) -- -- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- -- -- -- Max -- -- -- -- -- -- 10,000 250 250 250 -- -- -- -- -- 25* 25* 50* Units ns ns ns ns s ns ns ns ns ns s -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions XT osc mode 10 MHz mode HS osc mode (Com/Indust) HS osc mode (Extended) LP osc mode RC osc mode XT osc mode 10 MHz mode HS osc mode (Com/Indust) HS osc mode (Extended) LP osc mode
Parameter No. 1
Sym TOSC
2 3
TCY
-- 85* 20* 2*
TosL, TosH Clock in (OSC1) Low or High Time
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
-- -- --
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 76
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
FIGURE 11-3: CLKOUT AND I/O TIMING - PIC16C54/55/56/57
Q4 OSC1 10 CLKOUT 13 I/O Pin (input) 17 I/O Pin (output) Old Value 15 18 Q1 Q2
PIC16C5X
Q3
11
14
19
12 16
New Value
20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 11-4:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C54/55/56/57
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5 5 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 11-1 for loading conditions.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 77
PIC16C5X
FIGURE 11-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16C54/55/56/57
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1)
PIC16C54/55/56/57
32
32
34
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 11-5:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C54/55/56/57
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3 Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 100* 9* 9* --
Typ(1) -- 18* 18* --
Max -- 30* 30* 100*
Units ns ms ms ns
Conditions VDD = 5.0V VDD = 5.0V (Commercial) VDD = 5.0V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 78
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
FIGURE 11-5: TIMER0 CLOCK TIMINGS - PIC16C54/55/56/57
PIC16C5X
T0CKI 40 41
42
TABLE 11-6:
TIMER0 CLOCK REQUIREMENTS - PIC16C54/55/56/57
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3 Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 79
PIC16C5X
NOTES:
PIC16C54/55/56/57
DS30453B-page 80
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
12.0 DC AND AC CHARACTERISTICS - PIC16C54/55/56/57
PIC16C5X
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation.
FIGURE 12-1: TYPICAL RC OSCILLATOR FREQUENCY vs. TEMPERATURE
FOSC FOSC (25C) 1.10 1.08 1.06 1.04 1.02 1.00 0.98 VDD = 5.5 V 0.96 0.94 VDD = 3.5 V 0.92 0.90 0.88 0 10 20 25 30 T(C) 40 50 60 70 Rext 10 k Cext = 100 pF Frequency normalized to +25C
TABLE 12-1:
Cext 20 pF
RC OSCILLATOR FREQUENCIES
Rext 4.973 MHz 3.82 MHz 2.22 MHz 262.15 kHz 1.63 MHz 1.19 MHz 684.64 kHz 71.56 kHz 660 kHz 484.1 kHz 267.63 kHz 29.44 kHz Average Fosc @ 5 V, 25C 27% 21% 21% 31% 13% 13% 18% 25% 10% 14% 15% 19%
3.3 k 5k 10 k 100 k 100 pF 3.3 k 5k 10 k 100 k 300 pF 3.3 k 5.0 k 10 k 160 k The frequencies are measured on DIP packages.
The percentage variation indicated here is part-to-part variation due to normal process distribution. The variation indicated is 3 standard deviation from average value for VDD = 5 V.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 81
PIC16C5X
FIGURE 12-2: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 20 PF
5.5 R = 3.3k 5.0 4.5 4.0 3.5
FOSC (MHz)
PIC16C54/55/56/57
FIGURE 12-3: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 100 PF
1.8 R = 3.3k 1.6 1.4 R = 5k
FOSC (MHz)
1.2 1.0 0.8
R = 5k
3.0 R = 10k 2.5 2.0
Measured on DIP Packages, T = 25C
R = 10k 0.6
Measured on DIP Packages, T = 25C
0.4 0.2 R = 100k 0.0 3.0 R = 100k
1.5 1.0 0.5 0.0 3.0
3.5
4.0
4.5
VDD (Volts)
5.0
5.5
6.0
3.5
4.0 4.5 VDD (Volts)
5.0
5.5
6.0
FIGURE 12-4: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 300 PF
800 700 600 500
FOSC (kHz)
R = 3.3k
R = 5k
400 300 200
Measured on DIP Packages, T = 25C
R = 10k
100 R = 100k 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
DS30453B-page 82
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
FIGURE 12-5: TYPICAL IPD vs. VDD, WATCHDOG DISABLED
2.5
PIC16C5X
FIGURE 12-7: TYPICAL IPD vs. VDD, WATCHDOG ENABLED
20 18
2.0 T = 25C 1.5 IPD (A) IPD (A)
16 14 T = 25C 12 10 8 6
1.0
0.5
4 2
0.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts)
0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts)
FIGURE 12-6: MAXIMUM IPD vs. VDD, WATCHDOG DISABLED
100
FIGURE 12-8: MAXIMUM IPD vs. VDD, WATCHDOG ENABLED
60
50
+125C 10 +85C +70C 0C IPD (A)
30 40 -55C +85C +125C 20
-40C
IPD (A)
1
-55C
-40C
+70C
0C 10
0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 VDD (Volts)
0 2.5
3.0
3.5
4.0 4.5 5.0 VDD (Volts)
5.5
6.0
6.5 7.0
IPD, with WDT enabled, has two components: The leakage current which increases with higher temperature and the operating current of the WDT logic which increases with lower temperature. At -40C, the latter dominates explaining the apparently anomalous behavior.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 83
PIC16C5X
FIGURE 12-9: VTH (INPUT THRESHOLD VOLTAGE) OF I/O PINS vs. VDD
2.00 1.80 1.60 VTH (Volts) 1.40 1.20 1.00 0.80 0.60 2.5 3.0 3.5
PIC16C54/55/56/57
-40C Max (
C) to +85 5C)
2 Typ (+
40C Min (-
C) to +85
4.0 4.5 VDD (Volts)
5.0
5.5
6.0
FIGURE 12-10: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) vs. VDD
4.5 4.0 3.5 VIH, VIL (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2.5 3.0 3.5 4.0
Note: These input pins have Schmitt Trigger input buffers.
C) +85 C to (-40 max VIH C +25 typ C) VIH +85 C to (-40 min VIH
C to +85C) VIL max (-40 VIH typ +25C
VIL min (-40C to +8 5C)
4.5 VDD (Volts)
5.0
5.5
6.0
FIGURE 12-11: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP MODES) vs. VDD
3.4 3.2 3.0 2.8 2.6 VTH (Volts) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 2.5 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0
Max
C t (-40
o +8
) 5C
( Typ
C) +25
Min
o+ C t (-40
85
C)
DS30453B-page 84
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
FIGURE 12-12: TYPICAL IDD vs. FREQUENCY (EXTERNAL CLOCK, 25C)
10
PIC16C5X
1.0 IDD (mA) 0.1
7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5
0.01 10k
100k
1M External Clock Frequency (Hz)
10M
100M
FIGURE 12-13: MAXIMUM IDD vs. FREQUENCY (EXTERNAL CLOCK, -40C TO +85C)
10
1.0
IDD (mA)
0.1
7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5
0.01 10k
100k
1M External Clock Frequency (Hz)
10M
100M
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 85
PIC16C5X
10
PIC16C54/55/56/57
FIGURE 12-14: MAXIMUM IDD vs. FREQUENCY (EXTERNAL CLOCK -55C TO +125C)
1.0
IDD (mA)
0.1
7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5
0.01 10k
100k
1M External Clock Frequency (Hz)
10M
100M
FIGURE 12-15: WDT TIMER TIME-OUT PERIOD vs. VDD
50 45 40 35 WDT period (ms) 30
Max +85C
FIGURE 12-16: TRANSCONDUCTANCE (gm) OF HS OSCILLATOR vs. VDD
9000 8000
Max -40C
7000 6000 5000
Typ +25C
25
Max +70C
gm (A/V)
4000 3000
20
Typ +25C
Min +85C
15
MIn 0C
2000 100
MIn -40C
10 5 2 3 4 5 VDD (Volts) 6 7
0 2 3 4 5 VDD (Volts) 6 7
DS30453B-page 86
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54/55/56/57
FIGURE 12-17: TRANSCONDUCTANCE (gm) OF LP OSCILLATOR vs. VDD
45 40
Max -40C
PIC16C5X
FIGURE 12-19: TRANSCONDUCTANCE (gm) OF XT OSCILLATOR vs. VDD
2500
Max -40C
35 30
2000
1500 gm (A/V) 25 gm (A/V)
Typ +25C Typ +25C
20 15
1000
Min +85C
10
Min +85C
500
5 0 0 2 3 4 5 VDD (Volts) 6 7 2 3 4 5 6 7 VDD (Volts)
FIGURE 12-18: IOH vs. VOH, VDD = 3 V
0
FIGURE 12-20: IOH vs. VOH, VDD = 5 V
0
Min +85C
-5
Min +85C
-10
IOH (mA)
IOH (mA)
-10
Typ +25C
-20
Typ +25C
-15
Max -40C
-30
Max -40C
-20
-25 0 0.5 1.0 1.5 2.0 2.5 3.0 VOH (Volts)
-40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VOH (Volts)
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 87
PIC16C5X
FIGURE 12-21: IOL vs. VOL, VDD = 3 V
45 40 35 30 25
Typ +25C Max -40C
PIC16C54/55/56/57
FIGURE 12-22: IOL vs. VOL, VDD = 5 V
90 80 70 60
Typ +25C Max -40C
IOL (mA)
IOL (mA)
50
20 15
Min +85C
40
Min +85C
30 20 10 0 0.0
10 5 0 0.0
0.5
1.0 1.5 2.0 VOL (Volts)
2.5
3.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
TABLE 12-2:
INPUT CAPACITANCE FOR PIC16C54/56
Typical Capacitance (pF)
TABLE 12-3:
INPUT CAPACITANCE FOR PIC16C55/57
Typical Capacitance (pF)
Pin 18L PDIP RA port RB port MCLR OSC1 OSC2/CLKOUT T0CKI 5.0 5.0 17.0 4.0 4.3 3.2 18L SOIC 4.3 4.3 17.0 3.5 3.5 2.8
Pin
28L PDIP (600 mil) 5.2 5.6 5.0 17.0 6.6 4.6 4.5
28L SOIC 4.8 4.7 4.1 17.0 3.5 3.5 3.5
RA port RB port RC port MCLR OSC1 OSC2/CLKOUT T0CKI
All capacitance values are typical at 25C. A part-to-part variation of 25% (three standard deviations) should be taken into account.
All capacitance values are typical at 25C. A part-to-part variation of 25% (three standard deviations) should be taken into account.
DS30453B-page 88
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
13.0 ELECTRICAL CHARACTERISTICS - PIC16CR54A
PIC16C5X
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -55C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on MCLR with respect to VSS(2) ............................................................................................................0 to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total Power Dissipation(1) ....................................................................................................................................800 mW Max. Current out of VSS pin...................................................................................................................................150 mA Max. Current into VDD pin........................................................................................................................................50 mA Max. Current into an input pin (T0CKI only).....................................................................................................................500 A Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (V0 < 0 or V0 > VDD) .............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................20 mA Max. Output Current sourced by a single I/O port (PORTA or B)............................................................................40 mA Max. Output Current sunk by a single I/O port (PORTA or B) .................................................................................50 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL) Note 2: Voltage spikes below Vss at the MCLR pin, inducing currents greater than 80 mA may cause latch-up. Thus, a series resistor of 50 to 100 should be used when applying a low level to the MCLR pin rather than pulling this pin directly to Vss.
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 89
PIC16C5X
TABLE 13-1:
OSC
RC
PIC16CR54A
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16CR54A-10 PIC16CR54A-20 PIC16LCR54A-04
PIC16CR54A-04
VDD: 2.5 V to 6.25 V IDD: 3.6 mA max at 6.0 V IPD: 6.0 A max at 2.5 V, WDT dis Freq: 4 MHz max VDD: 2.5 V to 6.25 V IDD: 3.6 mA max at 6.0 V IPD: 6.0 A max at 2.5 V, WDT dis Freq: 4.0 MHz max
N/A
N/A
N/A
XT
N/A
N/A
N/A
HS N/A
VDD: 4.5 V to 5.5 V IDD: 10 mA max at 5.5 V IPD: 6.0 A max at 2.5 V, WDT dis Freq: 10 MHz max
VDD: 4.5 V to 5.5 V IDD: 10 mA max at 5.5 V IPD: 6.0 A max at 2.5 V, WDT dis Freq: 20 MHz max
N/A
LP N/A N/A N/A
VDD: 2.0 V to 6.25 V IDD: 20 A max at 32 kHz, 2.0 V IPD: 6.0 A max at 2.5 V, WDT dis Freq: 200 kHz max
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 90
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
13.1 DC Characteristics: PIC16CR54A-04, 10, 20 (Commercial) PIC16CR54A-04I, 10I, 20I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RC and XT options HS option RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) RC(4) and XT options Sym VDD 2.5 4.5 VDR VPOR SVDD IDD 2.0 0.8 90 4.8 9.0 IPD 1.0 2.0 3.0 5.0 Power-Down Current(5) Industrial IPD 1.0 2.0 3.0 3.0 5.0 * These parameters are characterized but not tested. 8.0 10* 20* 18 45 A A A A A 6.0 8.0* 15 25 A A A A 3.6 1.8 350 10 20 mA mA A mA mA -- -- 0.05* 1.5* VSS -- 6.25 5.5 -- -- -- V V V V V/ms
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 6.0V FOSC = 4.0 MHz, VDD = 3.0V FOSC = 200 kHz, VDD = 2.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V
HS option Power-Down Current(5) Commercial
VDD = 2.5V, WDT disabled VDD = 4.0V, WDT disabled VDD = 6.0V, WDT disabled VDD = 6.0V, WDT enabled
VDD = 2.5V, WDT disabled VDD = 4.0V, WDT disabled VDD = 4.0V, WDT enabled VDD = 6.0V, WDT disabled VDD = 6.0V, WDT enabled
Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 91
PIC16C5X
13.2 DC Characteristics: PIC16CR54A-04E, 10E, 20E (Extended)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RC, XT and LP options HS options RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) RC(4) and XT options HS option Power-Down Current(5) Sym VDD 3.25 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- * These parameters are characterized but not tested. 5.0 0.8 22 18 A A 1.8 4.8 9.0 3.3 10 20 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 6.0 5.5 -- -- -- V V V V V/ms
PIC16CR54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 16 MHz, VDD = 5.5V VDD = 3.25V, WDT enabled VDD = 3.25V, WDT disabled
Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 92
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
13.3 DC Characteristics: PIC16LCR54A-04 (Commercial) PIC16LCR54A-04I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) Sym VDD VDR VPOR SVDD IDD
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min 2.0 -- -- 0.05* -- 10 20 70 A A FOSC = 32 kHz, VDD = 2.0V FOSC = 32 kHz, VDD = 6.0V Typ(1) -- 1.5* VSS -- Max 6.25 -- -- -- Units V V V V/ms LP Option Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset Conditions
Power-Down Current(5) Commercial
IPD -- -- -- -- 1.0 2.0 3.0 5.0 6.0 8.0* 15 25 A A A A VDD = 2.5V, WDT disabled VDD = 4.0V, WDT disabled VDD = 6.0V, WDT disabled VDD = 6.0V, WDT enabled
Power-Down Current(5) Industrial
IPD -- -- -- -- -- 1.0 2.0 3.0 3.0 5.0 8.0 10* 20* 18 45 A A A A A VDD = 2.5V, WDT disabled VDD = 4.0V, WDT disabled VDD = 4.0V, WDT enabled VDD = 6.0V, WDT disabled VDD = 6.0V, WDT enabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 93
PIC16C5X
13.4
PIC16CR54A
DC Characteristics: PIC16CR54A-04, 10, 20, PIC16LCR54A-04 (Commercial) PIC16CR54A-04I, 10I, 20I, PIC16LCR54A-04I (Industrial)
DC Characteristics All Pins Except Power Supply Pins Characteristic Sym VIL VSS VSS VSS VSS VSS VIH 2.0 0.6 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.85 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD -0.5 VDD -0.5 -- -- -- -- V V IOH = -4.0 mA, VDD = 6.0V IOH = -0.8 mA, VDD = 6.0V, RC option only -- -- 0.5 0.5 V V IOL = 10 mA, VDD = 6.0V IOL = 1.9 mA, VDD = 6.0V, RC option only 0.5 0.5 0.5 +5.0 +3.0 +3.0 +1.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD -- V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options VDD = 3.0V to 5.5V(5) Full VDD range(5) RC option only(4) XT, HS and LP options -- -- -- -- -- 0.2 0.15 0.15 0.15 0.15 VDD VDD VDD VDD VDD V V V V V Pin at hi-impedance RC option only(4) XT, HS and LP options Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 13.1 and Section 13.3. Min Typ(1) Max Units Conditions
Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage(3) I/O ports OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
DS30453B-page 94
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
13.5 DC Characteristics: PIC16CR54A-04E, 10E, 20E (Extended)
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports Sym VIL Vss Vss Vss Vss Vss VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD -0.7 VDD -0.7 -- -- -- -- V V -- -- 0.6 0.6 V V 0.5 0.5 0.5 +5.0 +3.0 +3.0 0.5 +1.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V -- -- -- -- -- 0.15 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD V V V V V
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C Operating Voltage VDD range is described in Section 13.2. Min Typ(1) Max Units Conditions Pin at hi-impedance RC option only(4) XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5V RC option only(4) XT, HS and LP options
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage (3) I/O ports OSC2/CLKOUT
For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 95
PIC16C5X
13.6 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F pp 2 ck cy drt io S F H I L Fall High Invalid (Hi-impedance) Low P R V Z Period Rise Valid Hi-impedance to CLKOUT cycle time device reset timer I/O port mc osc os t0 wdt MCLR oscillator OSC1 T0CKI watchdog timer Frequency T Time Lowercase subscripts (pp) and their meanings:
PIC16CR54A
Uppercase letters and their meanings:
FIGURE 13-1: LOAD CONDITIONS
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP options when external clock is used to drive OSC1
DS30453B-page 96
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
13.7 Timing Diagrams and Specifications
PIC16C5X
FIGURE 13-2: EXTERNAL CLOCK TIMING - PIC16CR54A
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 13-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 13.1, Section 13.2 and Section 13.3.
Characteristic External CLKIN Frequency(2) Min DC DC DC DC DC Oscillator Frequency(2) DC 0.1 4.0 4.0 4.0 5.0 Typ(1) -- -- -- -- -- -- -- -- -- -- -- Max 4.0 4.0 10 20 200 4.0 4.0 4.0 10 20 200 Units MHz MHz MHz MHz kHz MHz MHz MHz MHz MHz kHz Conditions XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 97
PIC16C5X
TABLE 13-2:
AC Characteristics
PIC16CR54A
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR54A (CON'T)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 13.1, Section 13.2 and Section 13.3.
Characteristic External CLKIN Period(2) Min 250 250 100 50 5.0 Oscillator Period(2) 250 250 250 100 50 5.0 Instruction Cycle Time(3) Typ(1) -- -- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- -- -- -- Max -- -- -- -- -- -- 10,000 250 250 250 200 -- -- -- -- 25* 25* 50* Units ns ns ns ns s ns ns ns ns ns s -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
Parameter No. 1
Sym TOSC
2 3
TCY
-- 50* 20* 2.0*
TosL, TosH Clock in (OSC1) Low or High Time
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
-- -- --
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 98
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
FIGURE 13-3: CLKOUT AND I/O TIMING - PIC16CR54A
Q4 OSC1
10
PIC16C5X
Q1 Q2 Q3
11
CLKOUT
13 14 19 18 12 16
I/O Pin (input)
17 15 New Value 20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
I/O Pin (output)
Old Value
TABLE 13-3:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 13.1, Section 13.2 and Section 13.3.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5.0 5.0 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 13-1 for loading conditions.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 99
PIC16C5X
PIC16CR54A
FIGURE 13-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16CR54A
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 13-4:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR54A
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 13.1, Section 13.2 and Section 13.3. Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 1.0* 7.0* 7.0* --
Typ(1) -- 18* 18* --
Max -- 40* 30* 1.0*
Units s ms ms s
Conditions VDD = 5.0V VDD = 5.0V (Commercial) VDD = 5.0V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 100
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR54A
FIGURE 13-5: TIMER0 CLOCK TIMINGS - PIC16CR54A
PIC16C5X
T0CKI 40 41
42
TABLE 13-5:
TIMER0 CLOCK REQUIREMENTS - PIC16CR54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 13.1, Section 13.2 and Section 13.3. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 101
PIC16C5X
NOTES:
PIC16CR54A
DS30453B-page 102
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
14.0 ELECTRICAL CHARACTERISTICS - PIC16C54A
PIC16C5X
Absolute Maximum Ratings
Ambient temperature under bias............................................................................................................ -55C to +125C Storage temperature ............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total power dissipation(1) .....................................................................................................................................800 mW Max. current out of VSS pin....................................................................................................................................150 mA Max. current into VDD pin ......................................................................................................................................100 mA Max. current into an input pin (T0CKI only)......................................................................................................................500 A Input clamp current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................................................................20 mA Max. output current sunk by any I/O pin..................................................................................................................25 mA Max. output current sourced by any I/O pin ............................................................................................................20 mA Max. output current sourced by a single I/O port (PORTA or B) .............................................................................50 mA Max. output current sunk by a single I/O port (PORTA or B)...................................................................................50 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 103
PIC16C5X
TABLE 14-1:
OSC
PIC16C54A
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16C54A-10
VDD: 3.0V to 6.25V IDD: 1.7 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD: 1.7 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 8.0 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 10 MHz max.
PIC16C54A-04
VDD: 3.0V to 6.25V IDD: 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4 MHz max. VDD: 3.0V to 6.25V IDD 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4 MHz max.
PIC16C54A-20
VDD: 3.0V to 6.25V IDD: 1.7 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD: 1.7 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 16 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 20 MHz max.
PIC16LC54A-04
VDD: 3.0V to 6.25V IDD: 0.5 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD: 0.5 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max.
RC
XT
HS
N/A
Do not use in HS mode
LP
VDD: 3.0V to 6.25V IDD: 14 A typ. at 32kHz, 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 200 kHz max.
Do not use in LP mode
Do not use in LP mode
VDD: 2.5V to 6.25V IDD: 27 A max. at 32kHz, 2.5V WDT dis IPD: 4.0 A max. at 2.5V WDT dis Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections. OSC PIC16C54A/JW
VDD: 3.0V to 6.25V IDD: 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 8 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 10 MHz max. VDD: 2.5V to 6.25V IDD: 27 A max. at 32kHz, 2.5V WDT dis IPD: 4.0 A max. at 2.5V WDT dis Freq: 200 kHz max.
PIC16LV54A-02
VDD: 2.0V to 3.8V IDD: 0.5 mA typ. at 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 2.0 MHz max. VDD: 2.0V to 3.8V IDD: 0.5 mA typ. at 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 2.0 MHz max.
RC
XT
HS
Do not use in HS mode
LP
VDD: 2.0V to 3.8V IDD: 27 A max. at 32kHz, 2.5V WDT dis IPD: 4.0 A max. at 2.5V WDT dis Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 104
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
14.1 DC Characteristics: PIC16C54A-04, 10, 20 (Commercial) PIC16C54A-04I, 10I, 20I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options HS option RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options HS option LP option, Commercial LP option, Industrial Power Down Current(5) Commercial Industrial IPD -- -- -- -- 4.0 0.25 5.0 0.3 12 4.0 14 5.0 A A A A Sym VDD 3.0 4.5 VDR VPOR SVDD IDD -- -- -- -- -- 1.8 2.4 4.5 14 17 2.4 8.0 16 29 37 mA mA mA A A -- -- 0.05* -- -- 1.5* VSS -- 6.25 5.5 -- -- -- V V V V
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset
V/ms See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 3.0V, WDT disabled FOSC = 32 kHz, VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 105
PIC16C5X
14.2 DC Characteristics: PIC16C54A-04E, 10E, 20E (Extended)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT and RC options HS option RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options HS option Power Down Current(5) XT and RC options HS option Sym VDD 3.5 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 5.0 0.8 4.0 0.25 22 18 22 18 A A A A 1.8 4.8 9.0 3.3 10 20 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 5.5 5.5 -- -- -- V V V V Device in SLEEP mode
PIC16C54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Min Typ(1) Max Units Conditions
See Section 7.4 for details on Power-on Reset
V/ms See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.5V, WDT enabled VDD = 3.5V, WDT disabled VDD = 3.5V, WDT enabled VDD = 3.5V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 106
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
14.3 DC Characteristics: PIC16LC54A-04 (Commercial) PIC16LC54A-04I (Industrial) PIC16LC54A-04E (Extended)
PIC16C5X
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options LP option, Commercial LP option, Industrial LP option, Extended Power Down Current(5) Commercial Industrial Extended Sym VDD
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Min 2.5 VDR VPOR SVDD IDD -- -- -- -- IPD -- -- -- -- -- -- 2.5 0.25 2.5 0.25 2.5 0.25 12 4.0 14 5.0 15 7.0 A A A A A A VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled 0.5 11 11 11 25 27 35 37 mA A A A FOSC = 4.0 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 2.5V WDT disabled FOSC = 32 kHz, VDD = 2.5V WDT disabled FOSC = 32 kHz, VDD = 2.5V WDT disabled -- -- 0.05* Typ(1) Max Units -- 1.5* VSS -- 6.25 -- -- -- V V V Device in SLEEP mode See Section 7.4 for details on Power-on Reset Conditions
V/ms See Section 7.4 for details on Power-on Reset
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 107
PIC16C5X
14.4 DC Characteristics: PIC16LV54A-02 (Commercial) PIC16LV54A-02 (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options LP option, Commercial LP option, Industrial Power Down Current(5)(6) Commercial Industrial Sym VDD 2.0 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 2.5 0.25 3.5 0.3 12 4.0 14 5.0 A A A A 0.5 11 14 -- 27 35 mA A A -- -- 0.05* -- 1.5* VSS -- 3.8 -- -- -- V V V Device in SLEEP mode
PIC16C54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -20C TA +85C (industrial) Min Typ(1) Max Units Conditions
See Section 7.4 for details on Power-on Reset
V/ms See Section 7.4 for details on Power-on Reset FOSC = 2.0 MHz, VDD = 3.0V FOSC = 32 kHz, VDD = 2.5V, WDT disabled FOSC = 32 kHz, VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. 6: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection, if the SLEEP mode is entered or during initial power-up.
DS30453B-page 108
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
14.5
PIC16C5X
DC Characteristics: PIC16C54A-04, 10, 20, PIC16LC54A-04, PIC16LV54A-02 (Commercial) PIC16C54A-04I, 10I, 20I, PIC16LC54A-04I, PIC16LV54A-02I (Industrial) PIC16C54A-04E, 10E, 20E (Extended)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV54A-02I) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1, Section 14.2 and Section 14.3. Sym VIL VSS VSS VSS VSS VSS VSS VIH 0.2 VDD+1V 2.0 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -- -5.0 -3.0 -3.0 VOL -- -- VOH VDD-0.7 VDD-0.7 -- -- -- -- V V IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only -- -- 0.6 0.6 V V IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only 0.5 -- -- 0.5 0.5 0.5 +1.0 -- +5.0 +3.0 +3.0 -- A -- A A A A 0.15VDD* -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD -- V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS +0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) RC option only(4) XT, HS and LP options -- -- -- -- -- -- 0.2 VDD 0.8VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD V V V V V Pin at hi-impedance 4.0V < VDD 5.5V(5) RC option only(4) XT, HS and LP options Min Typ(1) Max Units Conditions
DC Characteristics All Pins Except Power Supply Pins
Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage I/O ports(3) OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 109
PIC16C5X
14.6 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase subscripts (pp) and their meanings: pp 2 to ck CLKOUT cy cycle time drt device reset timer io I/O port Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low
PIC16C54A
T
Time
mc osc os t0 wdt
MCLR oscillator OSC1 T0CKI watchdog timer
P R V Z
Period Rise Valid Hi-impedance
FIGURE 14-1: LOAD CONDITIONS - PIC16C54A
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP options when external clock is used to drive OSC1
DS30453B-page 110
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
14.7 Timing Diagrams and Specifications
PIC16C5X
FIGURE 14-2: EXTERNAL CLOCK TIMING - PIC16C54A
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 14-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV54A-02I) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1, Section 14.2 and Section 14.3.
Characteristic External CLKIN Frequency(2) Min DC DC DC DC DC DC Oscillator Frequency(2) DC DC 0.1 0.1 4 4 4 5 Typ(1) -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 4.0 2.0 4.0 10 20 200 4.0 2.0 4.0 2.0 4.0 10 20 200 Units MHz MHz MHz MHz MHz kHz MHz MHz MHz MHz MHz MHz MHz kHz Conditions XT osc mode XT osc mode (PIC16LV54A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode RC osc mode (PIC16LV54A) XT osc mode XT osc mode (PIC16LV54A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 111
PIC16C5X
TABLE 14-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54A (CON'T)
AC Characteristics
PIC16C54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV54A-02I) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1, Section 14.2 and Section 14.3.
Characteristic External CLKIN Period(2) Min 250 500 250 100 50 5.0 Oscillator Period(2) 250 500 250 500 250 100 50 5.0 Instruction Cycle Time(3) Typ(1) -- -- -- -- -- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- -- -- -- Max -- -- -- -- -- -- -- -- 10,000 -- 250 250 250 200 -- -- -- -- 25* 25* 50* Units ns ns ns ns ns s ns ns ns ns ns ns ns s -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions XT osc mode XT osc mode (PIC16LV54A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode RC osc mode (PIC16LV54A) XT osc mode XT osc mode (PIC16LV54A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
Parameter No. 1
Sym TOSC
2 3
TCY
-- 85* 20* 2.0*
TosL, TosH Clock in (OSC1) Low or High Time
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
-- -- --
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 112
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
FIGURE 14-3: CLKOUT AND I/O TIMING - PIC16C54A
Q4 OSC1 10 CLKOUT 13 I/O Pin (input) 17 I/O Pin (output) Old Value 15 18 Q1 Q2
PIC16C5X
Q3
11
14
19
12 16
New Value
20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 14-3:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV54A-02I) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1, Section 14.2 and Section 14.3.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5.0 5.0 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 14-1 for loading conditions.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 113
PIC16C5X
FIGURE 14-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16C54A
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
PIC16C54A
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 14-4:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C54A
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV54A-02I) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1, Section 14.2 and Section 14.3. Parameter No.
30
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 100* 1s 9.0* 9.0* -- --
Typ(1) -- -- 18* 18* -- --
Max -- -- 30* 30* 100* 1s
Units ns -- ms ms ns --
Conditions VDD = 5.0V VDD = 5.0V (PIC16LV54A only) VDD = 5.0V (Commercial) VDD = 5.0V (Commercial) (PIC16LV54A only)
31
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 114
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A
FIGURE 14-5: TIMER0 CLOCK TIMINGS - PIC16C54A
PIC16C5X
T0CKI 40 41
42
TABLE 14-5:
TIMER0 CLOCK REQUIREMENTS - PIC16C54A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV54A-02I) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1, Section 14.2 and Section 14.3. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 115
PIC16C5X
NOTES:
PIC16C54A
DS30453B-page 116
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
15.0 ELECTRICAL CHARACTERISTICS - PIC16CR57B
PIC16C5X
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -55C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total Power Dissipation(1) ....................................................................................................................................800 mW Max. Current out of VSS pin...................................................................................................................................150 mA Max. Current into VDD pin......................................................................................................................................100 mA Max. Current into an input pin (T0CKI only).....................................................................................................................500 A Input Clamp Current, IIK (VI < 0 or VI > VDD) ...................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................20 mA Max. Output Current sourced by a single I/O port (PORTA, B or C) .......................................................................50 mA Max. Output Current sunk by a single I/O port (PORTA, B or C) ............................................................................50 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 117
PIC16C5X
TABLE 15-1:
OSC
RC
PIC16CR57B
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16CR57B-10 PIC16CR57B-20 PIC16LCR57B-04
PIC16CR57B-04
VDD: 3.0V to 6.25V IDD: 2.5 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 4.0 MHz max VDD: 3.0V to 6.25V IDD: 2.5 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 4.0 MHz max
N/A
N/A
N/A
XT
N/A
N/A
N/A
HS N/A
VDD: 4.5V to 5.5V IDD: 10 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 10 MHz max
VDD: 4.5V to 5.5V IDD: 20 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 20 MHz max
N/A
LP N/A N/A N/A
VDD: 2.5V to 6.25V IDD: 32 A max at 32 kHz, 2.5V IPD: 4.0 A max at 2.5V, WDT dis Freq: 200 kHz max
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 118
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
15.1 DC Characteristics: PIC16CR57B-04, 10, 20 (Commercial) PIC16CR57B-04I, 10I, 20I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RC and XT options HS option RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) RC(4) and XT options HS option Power-Down Current(5) Commercial Industrial Sym VDD 3.0 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 4.0 0.25 4.0 0.25 12 4.0 14 5.0 A A A A 1.9 2.5 4.7 2.5 8.0 17 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 6.25 5.5 -- -- -- V V V V V/ms
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 4 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 119
PIC16C5X
15.2 DC Characteristics: PIC16CR57B-04E, 10E, 20E (Extended)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RC and XT options HS options RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) RC(4) and XT options HS option Power-Down Current(5) Sym VDD 3.25 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- * These parameters are characterized but not tested. 5.0 0.8 22 18 A A 1.9 4.8 9.0 3.3 10 20 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 6.0 5.5 -- -- -- V V V V V/ms
PIC16CR57B
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 4 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.25V, WDT enabled VDD = 3.25V, WDT disabled
Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 120
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
15.3 DC Characteristics: PIC16LCR57B-04 (Commercial) PIC16LCR57B-04I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) Commercial Industrial Power-Down Current(5) Commercial Industrial * These parameters are characterized but not tested. IPD 3.5 0.2 3.5 0.2 12 4.0 14 5.0 A A A A Sym VDD VDR VPOR SVDD IDD -- -- 12 15 28 37 A A
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min 2.5 -- -- 0.05* Typ(1) -- 1.5* VSS -- Max 6.25 -- -- -- Units V V V V/ms LP option Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 32 kHz, VDD = 2.5V, WDT disabled FOSC = 32 kHz, VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled Conditions
Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 121
PIC16C5X
15.4
PIC16CR57B
DC Characteristics: PIC16CR57B-04, 10, 20, PIC16LCR57B-04 (Commercial) PIC16CR57B-04I, 10I, 20I, PIC16LCR57B-04I (Industrial)
DC Characteristics All Pins Except Power Supply Pins Characteristic Sym VIL VSS VSS VSS VSS VSS VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD -0.7 VDD -0.7 -- -- -- -- V V IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only -- -- 0.6 0.6 V V IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only -- 0.5 0.5 0.5 +1.0 -- +5.0 +3.0 +3.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5V RC option only(4) XT, HS and LP options -- -- -- -- -- 0.2 0.15 0.15 0.15 0.3 VDD VDD VDD VDD VDD V V V V V Pin at hi-impedance RC option only(4) XT, HS and LP options Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 15.1 and Section 15.3. Min Typ(1) Max Units Conditions
Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage(3) I/O ports OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
DS30453B-page 122
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
15.5 DC Characteristics: PIC16CR57B-04E, 10E, 20E (Extended)
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports Sym VIL VSS VSS VSS VSS VSS VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD -0.7 VDD -0.7 -- -- -- -- V V -- -- 0.6 0.6 V V -- -- 0.5 0.5 0.5 +1.0 -- +5.0 +3.0 +3.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V -- -- -- -- -- 0.2 0.15 0.15 0.15 0.3 VDD VDD VDD VDD VDD V V V V V
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C Operating Voltage VDD range is described in Section 15.2. Min Typ(1) Max Units Conditions Pin at hi-impedance RC option only(4) XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5V RC option only(4) XT, HS and LP options
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage(3) I/O ports OSC2/CLKOUT
For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25 V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 123
PIC16C5X
15.6 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F pp 2 ck cy drt io S F H I L Fall High Invalid (Hi-impedance) Low P R V Z Period Rise Valid Hi-impedance to CLKOUT cycle time device reset timer I/O port mc osc os t0 wdt MCLR oscillator OSC1 T0CKI watchdog timer Frequency T Time Lowercase subscripts (pp) and their meanings:
PIC16CR57B
Uppercase letters and their meanings:
FIGURE 15-1: LOAD CONDITIONS
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP options when external clock is used to drive OSC1
DS30453B-page 124
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
15.7 Timing Diagrams and Specifications
PIC16C5X
FIGURE 15-2: EXTERNAL CLOCK TIMING - PIC16CR57B
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 15-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR57B
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 15.1, Section 15.2 and Section 15.3.
Characteristic External CLKIN Frequency(2) Min DC DC DC DC DC Oscillator Frequency(2) DC 0.1 4.0 4.0 4.0 5.0 Typ(1) -- -- -- -- -- -- -- -- -- -- -- Max 4.0 4.0 10 20 200 4.0 4.0 4.0 10 20 200 Units MHz MHz MHz MHz kHz MHz MHz MHz MHz MHz kHz Conditions XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 125
PIC16C5X
TABLE 15-2:
AC Characteristics
PIC16CR57B
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR57B (CON'T)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 15.1, Section 15.2 and Section 15.3.
Characteristic External CLKIN Period(2) Min 250 250 100 50 5.0 Oscillator Period(2) 250 250 250 100 50 5.0 Instruction Cycle Time(3) Typ(1) -- -- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- -- -- -- Max -- -- -- -- -- -- 10,000 250 250 250 200 -- -- -- -- 25* 25* 50* Units ns ns ns ns s ns ns ns ns ns s -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
Parameter No. 1
Sym TOSC
2 3
TCY
-- 85* 20* 2.0*
TosL, TosH Clock in (OSC1) Low or High Time
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
-- -- --
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 126
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
FIGURE 15-3: CLKOUT AND I/O TIMING - PIC16CR57B
Q4 OSC1
10
PIC16C5X
Q1 Q2 Q3
11
CLKOUT
13 14 19 18 12 16
I/O Pin (input)
17 15 New Value 20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
I/O Pin (output)
Old Value
TABLE 15-3:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR57B
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 15.1, Section 15.2 and Section 15.3.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5.0 5.0 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 15-1 for loading conditions.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 127
PIC16C5X
PIC16CR57B
FIGURE 15-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16CR57B
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 15-4:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR57B
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 15.1, Section 15.2 and Section 15.3. Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 1.0* 9.0* 9.0* --
Typ(1) -- 18* 18* --
Max -- 30* 30* 1.0*
Units s ms ms s
Conditions VDD = 5.0V VDD = 5.0V (Commercial) VDD = 5.0V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 128
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR57B
FIGURE 15-5: TIMER0 CLOCK TIMINGS - PIC16CR57B
PIC16C5X
T0CKI 40 41
42
TABLE 15-5:
TIMER0 CLOCK REQUIREMENTS - PIC16CR57B
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 15.1, Section 15.2 and Section 15.3. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 129
PIC16C5X
NOTES:
PIC16CR57B
DS30453B-page 130
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
16.0 ELECTRICAL CHARACTERISTICS - PIC16C58A
PIC16C5X
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -55C to +125C Storage Temperature............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total Power Dissipation(1) ....................................................................................................................................800 mW Max. Current out of VSS pin...................................................................................................................................150 mA Max. Current into VDD pin......................................................................................................................................100 mA Max. Current into an input pin (T0CKI only).....................................................................................................................500 A Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................20 mA Max. Output Current sourced by a single I/O port (PORTA or B)............................................................................50 mA Max. Output Current sunk by a single I/O port (PORTA or B) .................................................................................50 mA Note 1: Power Dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 131
PIC16C5X
TABLE 16-1:
OSC
PIC16C58A
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16C58A-10
VDD: 3.0V to 6.25V IDD: 1.8 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD: 1.8 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 8.0 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 10 MHz max.
PIC16C58A-04
VDD: 3.0V to 6.25V IDD: 2.5 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD 2.5 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max.
PIC16C58A-20
VDD: 3.0V to 6.25V IDD: 1.8 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD: 1.8 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 17 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 20 MHz max.
PIC16LC58A-04
VDD: 3.0V to 6.25V IDD: 0.5 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD: 0.5 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max.
RC
XT
HS
N/A
N/A
LP
VDD: 3.0V to 6.25V IDD: 15 A typ. at 32kHz, 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 200 kHz max.
N/A
N/A
VDD: 2.5V to 6.25V IDD: 28 A max. at 32kHz, 2.5V WDT dis IPD: 4.0 A max. at 2.5V WDT dis Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections. OSC PIC16C58A/JW
VDD: 3.0V to 6.25V IDD: 2.5 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 6.25V IDD 2.5 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 17 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 20 MHz max. VDD: 2.5V to 6.25V IDD: 28 A max. at 32kHz, 2.5V WDT dis IPD: 4.0 A max. at 2.5V WDT dis Freq: 200 kHz max.
PIC16LV58A-02
VDD: 2.0V to 3.8V IDD: 0.5 mA typ. at 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 2.0 MHz max. VDD: 2.0V to 3.8V IDD: 0.5 mA typ. at 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 2.0 MHz max.
RC
XT
HS
N/A
LP
VDD: 2.0V to 3.8V IDD: 27 A max. at 32kHz, 2.5V WDT dis IPD: 4.0 A max. at 2.5V WDT dis Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 132
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
16.1 DC Characteristics: PIC16C58A-04, 10, 20 (Commercial) PIC16C58A-04I, 10I, 20I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options HS option RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options HS option LP option, Commercial LP option, Industrial Power Down Current(5) Commercial Industrial IPD -- -- -- -- 4.0 0.25 5.0 0.3 12 4.0 14 5.0 A A A A Sym VDD 3.0 4.5 VDR VPOR SVDD IDD -- -- -- -- -- 1.9 2.5 4.7 15 18 2.5 8.0 17 31 39 mA mA mA A A -- -- 0.05* -- -- 1.5* VSS -- 6.25 5.5 -- -- -- V V V V
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset
V/ms See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 3.0V, WDT disabled FOSC = 32 kHz, VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 133
PIC16C5X
16.2 DC Characteristics: PIC16C58A-04E, 10E, 20E (Extended)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT and RC options HS option RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options HS option Power Down Current(5) XT and RC options HS option Sym VDD 3.5 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 5.0 0.8 4.0 0.25 22 18 22 18 A A A A 1.9 4.8 9.0 3.3 10 20 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 5.5 5.5 -- -- -- V V V V Device in SLEEP mode
PIC16C58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Min Typ(1) Max Units Conditions
See Section 7.4 for details on Power-on Reset
V/ms See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.5V, WDT enabled VDD = 3.5V, WDT disabled VDD = 3.5V, WDT enabled VDD = 3.5V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 134
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
16.3 DC Characteristics: PIC16LC58A-04 (Commercial) PIC16LC58A-04I (Industrial) PIC16LC58A-04 (Extended)
PIC16C5X
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options LP option, Commercial LP option, Industrial LP option, Extended Power Down Current(5) Commercial Industrial Extended Sym VDD
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Min 2.5 VDR VPOR SVDD IDD -- -- -- -- IPD -- -- -- -- -- -- 2.5 0.25 2.5 0.25 2.5 0.25 12 4.0 14 5.0 15 7.0 A A A A A A VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled 0.5 12 12 12 2.5 27 35 37 mA A A A FOSC = 4.0 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 2.5V WDT disabled FOSC = 32 kHz, VDD = 2.5V WDT disabled FOSC = 32 kHz, VDD = 2.5V WDT disabled -- -- 0.05* Typ(1) Max Units -- 1.5* VSS -- 6.25 -- -- -- V V V Device in SLEEP mode See Section 7.4 for details on Power-on Reset Conditions
V/ms See Section 7.4 for details on Power-on Reset
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 135
PIC16C5X
16.4 DC Characteristics: PIC16LV58A-02 (Commercial) PIC16LV58A-02 (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options LP option, Commercial LP option, Industrial Power Down Current(5)(6) Commercial Industrial Sym VDD 2.0 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 2.5 0.25 2.5 0.25 12 4.0 14 5.0 A A A A 0.5 11 14 1.8 27 35 mA A A -- -- 0.05* -- 1.5* VSS -- 3.8 -- -- -- V V V Device in SLEEP mode
PIC16C58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -20C TA +85C (industrial) Min Typ(1) Max Units Conditions
See section on Power-On Reset for details
V/ms See section on Power-On Reset for details
FOSC = 2.0 MHz, VDD = 3.0V FOSC = 32 kHz, VDD = 2.5V, WDT disabled FOSC = 32 kHz, VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. 6: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection, if the SLEEP mode is entered or during initial power-up.
DS30453B-page 136
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
16.5
PIC16C5X
DC Characteristics: PIC16C58A-04, 10, 20, PIC16LC58A-04, PIC16LV58A-02 (Commercial) PIC16C58A-04I, 10I, 20I, PIC16LC58A-04I, PIC16LV58A-02I (Industrial) PIC16C58A-04E, 10E, 20E (Extended)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV58A) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 16.1, Section 16.2 and Section 16.3. Sym VIL VSS VSS VSS VSS VSS VIH 0.2 VDD+1V 2.0 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD-0.7 VDD-0.7 -- -- -- -- V V IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only -- -- 0.6 0.6 V V IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only 0.5 -- 0.5 0.5 0.5 +1.0 -- +5.0 +3.0 +3.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD -- V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS +0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) RC option only(4) XT, HS and LP options -- -- -- -- -- 0.2 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD V V V V V Pin at hi-impedance RC option only(4) XT, HS and LP options Min Typ(1) Max Units Conditions
DC Characteristics All Pins Except Power Supply Pins
Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage I/O ports(3) OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 137
PIC16C5X
16.6 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase subscripts (pp) and their meanings: pp 2 to ck CLKOUT cy cycle time drt device reset timer io I/O port Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low
PIC16C58A
T
Time
mc osc os t0 wdt
MCLR oscillator OSC1 T0CKI watchdog timer
P R V Z
Period Rise Valid Hi-impedance
FIGURE 16-1: LOAD CONDITIONS - PIC16C58A
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP options when external clock is used to drive OSC1
DS30453B-page 138
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
16.7 Timing Diagrams and Specifications
PIC16C5X
FIGURE 16-2: EXTERNAL CLOCK TIMING - PIC16C58A
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 16-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV58A) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 16.1, Section 16.2 and Section 16.3.
Characteristic External CLKIN Frequency(2) Min DC DC DC DC DC DC Oscillator Frequency(2) DC DC 0.1 0.1 4.0 4.0 4.0 5.0 Typ(1) -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 4.0 2.0 4.0 10 20 200 4.0 2.0 4.0 2.0 4.0 10 20 200 Units MHz MHz MHz MHz MHz kHz MHz MHz MHz MHz MHz MHz MHz kHz Conditions XT osc mode XT osc mode (PIC16LV58A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode RC osc mode (PIC16LV58A) XT osc mode XT osc mode (PIC16LV58A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 139
PIC16C5X
TABLE 16-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C58A (CON'T)
AC Characteristics
PIC16C58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV58A) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 16.1, Section 16.2 and Section 16.3.
Characteristic External CLKIN Period(2) Min 250 500 250 100 50 5.0 Oscillator Period(2) 250 500 250 500 250 100 50 5.0 Instruction Cycle Time(3) Typ(1) -- -- -- -- -- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- -- -- -- Max -- -- -- -- -- -- -- -- 10,000 -- 250 250 250 200 -- -- -- -- 25* 25* 50* Units ns ns ns ns ns s ns ns ns ns ns ns ns s -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions XT osc mode XT osc mode (PIC16LV58A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode RC osc mode (PIC16LV58A) XT osc mode XT osc mode (PIC16LV58A) HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
Parameter No. 1
Sym TOSC
2 3
TCY
-- 50* 20* 2.0*
TosL, TosH Clock in (OSC1) Low or High Time
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
-- -- --
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 140
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
FIGURE 16-3: CLKOUT AND I/O TIMING - PIC16C58A
Q4 OSC1 10 CLKOUT 13 I/O Pin (input) 17 I/O Pin (output) Old Value 15 18 Q1 Q2
PIC16C5X
Q3
11
14
19
12 16
New Value
20, 21 Note: Refer to Figure 16-1 for load conditions.
TABLE 16-3:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV58A) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 16.1, Section 16.2 and Section 16.3.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5 5 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 16-1 for loading conditions.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 141
PIC16C5X
FIGURE 16-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16C58A
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
PIC16C58A
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 16-4:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C58A
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV58A) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 16.1, Section 16.2 and Section 16.3. Parameter No.
30
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 100* 1s 9.0* 9.0* -- --
Typ(1) -- -- 18* 18* -- --
Max -- -- 30* 30* 100* 1s
Units ns -- ms ms ns --
Conditions VDD = 5.0V VDD = 5.0V (PIC16LV58A only) VDD = 5.0V (Commercial) VDD = 5.0V (Commercial) (PIC16LV58A only)
31
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 142
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C58A
FIGURE 16-5: TIMER0 CLOCK TIMINGS - PIC16C58A
PIC16C5X
T0CKI 40 41
42
TABLE 16-5:
TIMER0 CLOCK REQUIREMENTS - PIC16C58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -20C TA +85C (industrial - PIC16LV58A) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 16.1, Section 16.2 and Section 16.3. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 143
PIC16C5X
NOTES:
PIC16C58A
DS30453B-page 144
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
17.0 ELECTRICAL CHARACTERISTICS - PIC16CR58A
PIC16C5X
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -55C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total Power Dissipation(1) ....................................................................................................................................800 mW Max. Current out of VSS pin...................................................................................................................................150 mA Max. Current into VDD pin......................................................................................................................................100 mA Max. Current into an input pin (T0CKI only).....................................................................................................................500 A Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO> VDD)..............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................20 mA Max. Output Current sourced by a single I/O port (PORTA or B)............................................................................50 mA Max. Output Current sunk by a single I/O port (PORTA or B) .................................................................................50 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 145
PIC16C5X
TABLE 17-1:
OSC
RC
PIC16CR58A
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16CR58A-10 PIC16CR58A-20 PIC16LCR58A-04
PIC16CR58A-04
VDD: 3.0V to 6.25V IDD: 2.5 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 4.0 MHz max VDD: 3.0V to 6.25V IDD: 2.5 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 4.0 MHz max
N/A
N/A
N/A
XT
N/A
N/A
N/A
HS N/A
VDD: 4.5V to 5.5V IDD: 8.0 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 10 MHz max
VDD: 4.5V to 5.5V IDD: 17 mA max at 5.5V IPD: 4.0 A max at 3.0V, WDT dis Freq: 20 MHz max
N/A
LP N/A N/A N/A
VDD: 2.5V to 6.25V IDD: 28 A max at 32 kHz, 2.5V IPD: 4.0 A max at 2.5V, WDT dis Freq: 200 kHz max
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 146
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
17.1 DC Characteristics: PIC16CR58A-04, 10, 20 (Commercial) PIC16CR58A-04I, 10I, 20I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RC and XT options HS option RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) RC(4) and XT options HS option Power-Down Current(5) Commercial Industrial Sym VDD 3.0 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 4.0 0.25 4.0 0.25 12 4.0 14 5.0 A A A A 1.9 2.5 4.7 2.5 8.0 17 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 6.25 5.5 -- -- -- V V V V V/ms
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 147
PIC16C5X
17.2 DC Characteristics: PIC16CR58A-04E, 10E, 20E (Extended)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RC and XT options HS options RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) RC(4) and XT options HS option Power-Down Current(5) Sym VDD 3.25 4.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- * These parameters are characterized but not tested. 5.0 0.8 22 18 A A 1.9 4.8 9.0 3.3 10 20 mA mA mA -- -- 0.05* -- -- 1.5* VSS -- 6.0 5.5 -- -- -- V V V V V/ms
PIC16CR58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Min Typ(1) Max Units Conditions
Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 4.0 MHz, VDD = 5.5V FOSC = 10 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.25V, WDT enabled VDD = 3.25V, WDT disabled
Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 148
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
17.3 DC Characteristics: PIC16LCR58A-04 (Commercial) PIC16LCR58A-04I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) Commercial Industrial Power-Down Current(5) Commercial Industrial IPD -- -- -- -- 3.5 0.2 3.5 0.2 12 4.0 14 5.0 A A A A Sym VDD VDR VPOR SVDD IDD -- -- 12 15 28 37 A A
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min 2.5 -- -- 0.05* Typ(1) -- 1.5* VSS -- Max 6.25 -- -- -- Units V V V V/ms LP option Device in SLEEP mode See Section 7.4 for details on Power-on Reset See Section 7.4 for details on Power-on Reset FOSC = 32 kHz, VDD = 2.5V, WDT disabled FOSC = 32 kHz, VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled Conditions
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 149
PIC16C5X
17.4
PIC16CR58A
DC Characteristics: PIC16CR58A-04, 10, 20, PIC16LCR58A-04 (Commercial) PIC16CR58A-04I, 10I, 20I, PIC16LCR58A-04I (Industrial)
DC Characteristics All Pins Except Power Supply Pins Characteristic Sym VIL VSS VSS VSS VSS VSS VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD -0.7 VDD -0.7 -- -- -- -- V V IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only -- -- 0.6 0.6 V V IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only -- -- 0.5 0.5 0.5 +1.0 -- +5.0 +3.0 +3.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5V RC option only(4) XT, HS and LP options -- -- -- -- -- 0.2 0.15 0.15 0.15 0.3 VDD VDD VDD VDD VDD V V V V V Pin at hi-impedance RC option only(4) XT, HS and LP options Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating Voltage VDD range is described in Section 17.1 and Section 17.3. Min Typ(1) Max Units Conditions
Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage(3) I/O ports OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
DS30453B-page 150
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
17.5 DC Characteristics: PIC16CR58A-04E, 10E, 20E (Extended)
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports Sym VIL VSS VSS VSS VSS VSS VIH 0.45 VDD 2.0 0.36 VDD 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD -0.7 VDD -0.7 -- -- -- -- V V -- -- 0.6 0.6 V V -- -- 0.5 0.5 0.5 +1.0 -- +5.0 +3.0 +3.0 A A A A A 0.15VDD* -- -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD VDD -- V V V V V V V V -- -- -- -- -- 0.2 0.15 0.15 0.15 0.3 VDD VDD VDD VDD VDD V V V V V
PIC16C5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Operating Voltage VDD range is described in Section 17.2. Min Typ(1) Max Units Conditions Pin at hi-impedance RC option only(4) XT, HS and LP options For all VDD(5) 4.0V < VDD 5.5V(5) VDD > 5.5V RC option only(4) XT, HS and LP options
MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage(3) I/O ports OSC2/CLKOUT
For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode. 5: The user may use the better of the two specifications.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 151
PIC16C5X
17.6 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F pp 2 ck cy drt io S F H I L Fall High Invalid (Hi-impedance) Low P R V Z Period Rise Valid Hi-impedance to CLKOUT cycle time device reset timer I/O port mc osc os t0 wdt MCLR oscillator OSC1 T0CKI watchdog timer Frequency T Time Lowercase subscripts (pp) and their meanings:
PIC16CR58A
Uppercase letters and their meanings:
FIGURE 17-1: LOAD CONDITIONS - PIC16CR58A
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP options when external clock is used to drive OSC1
DS30453B-page 152
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
17.7 Timing Diagrams and Specifications
PIC16C5X
FIGURE 17-2: EXTERNAL CLOCK TIMING - PIC16CR58A
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 17-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 17.1, Section 17.2 and Section 17.3.
Characteristic External CLKIN Frequency(2) Min DC DC DC DC DC Oscillator Frequency(2) DC 0.1 4.0 4.0 4.0 5.0 Typ(1) -- -- -- -- -- -- -- -- -- -- -- Max 4.0 4.0 10 20 200 4.0 4.0 4.0 10 20 200 Units MHz MHz MHz MHz kHz MHz MHz MHz MHz MHz kHz Conditions XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 153
PIC16C5X
TABLE 17-2:
AC Characteristics
PIC16CR58A
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR58A (CON'T)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 17.1, Section 17.2 and Section 17.3.
Characteristic External CLKIN Period(2) Min 250 250 100 50 5.0 Oscillator Period(2) 250 250 250 100 50 5.0 Instruction Cycle Time(3) Typ(1) -- -- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- -- -- -- Max -- -- -- -- -- -- 10,000 250 250 250 200 -- -- -- -- 25* 25* 50* Units ns ns ns ns s ns ns ns ns ns s -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (10) HS osc mode (20) LP osc mode
Parameter No. 1
Sym TOSC
2 3
TCY
-- 85* 20* 2.0*
TosL, TosH Clock in (OSC1) Low or High Time
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
-- -- --
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 154
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
FIGURE 17-3: CLKOUT AND I/O TIMING - PIC16CR58A
Q4 OSC1
10
PIC16C5X
Q1 Q2 Q3
11
CLKOUT
13 14 19 18 12 16
I/O Pin (input)
17 15 New Value 20, 21 Note: Refer to Figure 17-1 for load conditions.
I/O Pin (output)
Old Value
TABLE 17-3:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 17.1, Section 17.2 and Section 17.3.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5.0 5.0 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 17-1 for loading conditions.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 155
PIC16C5X
PIC16CR58A
FIGURE 17-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16CR58A
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 17-4:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR58A
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 17.1, Section 17.2 and Section 17.3. Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 1.0* 9.0* 9.0* --
Typ(1) -- 18* 18* --
Max -- 30* 30* 1.0*
Units s ms ms s
Conditions VDD = 5.0V VDD = 5.0V (Commercial) VDD = 5.0V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 156
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16CR58A
FIGURE 17-5: TIMER0 CLOCK TIMINGS - PIC16CR58A
PIC16C5X
T0CKI 40 41
42
TABLE 17-5:
TIMER0 CLOCK REQUIREMENTS - PIC16CR58A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 17.1, Section 17.2 and Section 17.3. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 157
PIC16C5X
NOTES:
PIC16CR58A
DS30453B-page 158
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A/CR57B/C58A/CR58A
18.0
PIC16C5X
DC AND AC CHARACTERISTICS - PIC16C54A/CR57B/C58A/CR58A
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation.
FIGURE 18-1: TYPICAL RC OSCILLATOR FREQUENCY vs. TEMPERATURE
FOSC FOSC (25C) 1.10 1.08 1.06 1.04 1.02 1.00 0.98 VDD = 5.5 V 0.96 0.94 VDD = 3.5 V 0.92 0.90 0.88 0 10 20 25 30 T(C) 40 50 60 70 Rext 10 k Cext = 100 pF Frequency normalized to +25C
TABLE 18-1:
Cext 20 pF
RC OSCILLATOR FREQUENCIES
Rext 4.973 MHz 3.82 MHz 2.22 MHz 262.15 kHz 1.63 MHz 1.19 MHz 684.64 kHz 71.56 kHz 660 kHz 484.1 kHz 267.63 kHz 29.44 kHz Average Fosc @ 5 V, 25C 27% 21% 21% 31% 13% 13% 18% 25% 10% 14% 15% 19%
3.3 k 5k 10 k 100 k 100 pF 3.3 k 5k 10 k 100 k 300 pF 3.3 k 5.0 k 10 k 160 k The frequencies are measured on DIP packages.
The percentage variation indicated here is part-to-part variation due to normal process distribution. The variation indicated is 3 standard deviation from average value for VDD = 5 V.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 159
PIC16C5X
6.00
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-2: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 20 PF
R=3.3K
5.00 R=5.0K 4.00
Fosc(MHz)
3.00 R=10K
2.00
Cext=20pF, T=25C 1.00 R=100K 0.00 2.5 3 3.5 4 VDD(Volts) 4.5 5 5.5 6
FIGURE 18-3: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 100 PF
1.80 R=3.3K 1.60
1.40 R=5.0K 1.20
Fosc(MHz)
1.00
0.80 R=10K 0.60 Cext=100pF, T=25C 0.40
0.20 R=100K 0.00 2.5
3
3.5
4 VDD(Volts)
4.5
5
5.5
6
DS30453B-page 160
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A/CR57B/C58A/CR58A
PIC16C5X
FIGURE 18-4: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 300 PF
700.00 R=3.3K 600.00
500.00 R=5.0K
Fosc(KHz)
400.00
300.00 R=10K 200.00 Cext=300pF, T=25C 100.00 R=100K 0.00 2.5 3 3.5 4 VDD(Volts) 4.5 5 5.5 6
FIGURE 18-5: TYPICAL IPD vs. VDD, WATCHDOG DISABLED (25C)
2.5
2
1.5
Ipd(A) Ipd(nA)
1 0.5 0 2.5
3
3.5
4 VDD(Volts)
4.5
5
5.5
6
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 161
PIC16C5X
25.00
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-6: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (25C)
20.00
15.00
Ipd(uA)
10.00 5.00 0.00 2.5
3
3.5
4 VDD(Volts)
4.5
5
5.5
6
FIGURE 18-7: VTH (INPUT THRESHOLD VOLTAGE) OF I/O PINS vs. VDD
2.00 1.80 1.60 VTH (Volts) 1.40 1.20 1.00 0.80 0.60 2.5 3.0 3.5
to -40C Max ( 2 Typ (+
+85C
)
5C)
to 40C Min (-
+85C
)
4.0 4.5 VDD (Volts)
5.0
5.5
6.0
DS30453B-page 162
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-8: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) vs. VDD
4.5 4.0 3.5
PIC16C5X
VIH
VIH, VIL (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2.5 3.0 3.5 4.0 4.5 VDD (Volts)
ma
0C x (-4
typ
to +8
5C)
VIH
VIH
min
C +25 5C) to +8 40C (-
C to +85C) VIL max (-40 VIH typ +25C
VIL min (-40C to +8 5C)
5.0
5.5
6.0
Note: These input pins have Schmitt Trigger input buffers.
FIGURE 18-9: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP MODES) vs. VDD
3.4 3.2 3.0 2.8 2.6 VTH (Volts) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 2.5 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0
C) 85 to + C (-40 Max C) (+25 Typ
Min
C t (-40
o +8
) 5C
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 163
PIC16C5X
10000
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-10: TYPICAL IDD vs. FREQUENCY (WDT( DIS, RC MODE @ 20 PF, 25C) @p )
1000
Idd(uA)
100
5.0V 4.0V 3.0V
6.0V 5.5V 4.5V 3.5V 2.5V
10 100000
1000000 Freq(Hz)
10000000
FIGURE 18-11: MAXIMUM IDD vs. FREQUENCY (WDT( DIS, RC MODE @ 20 PF, -40C TO +85C) @ p)
10000
1000
Idd(uA)
100
6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V
10 100000
1000000 Freq(Hz)
10000000
DS30453B-page 164
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A/CR57B/C58A/CR58A
PIC16C5X
FIGURE 18-12: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE )@ 100 PF, 25C) ( @ p
10000
1000
Idd(uA)
100
6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V
10 10000
100000 Freq(Hz)
1000000
10000000
FIGURE 18-13: MAXIMUM IDD vs. FREQUENCY (WDT DIS, RC MODE @ 100 PF, -40C TO +85C)
10000
1000
Idd(uA)
100
6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V
10 10000
100000 Freq(Hz)
1000000
10000000
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 165
PIC16C5X
10000
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-14: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE )@ 300 PF, 25C) ( @ p
1000
Idd(uA)
100
6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V
10 10000
100000 Freq(Hz)
1000000
FIGURE 18-15: MAXIMUM IDD vs. FREQUENCY (WDT DIS, RC MODE @ 300 PF, -40C TO +85C)
10000
1000
Idd(uA)
100
6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V
10 10000
100000 Freq(Hz)
1000000
DS30453B-page 166
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-16: WDT TIMER TIME-OUT PERIOD vs. VDD
50 45 40 35 WDT period (ms) 30
Max +85C
PIC16C5X
TABLE 18-2: INPUT CAPACITANCE FOR PIC16C54A/C58A
Typical Capacitance (pF) Pin 18L PDIP RA port RB port MCLR OSC1 OSC2/CLKOUT T0CKI 5.0 5.0 17.0 4.0 4.3 3.2 18L SOIC 4.3 4.3 17.0 3.5 3.5 2.8
25
Max +70C
All capacitance values are typical at 25C. A part-to-part variation of 25% (three standard deviations) should be taken into account.
20
Typ +25C
15
MIn 0C
10
MIn -40C
5 2 3 4 5 VDD (Volts) 6 7
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 167
PIC16C5X
FIGURE 18-17: TRANSCONDUCTANCE (gm) OF HS OSCILLATOR vs. VDD
9000 8000
Max -40C
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-18: TRANSCONDUCTANCE (gm) OF LP OSCILLATOR vs. VDD
45 40
Max -40C
7000 6000 5000
Typ +25C
35 30 25
Typ +25C
gm (A/V)
4000 3000
Min +85C
gm (A/V)
20 15 10
Min +85C
2000 100 0 2 3 4 5 VDD (Volts) 6 7
5 0 2 3 4 5 VDD (Volts) 6 7
FIGURE 18-19: TRANSCONDUCTANCE (gm) OF XT OSCILLATOR vs. VDD
2500
Max -40C
2000
1500 gm (A/V)
Typ +25C
1000
Min +85C
500
0 2 3 4 5 6 7 VDD (Volts)
DS30453B-page 168
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-20: IOH vs. VOH, VDD = 3 V
0
PIC16C5X
FIGURE 18-22: IOL vs. VOL, VDD = 3 V
45 40
Max -40C
-5
Min +85C
35 30
IOH (mA)
-10
Typ +25C
IOL (mA)
25
Typ +25C
-15
Max -40C
20 15
Min +85C
-20 10 5 0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.0 0.5 1.0 1.5 2.0 VOL (Volts)
-25 VOH (Volts)
2.5
3.0
FIGURE 18-21: IOH vs. VOH, VDD = 5 V
0
FIGURE 18-23: IOL vs. VOL, VDD = 5 V
90 80
Max -40C
Min +85C
-10
70 60
IOH (mA)
Typ +25C
Typ +25C
IOL (mA)
-20
50
40
Min +85C
-30
Max -40C
30 20
-40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VOH (Volts)
10 0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 169
PIC16C5X
NOTES:
PIC16C54A/CR57B/C58A/CR58A
DS30453B-page 170
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B 19.0 ELECTRICAL CHARACTERISTICS PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR 58B
Absolute Maximum Ratings
Ambient temperature under bias............................................................................................................ -55C to +125C Storage temperature ............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on all other pins with respect to VSS ................................................................................. -0.6V to (VDD + 0.6V) Total power dissipation(1) .....................................................................................................................................800 mW Max. current out of VSS pin....................................................................................................................................150 mA Max. current into VDD pin ......................................................................................................................................100 mA Max. current into an input pin (T0CKI only)......................................................................................................................500 A Input clamp current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................................................................20 mA Max. output current sunk by any I/O pin..................................................................................................................25 mA Max. output current sourced by any I/O pin ............................................................................................................20 mA Max. output current sourced by a single I/O Port A ................................................................................................50 mA Max. output current sourced by a single I/O Port B ................................................................................................50 mA Max. output current sunk by a single I/OPort A.......................................................................................................50 mA Max. output current sunk by a single I/O Port B .....................................................................................................50 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 171
PIC16C5X
TABLE 19-1:
OSC
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16C5X-20
VDD: 3.0V to 5.5V IDD: 1.7 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 5.5V IDD: 1.7 mA typ. at 5.5V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 16 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 20 MHz max.
PIC16C5X-04
VDD: 3.0V to 5.5V IDD: 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4 MHz max. VDD: 3.0V to 5.5V IDD 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4 MHz max.
PIC16C5X/JW
VDD: 3.0V to 5.5V IDD: 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 3.0V to 5.5V IDD 2.4 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 4.0 MHz max. VDD: 4.5V to 5.5V IDD: 16 mA max. at 5.5V IPD: 4.0 A max. at 3.0V WDT dis Freq: 20 MHz max. VDD: 3.0V to 5.5V IDD: 32 A max. at 32kHz, 3.0V WDT dis IPD: 4.0 A max. at 3.0V WDT dis Freq: 200 kHz max.
RC
XT
HS
N/A
LP
VDD: 3.0V to 5.5V IDD: 14 A typ. at 32kHz, 3.0V IPD: 0.25 A typ. at 3.0V WDT dis Freq: 200 kHz max.
N/A
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended that the user select the device type from information in unshaded sections.
DS30453B-page 172
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B
19.1 DC Characteristics: PIC16C54B/C54C/C55A/C56A/C57C/C58B-04, 20 (Commercial) PIC16CR54B/CR54C/CR56A/CR57C/CR58B-04, 20 (Commercial) PIC16C54B/C54C/C55A/C56A/C57C/C58B-04I, 20I (Industrial) PIC16CR54B/CR/54C/CR56A/CR57C/CR58B-04I, 20I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT, RC and LP options HS option RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options HS option LP option, Commercial LP option, Industrial Power Down Current(5) Commercial Industrial Sym VDD 3.0 4.5 VDR VPOR SVDD IDD -- -- -- -- IPD -- -- -- -- 4.0 0.25 4.0 0.25 12 4.0 14 5.0 A A A A VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled VDD = 3.0V, WDT enabled VDD = 3.0V, WDT disabled 1.8 4.5 14 17 2.4 16 32 40 mA mA A A FOSC = 4.0 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 3.0V, WDT disabled FOSC = 32 kHz, VDD = 3.0V, WDT disabled -- -- 0.05* -- -- 1.5* VSS -- 5.5 5.5 -- -- -- V V V V Device in SLEEP mode See Section 7.4 for details on Power-on Reset Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
V/ms See Section 7.4 for details on Power-on Reset
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 173
PIC16C5X
19.2 DC Characteristics: PIC16C54B/C54C/C55A/C56A/C57C/C58B-04E, 20E (Extended) PIC16CR54B/CR54C/CR56A/CR57C/CR58B-04E, 20E (Extended)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT and RC options HS option RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options HS option Power Down Current(5) Sym VDD 3.0 4.5 VDR VPOR SVDD IDD -- -- IPD -- -- 1.8 9.0 0.3 4.5 3.3 20 18 22 mA mA A A FOSC = 4.0 MHz, VDD = 5.5V FOSC = 20 MHz, VDD = 5.5V VDD = 3.5V, WDT disabled VDD = 3.5V, WDT enabled -- -- 0.05* -- -- 1.5* VSS -- 5.5 5.5 -- -- -- V V V V Device in SLEEP mode See Section 7.4 for details on Power-on Reset Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) Min Typ(1) Max Units Conditions
V/ms See Section 7.4 for details on Power-on Reset
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS30453B-page 174
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B
19.3 DC Characteristics: PIC16LC5X-04, PIC16LCR5X-04 (Commercial) PIC16LC5X-04I, PIC16LCR5X-04I (Industrial)
DC Characteristics Power Supply Pins Characteristic Supply Voltage XT and RC options LP options RAM Data Retention Voltage(2) VDD start voltage to ensure Power-On Reset VDD rise rate to ensure Power-On Reset Supply Current(3) XT and RC(4) options LP option, Commercial LP option, Industrial Power Down Current(5) Commercial Industrial Sym VDD 3.0 2.5 VDR VPOR SVDD IDD -- -- -- IPD -- -- -- -- 2.5 0.25 2.5 0.25 10 2.0 12 3.0 A A A A VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled VDD = 2.5V, WDT enabled VDD = 2.5V, WDT disabled 0.5 11 14 2.4 27 35 mA A A FOSC = 4.0 MHz, VDD = 5.5V FOSC = 32 kHz, VDD = 2.5V WDT disabled FOSC = 32 kHz, VDD = 2.5V WDT disabled -- -- 0.05* -- -- 1.5* VSS -- 5.5 5.5 -- -- -- V V V V Device in SLEEP mode See Section 7.4 for details on Power-on Reset Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min Typ(1) Max Units Conditions
V/ms See Section 7.4 for details on Power-on Reset
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in k. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 175
PIC16C5X
19.4 DC Characteristics: PIC16C54B/C54C/C55A/C56A/C57C/C58B-04, 20, PIC16LCR5X-04 (Commercial)
PIC16CR54B/CR54C/CR56A/CR57C/CR58B-04, 20 (Commercial) PIC16CR5X-04I, 20I (Commercial) PIC16C54B/C54C/C55A/C56A/C57C/C58B-04I, 20I, PIC16LC5X-04I (Industrial) PIC16C54B/C54C/C55A/C56A/C57C/C58B-04E, 20E (Extended) Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 19.1, Section 19.2 and Section 19.3. Sym VIL VSS VSS VSS VSS VSS VIH 2.0 0.25 VDD+0.8V 0.85 VDD 0.85 VDD 0.85 VDD 0.7 VDD VHYS IIL -1.0 -5.0 -3.0 -3.0 VOL -- -- VOH VDD-0.7 VDD-0.7 -- -- -- -- V V IOH = -5.4 mA, VDD = 4.5V IOH = -1.0 mA, VDD = 4.5V, RC option only -- -- 0.6 0.6 V V IOL = 8.7 mA, VDD = 4.5V IOL = 1.6 mA, VDD = 4.5V, RC option only 0.5 -- 0.5 0.5 0.5 +1.0 +5.0 +3.0 +3.0 -- A A A A A 0.15VDD* -- -- -- -- -- -- -- VDD VDD VDD VDD VDD VDD -- V V V V V V V For VDD 5.5V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS +0.25V(2) VPIN = VDD(2) VSS VPIN VDD VSS VPIN VDD, XT, HS and LP options 4.5V < VDD 5.5V(5) otherwise RC option only(4) XT, HS and LP options -- -- -- -- -- 0.8 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.15 VDD 0.3 VDD V V V V V -- 4.5V DC Characteristics All Pins Except Power Supply Pins
Characteristic Input Low Voltage I/O Ports I/O Ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Input High Voltage I/O ports MCLR (Schmitt Trigger) T0CKI (Schmitt Trigger) OSC1 (Schmitt Trigger) OSC1 Hysteresis of Schmitt Trigger inputs Input Leakage Current(3) I/O ports MCLR T0CKI OSC1 Output Low Voltage I/O ports OSC2/CLKOUT Output High Voltage I/O ports(3) OSC2/CLKOUT
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is defined as coming out of the pin. 4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be driven with external clock in RC mode.
DS30453B-page 176
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B
19.5 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase subscripts (pp) and their meanings: pp 2 to ck CLKOUT cy cycle time drt device reset timer io I/O port Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low
T
Time
mc osc os t0 wdt
MCLR oscillator OSC1 T0CKI watchdog timer
P R V Z
Period Rise Valid Hi-impedance
FIGURE 19-1: LOAD CONDITIONS PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B, PIC16CR5X
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP options when external clock is used to drive OSC1
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 177
PIC16C5X
19.6 Timing Diagrams and Specifications FIGURE 19-2: EXTERNAL CLOCK TIMING - PIC16C5X, PIC16CR5X
Q4 OSC1 1 2 CLKOUT 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 19-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C5X, PIC16CR5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 19.1, Section 19.2 and Section 19.3.
Characteristic External CLKIN Frequency(2) Min DC DC DC DC Oscillator Frequency(2) DC 0.455 4 4 5 External CLKIN Period(2) Typ(1) -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 4.0 4.0 20 200 4.0 4.0 4.0 20 200 -- -- -- -- -- 2,200 250 250 200 Units MHz MHz MHz kHz MHz MHz MHz MHz kHz ns ns ns s ns ns ns ns s Conditions XT osc mode HS osc mode (04) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (20) LP osc mode XT osc mode HS osc mode (04) HS osc mode (20) LP osc mode RC osc mode XT osc mode HS osc mode (04) HS osc mode (20) LP osc mode
AC Characteristics
Parameter No.
Sym FOSC
1
TOSC
250 250 50 5.0
Oscillator Period(2)
250 250 250 50 5.0
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453B-page 178
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B
TABLE 19-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C5X, PIC16CR5X (CON'T)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 19.1, Section 19.2 and Section 19.3.
Characteristic Instruction Cycle Time(3) Min -- 50* 20* 2.0* 4 TosR, TosF Clock in (OSC1) Rise or Fall Time -- -- -- Typ(1) 4/FOSC -- -- -- -- -- -- Max -- -- -- -- 25* 25* 50* Units -- ns ns s ns ns ns XT oscillator HS oscillator LP oscillator XT oscillator HS oscillator LP oscillator Conditions
AC Characteristics
Parameter No. 2 3
Sym TCY
TosL, TosH Clock in (OSC1) Low or High Time
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 179
PIC16C5X
FIGURE 19-3: CLKOUT AND I/O TIMING - PIC16C5X, PIC16CR5X
Q4 OSC1 10 CLKOUT 13 I/O Pin (input) 17 I/O Pin (output) Old Value 15 New Value 18 12 16 11 Q1 Q2 Q3
14
19
20, 21 Note: Refer to Figure 19-1 for load conditions.
TABLE 19-3:
CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C5X, PIC16CR5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 19.1, Section 19.2 and Section 19.3.
Characteristic OSC1 to CLKOUT(2) OSC1 to CLKOUT(2) CLKOUT rise time(2) CLKOUT fall time(2) CLKOUT to Port out valid(2) Port in valid before CLKOUT(2) Port in hold after CLKOUT(2) OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- -- -- -- -- 0.25 TCY+30* 0* -- TBD TBD -- -- Typ(1) 15 15 5.0 5.0 -- -- -- -- -- -- 10 10 Max 30** 30** 15** 15** 40** -- -- 100* -- -- 25** 25** Units ns ns ns ns ns ns ns ns ns ns ns ns
AC Characteristics
Parameter No. 10 11 12 13 14 15 16 17 18 19 20 21
Sym TosH2ckL TosH2ckH TckR TckF TckL2ioV TioV2ckH TckH2ioI TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 3: See Figure 19-1 for loading conditions.
DS30453B-page 180
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B
FIGURE 19-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16C5X, PIC16CR5X
VDD MCLR 30 Internal POR 32 DRT Time-out Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 19-4:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C5X, PIC16CR5X
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 19.1, Section 19.2 and Section 19.3. Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period I/O Hi-impedance from MCLR Low
Min 1000* 9.0* 9.0* 100*
Typ(1) -- 18* 18* 300*
Max -- 30* 30* 1000*
Units ns ms ms ns
Conditions VDD = 5.0V VDD = 5.0V (Commercial) VDD = 5.0V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 181
PIC16C5X
FIGURE 19-5: TIMER0 CLOCK TIMINGS - PIC16C5X, PIC16CR5X
T0CKI 40 41
42
TABLE 19-5:
TIMER0 CLOCK REQUIREMENTS - PIC16C5X, PIC16CR5X
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 19.1, Section 19.2 and Section 19.3. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS30453B-page 182
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58
20.0 DC AND AC CHARACTERISTICS PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C /CR57C/C58B/CR58B
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation.
FIGURE 20-1: TYPICAL RC OSCILLATOR FREQUENCY vs. TEMPERATURE
FOSC FOSC (25C) 1.10 1.08 1.06 1.04 1.02 1.00 0.98 VDD = 5.5 V 0.96 0.94 VDD = 3.5 V 0.92 0.90 0.88 0 10 20 25 30 T(C) 40 50 60 70 Rext 10 k Cext = 100 pF Frequency normalized to +25C
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 183
PIC16C5X
TABLE 20-1:
Cext 20 pF
RC OSCILLATOR FREQUENCIES
Rext 4.973 MHz 3.82 MHz 2.22 MHz 262.15 kHz 1.63 MHz 1.19 MHz 684.64 kHz 71.56 kHz 660 kHz 484.1 kHz 267.63 kHz 29.44 kHz Average Fosc @ 5 V, 25C 27% 21% 21% 31% 13% 13% 18% 25% 10% 14% 15% 19%
3.3 k 5k 10 k 100 k 100 pF 3.3 k 5k 10 k 100 k 300 pF 3.3 k 5.0 k 10 k 160 k The frequencies are measured on DIP packages.
The percentage variation indicated here is part-to-part variation due to normal process distribution. The variation indicated is 3 standard deviation from average value for VDD = 5 V.
DS30453B-page 184
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58
FIGURE 20-2: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 20 PF
6.00 R=3.3K
5.00 R=5.0K 4.00
Fosc(MHz)
3.00 R=10K
2.00
Cext=20pF, T=25C 1.00 R=100K 0.00 2.5 3 3.5 4 VDD(Volts) 4.5 5 5.5 6
FIGURE 20-3: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 100 PF
1.80 R=3.3K 1.60
1.40 R=5.0K 1.20
Fosc(MHz)
1.00
0.80 R=10K 0.60 Cext=100pF, T=25C 0.40
0.20 R=100K 0.00 2.5
3
3.5
4 VDD(Volts)
4.5
5
5.5
6
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 185
PIC16C5X
FIGURE 20-4: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 300 PF
700.00 R=3.3K 600.00
500.00 R=5.0K
Fosc(KHz)
400.00
300.00 R=10K 200.00 Cext=300pF, T=25C 100.00 R=100K 0.00 2.5 3 3.5 4 VDD(Volts) 4.5 5 5.5 6
FIGURE 20-5: TYPICAL IPD vs. VDD, WATCHDOG DISABLED (25C)
2.5
2
1.5
Ipd(nA) Ipd(A)
1 0.5 0 2.5
3
3.5
4 VDD(Volts)
4.5
5
5.5
6
DS30453B-page 186
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58
FIGURE 20-6: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (25C)
25
20
15
IPD (uA)
10 5 0 2.5 3 3.5 4 4.5 5 5.5 6
VDD (Volts)
FIGURE 20-7: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (-40C, 85C)
35
30
25
20
IPD (uA)
15 10
5
(-40C)
(+85C)
2.5 3 3.5 4 4.5 5 5.5 6
0
VDD (Volts)
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 187
PIC16C5X
FIGURE 20-8: VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF I/O PINS vs. VDD
2.00 1.80 1.60 VTH (Volts) 1.40 1.20 1.00 0.80 0.60 2.5 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0
2 Typ (+
5C)
FIGURE 20-9: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) vs. VDD
4.5 4.0 3.5 VIH, VIL (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2.5 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0
Note: These input pins have Schmitt Trigger input buffers.
C) +85 C to (-40 max VIH C +25 typ C) VIH +85 C to (-40 min VIH
C to +85C) VIL max (-40 VIL typ +25C
VIL min (-40C to +8 5C)
FIGURE 20-10: VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP MODES) vs. VDD
3.4 3.2 3.0 2.8 2.6 VTH (Volts) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 2.5 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0
( Typ
C) +25
DS30453B-page 188
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58
FIGURE 20-11: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 20 PF, 25C)
10000
1000
Idd(uA)
5.5V 100 4.5V 3.5V 2.5V
10 100000
1000000 Freq(Hz)
10000000
FIGURE 20-12: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 100 PF, 25C)
10000
1000
Idd(uA)
100
5.5V 4.5V 3.5V 2.5V
10 10000
100000 Freq(Hz)
1000000
10000000
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 189
PIC16C5X
FIGURE 20-13: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 300 PF, 25C)
10000
1000
Idd(uA) 100
5.5V 4.5V 3.5V 2.5V
10 10000
100000 Freq(Hz)
1000000
DS30453B-page 190
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58
FIGURE 20-14: WDT TIMER TIME-OUT PERIOD vs. VDD
50 45 40 35 WDT period (ms) 30
Typ +125C Typ +85C
TABLE 20-2:
INPUT CAPACITANCE FOR PIC16C54s/C56s/C58s
Typical Capacitance (pF)
Pin 18L PDIP RA port RB port MCLR OSC1 OSC2/CLKOUT T0CKI 5.0 5.0 17.0 4.0 4.3 3.2 18L SOIC 4.3 4.3 17.0 3.5 3.5 2.8
25 20
All capacitance values are typical at 25C. A part-to-part variation of 25% (three standard deviations) should be taken into account.
Typ +25C
15
Typ -40C
10 5 2 3 4 5 VDD (Volts) 6 7
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 191
PIC16C5X
FIGURE 20-15: IOH vs. VOH, VDD = 3 V
0
FIGURE 20-17: IOL vs. VOL, VDD = 3 V
45 40
Max -40C
-5
Min +85C
35 30
IOH (mA)
-10
Typ +25C
IOL (mA)
25
Typ +25C
-15
Max -40C
20 15
Min +85C
-20 10 5 0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.0 0.5 1.0 1.5 2.0 VOL (Volts)
-25 VOH (Volts)
2.5
3.0
FIGURE 20-16: IOH vs. VOH, VDD = 5 V
0
FIGURE 20-18: IOL vs. VOL, VDD = 5 V
90 80 70 60
Typ +25C Max -40C
-10
Typ +125C
IOH (mA)
Typ +85C
IOL (mA)
-20
50
Typ +25C Typ -40C
40
Min +85C
-30
30 20
-40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VOH (Volts)
10 0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
DS30453B-page 192
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C54B/C54C/CR54B/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58
NOTES:
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 193
PIC16C5X
NOTES:
DS30453B-page 194
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
21.0 PACKAGING INFORMATION
K04-007 18-Lead Plastic Dual In-line (P) - 300 mil
E
Package Type:
D
2 n E1 A1 A R c A2 B1 eB Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Molded Package Width Radius to Radius Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter.
1
L
B
p
MIN n p B B1 R c A A1 A2 L D E E1 eB
INCHES* NOM 0.300 18 0.100 0.013 0.018 0.055 0.060 0.000 0.005 0.005 0.010 0.110 0.155 0.075 0.095 0.000 0.020 0.125 0.130 0.890 0.895 0.245 0.255 0.230 0.250 0.310 0.349 5 10 5 10
MAX
MIN
0.023 0.065 0.010 0.015 0.155 0.115 0.020 0.135 0.900 0.265 0.270 0.387 15 15
MILLIMETERS NOM MAX 7.62 18 2.54 0.33 0.46 0.58 1.40 1.52 1.65 0.00 0.13 0.25 0.13 0.25 0.38 2.79 3.94 3.94 1.91 2.41 2.92 0.00 0.51 0.51 3.18 3.30 3.43 22.61 22.73 22.86 6.22 6.48 6.73 5.84 6.35 6.86 7.87 8.85 9.83 5 10 15 5 10 15
Dimension "B1" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B1." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 195
PIC16C5X
Package Type: K04-070 28-Lead Skinny Plastic Dual In-line (SP) - 300 mil
E
D
2 n E1 A R eB Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Molded Package Width Radius to Radius Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter.
1
A1
c A2 B1 B INCHES* NOM 0.300 28 0.100 0.016 0.019 0.040 0.053 0.000 0.005 0.008 0.010 0.140 0.150 0.070 0.090 0.015 0.020 0.125 0.130 1.345 1.365 0.280 0.288 0.270 0.283 0.320 0.350 5 10 5 10 p
L
MIN n p B B1 R c A A1 A2 L D E E1 eB
MAX
MIN
0.022 0.065 0.010 0.012 0.160 0.110 0.025 0.135 1.385 0.295 0.295 0.380 15 15
MILLIMETERS MAX NOM 7.62 28 2.54 0.56 0.41 0.48 1.65 1.02 1.33 0.00 0.25 0.13 0.20 0.30 0.25 3.56 4.06 3.81 1.78 2.79 2.29 0.38 0.64 0.51 3.18 3.43 3.30 34.16 35.18 34.67 7.11 7.30 7.49 6.86 7.18 7.49 8.13 9.65 8.89 5 10 15 5 10 15
Dimension "B1" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B1." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
DS30453B-page 196
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
Package Type: K04-079 28-Lead Plastic Dual In-line (P) - 600 mil
E
D
2 n E1 A R eB Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Molded Package Width Radius to Radius Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter.
1
A1 L
c A2 INCHES* NOM 0.600 28 0.100 0.014 0.016 0.040 0.050 0.000 0.005 0.008 0.012 0.160 0.173 0.081 0.101 0.015 0.023 0.115 0.125 1.380 1.395 0.505 0.550 0.567 0.577 0.640 0.660 5 10 5 10 B1 B p
MIN n p B B1 R c A A1 A2 L D E E1 eB
MAX
MIN
0.018 0.060 0.010 0.015 0.185 0.121 0.030 0.135 1.465 0.555 0.587 0.680 15 15
MILLIMETERS NOM MAX 15.24 28 2.54 0.36 0.41 0.46 1.02 1.27 1.52 0.13 0.00 0.25 0.20 0.29 0.38 4.06 4.38 4.70 2.04 2.55 3.06 0.38 0.57 0.76 3.18 2.92 3.43 35.05 35.43 37.20 12.80 13.97 14.10 14.40 14.66 14.91 16.26 16.76 17.27 5 10 15 5 10 15
Dimension "B1" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B1." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 197
PIC16C5X
Package Type: K04-051 18-Lead Plastic Small Outline (SO) - Wide, 300 mil
E1 p E
D
2 B n X 45 1
L R2
c A R1 Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Chamfer Distance Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom
*
A1
L1
A2 MILLIMETERS NOM MAX 1.27 18 2.64 2.36 2.50 1.73 1.22 1.47 0.28 0.10 0.19 11.73 11.43 11.58 7.59 7.42 7.51 10.64 10.01 10.33 0.74 0.25 0.50 0.25 0.13 0.13 0.25 0.13 0.13 0.53 0.28 0.41 4 8 0 0.51 0.25 0.38 0.30 0.23 0.27 0.48 0.36 0.42 0 12 15 0 12 15
MIN p n A A1 A2 D E E1 X R1 R2 L L1 c B
INCHES* NOM 0.050 18 0.093 0.099 0.048 0.058 0.004 0.008 0.450 0.456 0.292 0.296 0.394 0.407 0.010 0.020 0.005 0.005 0.005 0.005 0.016 0.011 0 4 0.015 0.010 0.011 0.009 0.017 0.014 0 12 0 12
MAX
MIN
0.104 0.068 0.011 0.462 0.299 0.419 0.029 0.010 0.010 0.021 8 0.020 0.012 0.019 15 15
Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
DS30453B-page 198
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
Package Type: K04-052 28-Lead Plastic Small Outline (SO) - Wide, 300 mil
E1 E p
D
B n X 45 c A L1 A2 INCHES* NOM 0.050 28 0.099 0.093 0.058 0.048 0.008 0.004 0.706 0.700 0.296 0.292 0.407 0.394 0.020 0.010 0.005 0.005 0.005 0.005 0.016 0.011 0 4 0.015 0.010 0.011 0.009 0.014 0.017 0 12 0 12 MILLIMETERS NOM MAX 1.27 28 2.50 2.64 2.36 1.47 1.73 1.22 0.19 0.28 0.10 18.08 17.93 17.78 7.51 7.59 7.42 10.01 10.33 10.64 0.74 0.50 0.25 0.25 0.13 0.13 0.25 0.13 0.13 0.53 0.28 0.41 8 0 4 0.51 0.25 0.38 0.30 0.23 0.27 0.36 0.42 0.48 0 12 15 0 12 15 A1 L R2 2 1
Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Chamfer Distance Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom
*
R1
MIN p n A A1 A2 D E E1 X R1 R2 L L1 c B
MAX
MIN
0.104 0.068 0.011 0.712 0.299 0.419 0.029 0.010 0.010 0.021 8 0.020 0.012 0.019 15 15
Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 199
PIC16C5X
Package Type: K04-072 20-Lead Plastic Shrink Small Outine (SS) - 5.30 mm
E1 E p
D
B n
2 1 L R2
c
A A1 R1 L1 A2
Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom
*
MIN p n A A1 A2 D E E1 R1 R2 L L1 c B
INCHES NOM 0.026 20 0.073 0.068 0.036 0.026 0.005 0.002 0.283 0.278 0.208 0.205 0.306 0.301 0.005 0.005 0.005 0.005 0.020 0.015 0 4 0.005 0.000 0.007 0.005 0.012 0.010 0 5 0 5
MAX
MIN
0.078 0.046 0.008 0.289 0.212 0.311 0.010 0.010 0.025 8 0.010 0.009 0.015 10 10
MILLIMETERS* NOM MAX 0.65 20 1.73 1.86 1.99 0.66 0.91 1.17 0.05 0.13 0.21 7.07 7.20 7.33 5.20 5.29 5.38 7.65 7.78 7.90 0.13 0.13 0.25 0.13 0.13 0.25 0.38 0.51 0.64 8 0 4 0.00 0.13 0.25 0.13 0.18 0.22 0.25 0.32 0.38 0 5 10 0 5 10
Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
DS30453B-page 200
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
Package Type: K04-073 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm
E1 E p
D
B n 2 1 L c R2 A
A1 R1 L1 A2
Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom
*
MIN p n A A1 A2 D E E1 R1 R2 L L1 c B
INCHES NOM 0.026 28 0.073 0.068 0.036 0.026 0.005 0.002 0.402 0.396 0.208 0.205 0.306 0.301 0.005 0.005 0.005 0.005 0.020 0.015 0 4 0.005 0.000 0.007 0.005 0.010 0.012 0 5 5 0
MAX
MIN
0.078 0.046 0.008 0.407 0.212 0.311 0.010 0.010 0.025 8 0.010 0.009 0.015 10 10
MILLIMETERS* NOM MAX 0.65 28 1.99 1.73 1.86 1.17 0.66 0.91 0.21 0.05 0.13 10.33 10.07 10.20 5.38 5.20 5.29 7.90 7.65 7.78 0.25 0.13 0.13 0.25 0.13 0.13 0.64 0.38 0.51 0 4 8 0.25 0.00 0.13 0.22 0.13 0.18 0.38 0.25 0.32 10 5 0 10 0 5
Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 201
PIC16C5X
Package Type: K04-010 18-Lead Ceramic Dual In-line with Window (JW) - 300 mil
E
W2
D
2 n W1 E1 1
A R eB
A1 L
c A2 B1 B p
Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Package Width Radius to Radius Width Overall Row Spacing Window Width Window Length * Controlling Parameter.
MIN n p B B1 R c A A1 A2 L D E E1 eB W1 W2
0.098 0.016 0.050 0.010 0.008 0.175 0.091 0.015 0.125 0.880 0.285 0.255 0.345 0.130 0.190
INCHES* NOM 0.300 18 0.100 0.019 0.055 0.013 0.010 0.183 0.111 0.023 0.138 0.900 0.298 0.270 0.385 0.140 0.200
MAX
MIN
0.102 0.021 0.060 0.015 0.012 0.190 0.131 0.030 0.150 0.920 0.310 0.285 0.425 0.150 0.210
MILLIMETERS MAX NOM 7.62 18 2.59 2.49 2.54 0.53 0.41 0.47 1.52 1.27 1.40 0.38 0.25 0.32 0.30 0.20 0.25 4.83 4.45 4.64 3.33 2.31 2.82 0.76 0.57 0.00 3.81 3.18 3.49 23.37 22.35 22.86 7.87 7.24 7.56 7.24 6.86 6.48 9.78 10.80 8.76 0.15 0.14 0.13 0.2 0.21 0.19
DS30453B-page 202
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
Package Type: K04-013 28-Lead Ceramic Dual In-line with Window (JW) - 600 mil
E
W
D
2 n 1
E1 A R eB c A2 B1 B INCHES* NOM 0.600 28 0.100 0.019 0.058 0.005 0.010 0.185 0.128 0.038 0.138 1.460 0.520 0.580 0.660 0.280 p A1 L
Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Package Width Radius to Radius Width Overall Row Spacing Window Diameter * Controlling Parameter.
MIN n p B B1 R c A A1 A2 L D E E1 eB W
MAX
MIN
0.098 0.016 0.050 0.000 0.008 0.170 0.110 0.015 0.125 1.430 0.514 0.560 0.610 0.270
0.102 0.021 0.065 0.010 0.012 0.200 0.146 0.060 0.150 1.490 0.526 0.600 0.710 0.290
MILLIMETERS MAX NOM 15.24 28 2.49 2.54 2.59 0.47 0.41 0.53 1.46 1.27 1.65 0.13 0.00 0.25 0.25 0.30 0.20 4.70 5.08 4.32 3.24 3.70 2.78 0.95 1.52 0.00 3.81 3.49 3.18 37.85 36.32 37.08 13.36 13.21 13.06 14.73 15.24 14.22 16.76 18.03 15.49 7.11 7.37 6.86
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 203
PIC16C5X
21.1 Package Marking Information
18-Lead PDIP MMMMMMMMMMMMMMMMM MMMMMMMMMMMMMMMMM AABBCDE
Example PIC16C56RCI/P456 9823 CBA
28-Lead Skinny PDIP (.300") MMMMMMMMMMMMMMMMM MMMMMMMMMMMMMMMMM AABBCDE
Example PIC16C55RCI/P456 9823 CBA
28-Lead PDIP (.600") MMMMMMMMMMMMMMM MMMMMMMMMMMMMMM MMMMMMMMMMMMMMM AABBCDE
Example PIC16C55XTI/P126 9842 CDA
18-Lead SOIC MMMMMMMMMMMM MMMMMMMMMMMM MMMMMMMMMMMM AABBCDE
Example PIC16C54XTI/S0218 9818 CDK
28-Lead SOIC MMMMMMMMMMMMMMMMMMMM MMMMMMMMMMMMMMMMMMMM AABBCDE
Example PIC16C57XT/SO 9815 CBK
20-Lead SSOP MMMMMMMMMMM MMMMMMMMMMM AABBCDE
Example PIC16C54 XTI/218 9820 CBP
28-Lead SSOP MMMMMMMMMMMM MMMMMMMMMMMM AABBCDE
Example PIC16C57XT/SS123 9825 CBK
DS30453B-page 204
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
18-Lead CERDIP Windowed MMMMMMMM MMMMMMMM AABBCDE
Example PIC16C54 /JW 9801 CBA
28-Lead CERDIP Skinny Windowed MMMMMMMMMMMMMM MMMMMMMMMMMMMM AABBCDE
Example PIC16C57 /JW 9838 CCT
28-Lead CERDIP Windowed MMMMMMMMMMM MMMMMMMMMMM AABBCDE
Example PIC16C57 /JW 9838 CBA
Legend: MM...M XX...X AA BB C
D E Note:
Microchip part number information Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Facility code of the plant at which wafer is manufactured O = Outside Vendor C = 5" Line S = 6" Line H = 8" Line Mask revision number Assembly code of the plant or country of origin in which part was assembled
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 205
PIC16C5X
NOTES:
DS30453B-page 206
Preliminary
(c) 1998 Microchip Technology Inc.
PIC16C5X
APPENDIX A: COMPATIBILITY
To convert code written for PIC16CXX to PIC16C5X, the user should take the following steps: 1. Check any CALL, GOTO or instructions that modify the PC to determine if any program memory page select operations (PA2, PA1, PA0 bits) need to be made. Revisit any computed jump operations (write to PC or add to PC, etc.) to make sure page bits are set properly under the new scheme. Eliminate any special function register page switching. Redefine data variables to reallocate them. Verify all writes to STATUS, OPTION, and FSR registers since these have changed. Change reset vector to proper value for processor used. Remove any use of the ADDLW and SUBLW instructions. Rewrite any code segments that use interrupts.
2.
3.
4. 5. 6. 7.
(c) 1998 Microchip Technology Inc.
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NOTES:
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(c) 1998 Microchip Technology Inc.
PIC16C5X
INDEX A
Absolute Maximum Ratings ................................... 59, 67, 89 .......................................................... 103, 117, 131, 145, 171 ALU ...................................................................................... 9 Applications .......................................................................... 5 Architectural Overview ......................................................... 9 Assembler MPASM Assembler .................................................... 56 I/O Programming Considerations ...................................... 26 ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ........... 55 ID Locations ................................................................. 31, 42 INDF .................................................................................. 36 INDF Register .................................................................... 24 Indirect Data Addressing ................................................... 24 Instruction Cycle ................................................................ 13 Instruction Flow/Pipelining ................................................. 13 Instruction Set Summary ................................................... 43
K
KeeLoq(R) Evaluation and Programming Tools .................. 57
B
Block Diagram On-Chip Reset Circuit ................................................ 36 PIC16C5X Series ....................................................... 10 Timer0 ........................................................................ 27 TMR0/WDT Prescaler ................................................ 30 Watchdog Timer ......................................................... 40 Brown-Out Protection Circuit ............................................. 41
L
Loading of PC .............................................................. 22, 23
M
MCLR ................................................................................ 36 Memory Map ...................................................................... 15 PIC16C52 .................................................................. 15 PIC16C54s/CR54s/C55s ........................................... 15 PIC16C56s/CR56s .................................................... 15 PIC16C57s/CR57s/C58s ........................................... 16 Memory Organization ........................................................ 15 Data Memory ............................................................. 17 Program Memory ....................................................... 15 MP-DriveWayTM - Application Code Generator ................. 57 MPLAB C ........................................................................... 57 MPLAB Integrated Development Environment Software ............................................................................ 56
C
Carry bit ............................................................................... 9 Clocking Scheme ............................................................... 13 Code Protection ........................................................... 31, 42 Configuration Bits ............................................................... 31 Configuration Word ............................................................ 31 PIC16C52/C54/C54A/C55/C56/C57/C58A ................ 32 PIC16CR54A/C54B/CR54B/C56A/CR56A/ CR57B/C58B/CR58A/CR58B .................................... 31
D
DC and AC Characteristics - PIC16C54/55/56/57 ............. 81 DC and AC Characteristics PIC16C54A/CR57B/C58A/CR58A ................................... 159 DC and AC Characteristics PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B ............ 183 DC Characteristics ......................... 60, 61, 69, 70, 71, 72, 73 .................................................... 91, 105, 119, 133, 147, 173 Development Support ........................................................ 55 Development Tools ............................................................ 55 Device Varieties ................................................................... 7 Digit Carry bit ....................................................................... 9
O
One-Time-Programmable (OTP) Devices ............................7 OPTION ............................................................................. 36 OPTION Register .............................................................. 21 OSC selection .................................................................... 31 Oscillator Configurations ................................................... 33 Oscillator Types HS .............................................................................. 33 LP .............................................................................. 33 RC ............................................................................. 33 XT .............................................................................. 33
E
Electrical Characteristics PIC16C52 .................................................................. 59 PIC16C54/55/56/57 ................................................... 67 PIC16C54A .............................................................. 103 PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B .... 171 PIC16C58A .............................................................. 131 PIC16CR54A ............................................................. 89 PIC16CR57B ........................................................... 117 PIC16CR58A ........................................................... 145 Errata ................................................................................... 4 External Power-On Reset Circuit ....................................... 37
P
Package Marking Information .......................................... 204 Packaging Information ..................................................... 195 PC ...................................................................................... 22 PCL .................................................................................... 36 PIC16C54/55/56/57 Product Identification System ......... 214 PIC16C5X Product Identification System ........................ 213 PICDEM-1 Low-Cost PICmicro Demo Board .................... 56 PICDEM-2 Low-Cost PIC16CXX Demo Board .................. 56 PICDEM-3 Low-Cost PIC16CXXX Demo Board ............... 56 PICMASTER(R) In-Circuit Emulator .................................... 55 PICSTART(R) Plus Entry Level Development System ........ 55 Pin Configurations ................................................................2 Pinout Description - PIC16C52s, PIC16C54s, PIC16CR54s, PIC16C56s, PIC16CR56s, PIC16C58s, PIC16CR58s ................................................. 11 Pinout Description - PIC16C55s, PIC16C57s, PIC16CR57s ...................................................................... 12 POR Device Reset Timer (DRT) .................................. 31, 39 PD ........................................................................ 35, 41 Power-On Reset (POR) ................................. 31, 36, 37 TO ........................................................................ 35, 41 PORTA ........................................................................ 25, 36
F
Family of Devices PIC16C5X .................................................................... 6 Features ............................................................................... 1 FSR .................................................................................... 36 FSR Register ..................................................................... 24 Fuzzy Logic Dev. System (fuzzyTECH(R)-MP) ................... 57
I
I/O Interfacing .................................................................... 25 I/O Ports ............................................................................. 25
(c) 1998 Microchip Technology Inc.
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PIC16C5X
PORTB ......................................................................... 25, 36 PORTC ......................................................................... 25, 36 Power-Down Mode (SLEEP) .............................................. 42 Prescaler ............................................................................ 30 PRO MATE(R) II Universal Programmer .............................. 55 Program Counter ................................................................ 22
Q
Q cycles ............................................................................. 13 Quick-Turnaround-Production (QTP) Devices ..................... 7
R
RC Oscillator ...................................................................... 34 Read Only Memory (ROM) Devices ..................................... 7 Read-Modify-Write ............................................................. 26 Register File Map PIC16C52, PIC16C54s, PIC16CR54s, PIC16C55s, PIC16C56s, PIC16CR56s ..................... 17 PIC16C57s/CR57s ..................................................... 18 PIC16C58s/CR58s ..................................................... 18 Registers Special Function ........................................................ 19 Reset ............................................................................ 31, 35 Reset on Brown-Out ........................................................... 41
S
SEEVAL(R) Evaluation and Programming System .............. 57 Serialized Quick-Turnaround-Production (SQTP) Devices ................................................................... 7 SLEEP .......................................................................... 31, 42 Software Simulator (MPLAB-SIM) ...................................... 57 Special Features of the CPU .............................................. 31 Special Function Registers ................................................ 19 Stack .................................................................................. 23 STATUS ............................................................................. 36 STATUS Register ........................................................... 9, 20
T
Timer0 Switching Prescaler Assignment ................................ 30 Timer0 (TMR0) Module .............................................. 27 TMR0 with External Clock .......................................... 29 Timing Diagrams and Specifications ...................... 63, 75, 97 .......................................................... 111, 125, 139, 153, 178 Timing Parameter Symbology and Load Conditions ............. 62, 74, 96, 110, 124, 138, 152, 177 TMR0 ................................................................................. 36 TRIS ................................................................................... 36 TRIS Registers ................................................................... 25
U
UV Erasable Devices ........................................................... 7
W
W ........................................................................................ 36 Wake-up from SLEEP ........................................................ 42 Watchdog Timer (WDT) ............................................... 31, 39 Period ......................................................................... 39 Programming Considerations .................................... 39 WWW, On-Line Support ....................................................... 4
Z
Zero bit ................................................................................. 9
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(c) 1998 Microchip Technology Inc.
PIC16C5X
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site.
Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-602-786-7302 for the rest of the world.
980106
Connecting to the Microchip Internet Web Site
The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.futureone.com/pub/microchip The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events
Trademarks: The Microchip name, logo, PIC, PICSTART, PICMASTER and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. PICmicro, FlexROM, MPLAB and fuzzyLAB are trademarks and SQTP is a service mark of Microchip in the U.S.A. All other trademarks mentioned herein are the property of their respective companies.
(c) 1998 Microchip Technology Inc.
DS30453B-page 211
PIC16C5X
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: RE: Technical Publications Manager Reader Response Total Pages Sent
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: PIC16C5X Questions: 1. What are the best features of this document? Y N Literature Number: DS30453B FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?
DS30453B-page 212
(c) 1998 Microchip Technology Inc.
PIC16C5X
PIC16C5X PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device -XX X /XX Package XXX Pattern Examples: a) PIC16C54A -04/P 301 = Commercial temp., PDIP package, 4MHz, normal VDD limitis, QTP pattern #301. PIC16LC58A - 04I/SO = Industrial temp., SOIC package, 4MHz, Extended VDD limits. PIC16CR54A - 10I/P355 = ROM program memory, Industrial temp., PDIP package, 10MHz, normal VDD limits.
Frequency Temperature Range Range
Device
PIC16C5X(2), PIC16C5XT(3) PIC16LC5X(2), PIC16LC5XT(3) PIC16CR5X(2), PIC16CR5XT(3) PIC16LCR5X(2), PIC16LCR5XT(3) PIC16LV5X(2), PIC16LV5XT(3) 02 04 10 20 b(1) b(1) I E JW P SO SP SS = 2 MHz = 4 MHz = 10 MHz = 20 MHz = No type for JW(4) devices = 0C to +70C = -40C to +85C = -40C to +125C (Commercial) (Industrial) (Automotive)
b)
c)
Frequency Range
Temperature Range Package
= Windowed CERDIP = PDIP = SOIC (Gull Wing, 300 mil body) = Skinny PDIP (28-pin, 300 mil body) = SSOP (209 mil body)
Pattern
3-digit Pattern Code for QTP, ROM (blank otherwise)
Note 1: b = blank 2: C = Standard VDD range LC = Extended VDD range CR = ROM Version, Standard VDD range LCR = ROM Version, Extended VDD range LV = Low Voltage VDD range 3: T = in tape and reel - SOIC, SSOP packages only. 4: UV erasable devices are tested to all available voltage/frequency options. Erased devices are oscillator type 04. The user can select 04, 10 or 20 oscillators by programmng the appropriate configuration bits.
(c) 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 213
PIC16C5X
PIC16C54/55/56/57 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information (e.g., on pricing or delivery) refer to the factory or the listed sales office. PART NO. Device -XX Oscillator Type X Temperature Range /XX Package XXX Pattern Examples: a) b) c) d) PIC16C54 - XT/PXXX = "XT" oscillator, commercial temp., PDIP, QTP pattern. PIC16C55 - XTI/SO = "XT" oscillator, industrial temp., SOIC (OTP device) PIC16C55 /JW = Commercial temp. CERDIP with window. PIC16C57 - RC/S = "RC" oscillator, commercial temp., dice in waffle pack.
Device
PIC16C54, PIC16C54T(2) PIC16C55, PIC16C55T(2) PIC16C56, PIC16C56T(2) PIC16C57, PIC16C57T(2) RC LP XT HS 10 b(1) b(1) I E JW P S SO SP SS = Resistor Capacitor = Low Power Crystal = Standard Crystal/Resonator = High Speed Crystal = 10 MHz Crystal = No type for JW(3) devices = 0C to +70C (Commercial) = -40C to +85C (Industrial) = -40C to +125C (Automotive) = Windowed CERDIP = PDIP = Die in Waffle Pack = SOIC (Gull Wing, 300 mil body) = Skinny PDIP (28 pin, 300 mil body) = SSOP (209 mil body)
Oscillator Type
Temperature Range Package
Note 1: b = blank 2: T = in tape and reel - SOIC, SSOP packages only. 3: UV erasable devices are tested to all available voltage/frequency options. Erased devices are oscillator type RC. The user can select RC, LP, XT or HS oscillators by programming the appropriate configuration bits.
Pattern
3-digit Pattern Code for QTP (blank otherwise)
Sales and Support
Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office (see below) 2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277 Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302.
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(c) 1998 Microchip Technology Inc.
PIC16C5X
NOTES:
(c) 1998 Microchip Technology Inc.
Preliminary
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DS30453B-page 216
(c) 1998 Microchip Technology Inc.
M
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com
AMERICAS (continued)
Toronto
Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253
ASIA/PACIFIC (continued)
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850
ASIA/PACIFIC
Hong Kong
Microchip Asia Pacific RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431
Taiwan, R.O.C
Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Atlanta
Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307
Boston
Microchip Technology Inc. 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508-480-9990 Fax: 508-480-8575
EUROPE
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-1189-21-5858 Fax: 44-1189-21-5835
India
Microchip Technology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062
Chicago
Microchip Technology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
Japan
Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
France
Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Dallas
Microchip Technology Inc. 14651 Dallas Parkway, Suite 816 Dallas, TX 75240-8809 Tel: 972-991-7177 Fax: 972-991-8588
Dayton
Microchip Technology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934
Germany
Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Muchen, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Detroit
Microchip Technology Inc. 42705 Grand River, Suite 201 Novi, MI 48375-1727 Tel: 248-374-1888 Fax: 248-374-2874
Italy
Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-39-6899939 Fax: 39-39-6899883 7/7/98
Shanghai
Microchip Technology RM 406 Shanghai Golden Bridge Bldg. 2077 Yan'an Road West, Hong Qiao District Shanghai, PRC 200335 Tel: 86-21-6275-5700 Fax: 86 21-6275-5060
Los Angeles
Microchip Technology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 714-263-1888 Fax: 714-263-1338
New York
Microchip Technology Inc. 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 516-273-5305 Fax: 516-273-5335
San Jose
Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
Microchip received ISO 9001 Quality System certification for its worldwide headquarters, design, and wafer fabrication facilities in January, 1997. Our field-programmable PICmicroTM 8-bit MCUs, Serial EEPROMs, related specialty memory products and development systems conform to the stringent quality standards of the International Standard Organization (ISO).
All rights reserved. (c) 1998, Microchip Technology Incorporated, USA. 8/98
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
DS30453B-page 216
(c) 1998 Microchip Technology Inc.

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